Abstract: A method of manufacturing a multi-substrate semiconductor package. The method includes providing a first substrate with a plurality of first dies present thereon and forming a plurality of electrical contacts on an upper surface of a lateral extension portion of at least one of the plurality of first dies on the first substrate. The method also includes providing a second substrate, the second substrate comprising a plurality of second dies, at least one of the plurality of second dies comprising an interconnect region. Further, the method includes forming a sandwich structure by bonding the second substrate to an upper surface of the first substrate to form an intermediate level within the sandwich structure and separating the dies. The method also includes coupling an electrically conductive structure through the interconnect region of the one second dies to the lateral extension portion of the one first die.

Abstract: A system for wafer-level packaging of a plurality of MEMS devices includes a substrate having a plurality of individual chips. Each of the plurality of individual chips includes a plurality of MEMS devices and each of the plurality of individual chips is arranged in a spatial manner as a first array configuration. The system also includes a transparent member of a predetermined thickness. The transparent member includes a transparent substrate of a first thickness having a bonding surface joined to a bonding surface of a standoff substrate of a second thickness. The standoff substrate defines a plurality of recessed regions arranged in a spatial manner as a second array configuration. The system further includes a sealed interface between the standoff substrate and the substrate. The sealed interface is adapted to enclose each of the plurality of individual chips within one of the plurality of recessed regions.

Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: A method for bonding substrate structures. The method includes providing a transparent substrate structure, the transparent substrate structure comprising a face region and an incident light region, providing a spacer structure, the spacer structure comprising a selected thickness of material, the spacer structure having a spacer face region and a spacer device region, and providing a device substrate structure, the device substrate having a device face region and a device backside region. The method further includes applying a first glue material to the spacer face region and bonding the spacer face region to the face region of the transparent substrate structure. The method also includes applying a second glue material to the spacer device region and bonding the spacer device region to the device face region.

Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: A method of fabricating a spatial light modulator. The method includes forming cavities in a first substrate and fabricating electrodes on a second substrate. The method also includes bonding the first substrate to the second substrate and forming a mirror plate from a portion of the first substrate. The mirror plate has an upper surface and a lower surface. The method further includes forming a hinge coupled to the mirror plate and forming a reflective surface coupled to the upper surface of the mirror plate.

Abstract: A method of fabricating a spatial light modulator. The method includes providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface. The method also includes forming a standoff structure from the first substrate, the standoff structure having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface. The standoff structure includes a centrally located base section extending from the integrated surface to the bonding surface along a first axis and a plurality of lateral extension arms extending from the base section along a second axis orthogonal to the first axis. The method further includes providing a second substrate having a bonding surface and a support surface, joining the bonding surface of the standoff structure to the bonding surface of the second substrate, and releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer.

Abstract: An electro-mechanical system comprising a substrate including a surface region and a flexible member coupled at a first end to the surface region. The system further comprises a base region and a tip region. The system also comprises a reflective member coupled to the flexible member, including a reflective surface and a backside region, the backside region being coupled to the second end of the flexible member, the reflective surface being substantially parallel to the surface region while the reflective member is in a first state and being substantially non-parallel to the surface region while the reflective member is in a second state. The flexible member moves from a first position characterized by the first state to a second position characterized by the second state and the angle between the first state and the second state is greater than 12°.

Abstract: A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.

Abstract: A method of enhancing the gray scale resolution of a PWM system. The method includes defining an N-bit PWM sequence with a length of 2N?1 units. The N-bit PWM sequence includes a least significant bit (LSB) segment characterized by a temporal length of one unit. In some embodiments, the temporal length of one unit is referred to as a time t0. The method also includes defining a fractional PWM sequence. The fractional PWM sequence includes the N-bit PWM sequence and a fractional bit segment of temporal length F. The temporal length of the fractional PWM sequence is 2N?1+F units. In a particular embodiment, F=1 and the temporal length of the fractional PWM sequence is 2N.

Abstract: A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface and processing a device substrate to form at least an electrode layer. The method also includes depositing a first portion of a multi-layer standoff layer on the electrode layer, depositing a second portion of the multi-layer standoff layer on the first portion of the multi-layer standoff layer, and forming electrically insulating standoff structures from the multi-layer standoff layer. The method further includes joining the bonding surface of the first substrate to the standoff structures on the device substrate, thinning the first substrate, patterning the first substrate to form a mask, and forming a plurality of moveable structures from the first substrate. The moveable structures are aligned with at least one of the plurality of electrodes and adapted to rotate with respect to the standoff structures.

Abstract: A memory cell for driving a complementary pair of electrodes associated with a micro-mirror of a spatial light modulator. The memory cell includes a first PMOS transistor, wherein a source of the first PMOS transistor is coupled to a first supply voltage. The memory cell also includes a first NMOS transistor, wherein a drain of the first NMOS transistor is coupled to a drain of the first PMOS transistor, a source of the first NMOS transistor is coupled to a second supply voltage, and a gate of the first NMOS transistor is coupled to a gate of the first PMOS transistor. The memory cell further includes a second transistor adapted to establish a conduction path between the gate of the first NMOS transistor and at least one of the first supply voltage or the second supply voltage. Moreover, the memory includes a select transistor, wherein a drain of the select transistor is coupled to the gate of the first NMOS transistor and wherein the memory cell is free from a connection to a fifth transistor.

Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.

Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 ° C. to maintain a state of the planarizing material.

Abstract: A high fill factor spatial light modulator. The spatial light modulator includes a device layer coupled to a support base. The device layer includes a mirror plate and a coplanar flexible member. The spatial light modulator also includes a patterned spacer layer coupled to the mirror plate. In some embodiments, the spacer layer is fabricated from an aluminum layer. The method further includes a reflective layer coupled to the spacer layer.

Abstract: A method of fabricating a spatial light modulator. The method includes providing a first substrate including a first bonding surface, forming a first layer coupled to the bonding surface, wherein the first layer is characterized by a first set of material parameters, and forming a second layer coupled to the first layer, wherein the second layer is characterized by a second set of material parameters. The method also includes patterning the first layer and the second layer to form a plurality of landing structures extending to a first distance from the bonding surface of the first substrate. The method further includes providing a second substrate including a second bonding surface, joining the first bonding surface of the first substrate to the second bonding surface of the second substrate, and forming a plurality of moveable mirrors from the second substrate. During operation, the moveable mirrors make contact with the second layer.

Abstract: A spatial light modulator for use in projection display applications is provided. The spatial light modulator includes a substrate including a plurality of electrically active circuits and an electrode layer electrically coupled to at least one of the plurality of electrically active circuits. In one embodiment, the electrode layer includes a semi-continuous layer with at least one optical path. The spatial light modulator also includes a shielding layer electrically isolated from the electrode layer and disposed between the substrate and the plurality of electrically active circuits and an electrical connector coupling the shielding layer to a reference potential. In a specific embodiment, the shielding layer of the spatial light modulator converts incident light energy to electrical current and routes the current back to a source. In another specific embodiment, the shielding layer converts electrical field disturbance to electrical current and routes the current back to a source.

Abstract: A method of fabricating a spatial light modulator. The method includes providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface. The method also includes forming a standoff structure from the first substrate, the standoff structure having an integrated surface coupled to the lower surface of the mirror layer and a bonding surface opposite the integrated surface. The standoff structure includes a centrally located base section extending from the integrated surface to the bonding surface along a first axis and a plurality of lateral extension arms extending from the base section along a second axis orthogonal to the first axis. The method further includes providing a second substrate having a bonding surface and a support surface, joining the bonding surface of the standoff structure to the bonding surface of the second substrate, and releasing a portion of the first substrate to form a torsion spring hinge coplanar with the mirror layer.

Abstract: A method of fabricating an electrical connection for a spatial light modulator includes providing a first substrate including a plurality of bias electrodes and a plurality of dielectric bond pads. The method also includes providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, and joining the dielectric bond pads of the first substrate to the standoff region of the second substrate. The method further includes forming mirror structures from a first portion of the second substrate, exposing a portion of the upper surface of the plurality of bias electrodes, and depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes.