Abstract: A method of manufacturing a multi-substrate semiconductor package. The method includes providing a first substrate with a plurality of first dies present thereon and forming a plurality of electrical contacts on an upper surface of a lateral extension portion of at least one of the plurality of first dies on the first substrate. The method also includes providing a second substrate, the second substrate comprising a plurality of second dies, at least one of the plurality of second dies comprising an interconnect region. Further, the method includes forming a sandwich structure by bonding the second substrate to an upper surface of the first substrate to form an intermediate level within the sandwich structure and separating the dies. The method also includes coupling an electrically conductive structure through the interconnect region of the one second dies to the lateral extension portion of the one first die.

Abstract: A micro-mirror array that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a vertical torsion hinge, and a mirror plate, all being fabricated from a single wafer. The micro-mirror array has a large fill ratio.

Abstract: An electromechanical system comprising a substrate including a surface region and a flexible member coupled at a first end to the surface region. The system further comprises a base region within a first portion of the flexible member and a tip region within a second portion of the flexible member. The system also comprises a reflective member coupled to the flexible member, including a reflective surface and a backside region, the backside region being coupled to the second end of the flexible member, the reflective surface being substantially parallel to the surface region while the reflective member is in a first state and being substantially non-parallel to the surface region while the reflective member is in a second state, whereupon the flexible member moves from a first position characterized by the first state to a second position characterized by the second state.

Abstract: A micro mirror array having a hidden hinge that is useful, for example, in a reflective spatial light modulator. In one embodiment, the micro mirror array includes spacer support walls, a hinge, a mirror plate and a reflective surface on the upper surface of the mirror plate, the reflective surface concealing the hinge and the mirror plate. The micro mirror array fabricated from a single material.

Abstract: A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At least the first substrate or at least the second substrate (or both) has an alignment mark comprising a front-size zero mark within a portion of either the first thickness or the second thickness. The method includes applying a layer of photomasking material overlying a first backside surface of the first substrate. The method includes illuminating electromagnetic radiation using a coherent light source through the layer of photoresist material and through a portion of the first thickness. The method includes detecting an indication of the alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate.

Abstract: A method for bonding substrates together. The method includes providing a first substrate comprising a first surface. The first substrate comprises a plurality of first chips thereon. Each of the chips has integrated circuit devices. The first substrate includes a first alignment mark on the first substrate and a second alignment mark on the first substrate. The method also includes providing a second substrate comprising a silicon bearing material and second surface. The second substrate comprising a plurality of second chips thereon. Each of the chips comprises a plurality of mechanical structures. The second substrate has a first silicon based pattern on the second substrate and a second silicon based pattern on the second substrate. The method includes moving the first alignment mark of the first substrate to the first silicon based pattern on the second substrate and aligning the second alignment mark of the first substrate to the second silicon based pattern on the second substrate.

Abstract: A spatial light modulator for use in projection display applications is provided. The spatial light modulator includes a substrate including a plurality of electrically active circuits and an electrode layer electrically coupled to at least one of the plurality of electrically active circuits. In one embodiment, the electrode layer includes a semi-continuous layer with at least one optical path. The spatial light modulator also includes a shielding layer electrically isolated from the electrode layer and disposed between the substrate and the plurality of electrically active circuits and an electrical connector coupling the shielding layer to a reference potential. In a specific embodiment, the shielding layer of the spatial light modulator converts incident light energy to electrical current and routes the current back to a source. In another specific embodiment, the shielding layer converts electrical field disturbance to electrical current and routes the current back to a source.