Abstract: A micro-mirror array fabricated on one substrate is bonded to a second substrate that includes addressing electrodes and control circuitry. In one embodiment, the micro mirror array is fabricated from a substrate that is a single crystal material. There is enough area beneath the micro mirror array for electrodes and control circuitry, including memory buffers and a pulse width modulation array to be fabricated on the second substrate.

Abstract: A method for forming a standoff structure for devices, e.g., optical devices, integrated circuit devices, micro-electrical mechanical systems (i.e., MEMS). The method includes providing a substrate (e.g., silicon wafer), which has a first surface region characterized by a <100> crystal orientation, a second surface region, and a thickness defined between the first surface region and the second surface region. The method includes protecting selected portions of the first surface region using a masking layer while leaving a plurality of unprotected regions. Each of the unprotected regions is to be associated with an opening through the thickness of the substrate. The method includes immersing the substrate into an etching solution. The method also includes causing removal of the plurality of unprotected regions to form a plurality of openings through the entirety of the thickness of the substrate using the etching solution.

Abstract: A spatial light modulator is provided. The spatial light modulator includes a first substrate, the first substrate comprising a plurality of electrodes adapted to receive control signals, and a bias grid coupled to the first substrate and electrically isolated from the plurality of electrodes. The spatial light modulator also includes a mirror plate electrically coupled to the bias grid and adapted to rotate from a first orientation to a second orientation in response to the control signals received by the plurality of electrodes. The spatial light modulator further includes a landing post support structure coupled to the first substrate and electrically coupled to the bias grid and a landing post coupled to the landing post support structure. The landing post is electrically coupled to the bias grid and adapted to make contact with the mirror plate positioned at the first orientation.

Abstract: A method of fabricating an electrical connection for a spatial light modulator includes providing a first substrate including a plurality of bias electrodes and a plurality of dielectric bond pads. The method also includes providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, and joining the dielectric bond pads of the first substrate to the standoff region of the second substrate. The method further includes forming mirror structures from a first portion of the second substrate, exposing a portion of the upper surface of the plurality of bias electrodes, and depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes.

Abstract: A method of fabricating an integrated spatial light modulator. The method includes providing a first substrate including a bonding surface, processing a device substrate to form at least an electrode layer, the electrode layer including a plurality of electrodes, and depositing a standoff layer on the electrode layer. The method further includes forming standoff structures from the standoff layer and joining the bonding surface of the first substrate to the standoff structures on the device substrate. In a particular embodiment, the method further includes, after the step of depositing a standoff layer, performing chemical mechanical polishing of the standoff layer to planarize an upper surface of the standoff layer.

Abstract: A method for forming a composite substrate structure. The method includes providing a first substrate, the first substrate having a surface region and a backside region, providing a handling substrate, the handling substrate having a bonding surface and a handling surface, and activating at least one of the surface region of the first substrate and the bonding surface of the handling substrate using a surface activation process. The method also includes thereafter contacting the surface region of the first substrate to the bonding surface of the handling substrate to form a composite substrate structure, and thereafter applying a voltage to the backside region and the handling surface of the composite substrate structure. In one embodiment, the step of activating at least one of the surface region of the first substrate and the bonding surface of the handling substrate is performed in a plasma activation chamber.

Abstract: An electro-mechanical system comprising a substrate including a surface region and a flexible member coupled at a first end to the surface region. The system further comprises a base region within a first portion of the flexible member and a tip region within a second portion of the flexible member. The system also comprises a reflective member coupled to the flexible member, including a reflective surface and a backside region, the backside region being coupled to the second end of the flexible member, the reflective surface being substantially parallel to the surface region while the reflective member is in a first state and being substantially non-parallel to the surface region while the reflective member is in a second state, whereupon the flexible member moves from a first position characterized by the first state to a second position characterized by the second state.

Abstract: Fabrication of a reflective spatial light modulator including a micro-mirror array. In one embodiment, the micro-mirror array is fabricated from a substrate that is a single crystal material by only two main etching steps. A first etch forms cavities in a first side of the material. A second etch forms support post, a vertical hinge, and a mirror plate. Between the first and second etches, the substrate can be bonded to addressing and control circuitry.

Abstract: A method for forming a patterned silicon bearing material, e.g., silicon substrate. The method includes providing a silicon substrate, which has a surface region and a backside region. The method includes forming a plurality of recessed regions on the surface region. Each of the plurality of recessed regions has a border region. Preferably, the plurality of recessed regions forms a patterned surface region. The method includes bonding (e.g., hermetic bonding or on-hermetic seal) the patterned surface region to a handle surface region of a handle substrate, e.g., glass substrate. Each of the border regions, which protrude outwardly from the recessed regions, is bonded to the handle surface region, while each of the recessed regions remain free from attachment to any surface of the handle surface region. The method includes applying electromagnetic radiation comprising a laser beam to selected regions on the backside to ablate a thickness of silicon substrate overlying each of the recessed regions.

Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member.

Abstract: A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment.

Abstract: Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.

Abstract: Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.

Abstract: Fabrication of a micro mirror array having a hidden hinge that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array is fabricated from a substrate that is a first substrate of a single crystal material. Cavities are formed in a first side of the first substrate. Separately, electrodes and addressing and control circuitry are fabricated on a first side of a second substrate. The first side of the first substrate is bonded to the first side of the second substrate. The sides are aligned so the electrodes on the second substrate are in proper relation with the mirror plates that will be formed on the first substrate and that the electrodes will control.

Abstract: A micro mirror array having a hidden hinge that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a hinge, a mirror plate and a reflective surface on the upper surface of the mirror plate, the reflective surface concealing the hinge and the mirror plate. The micro mirror array fabricated from a single material.

Abstract: An electro-mechanical system, the system comprising a first surface with an electrically activated electrode coupled to the first surface and to an electrical source to receive a first signal. The system further comprising a moveable structure suspended at a first height over the first surface, the moveable structure being attracted toward the electrode based upon the first signal, and the moveable structure being attracted toward the first surface through an interaction with one or more parasitic forces. The systems also provides a landing post coupled to the moveable structure, the landing post being adapted to contact the base of the landing post against the first surface when the electrically activated electrode receives a predetermined voltage bias associated with the first signal, thereby maintaining an outer portion of the moveable structure free from physical contact with the first surface and reducing a magnitude of one or more parasitic forces.

Abstract: Fabrication of a reflective spatial light modulator including a micro-mirror array. In one embodiment, the micro mirror array is fabricated from a substrate that is a single crystal material by only two main etching steps. A first etch forms cavities in a first side of the material. A second etch forms support posts, a vertical hinge, and a mirror plate. Between the first and second etches, the substrate can be bonded to addressing and control circuitry.

Abstract: A method for forming a patterned silicon bearing material, e.g., silicon substrate. The method includes providing a silicon substrate, which has a surface region and a backside region. The method includes forming a plurality of recessed regions on the surface region. Each of the plurality of recessed regions has a border region. Preferably, the plurality of recessed regions forms a patterned surface region. The method includes bonding (e.g., hermetic bonding or on-hermetic seal) the patterned surface region to a handle surface region of a handle substrate, e.g., glass substrate. Each of the border regions, which protrude outwardly from the recessed regions, is bonded to the handle surface region, while each of the recessed regions remain free from attachment to any surface of the handle surface region. The method includes etching selected regions on the backside to remove a thickness of silicon substrate overlying each of the recessed regions.

Abstract: A method for forming a patterned silicon bearing material, e.g., silicon substrate. The method includes providing a silicon substrate, which has a surface region and a backside region. The method includes forming a plurality of recessed regions on the surface region. Each of the plurality of recessed regions has a border region. Preferably, the plurality of recessed regions forms a patterned surface region. The method includes bonding (e.g., hermetic bonding or on-hermetic seal) the patterned surface region to a handle surface region of a handle substrate, e.g., glass substrate. Each of the border regions, which protrude outwardly from the recessed regions, is bonded to the handle surface region, while each of the recessed regions remain free from attachment to any surface of the handle surface region. The method includes applying electromagnetic radiation comprising a laser beam to selected regions on the backside to ablate a thickness of silicon substrate overlying each of the recessed regions.

Abstract: A method for forming a standoff structure for packaging devices, e.g., optical devices, integrated circuit devices. The method includes providing a substrate, e.g., silicon wafer. The substrate includes a first surface region, a second surface region, and a thickness defined between the first surface region and the second surface region. The method includes protecting selected portions of the first surface region using a masking layer while leaving a plurality of unprotected regions. Preferably, each of the unprotected regions is to be associated with an opening through the thickness of the substrate. The method causes removal of the plurality of unprotected regions to form a plurality of openings through the thickness of the substrate to provide a resulting patterned substrate. Each of the openings is bordered by a portion of the selected portions of the first surface region. Preferably, etching techniques, such as wet etch or dry etching, can be used, depending upon the embodiment.