Abstract: To provide a method for manufacturing a novel molded article using a commingled yarn and a composite material using a commingled yarn. The method for manufacturing a molded article, includes disposing a commingled yarn containing a continuous reinforcing fiber and a continuous thermoplastic resin fiber on a part of a surface of a prepreg, the prepreg containing continuous reinforcing fibers paralleling at least unidirectionally, and a thermosetting resin impregnated between the continuous reinforcing fibers, and heat-processing the prepreg with the commingled yarn.
Abstract: A resin composition that has excellent flux activity, flexibility and storage stability and that is suitable for a pre-applied underfill material is provided. The resin composition contains a compound (A) having a phenolic hydroxy group, a metal ion trapping agent (B) and a radical polymerizable compound (C).
Abstract: A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1) and a weight average molecular weight of 70000 or less; and a polyfunctional radically polymerizable compound (B) having 4 or more and 100 or less radically polymerizable functional groups.
Abstract: The present application realizes an anti-reflection film or the like that is a layered product having low surface reflectivity, excellent thermoformability, and satisfactory abrasion resistance. This anti-reflection film includes: a base material layer including a thermoplastic resin; and a low-refractive-index layer which is stacked on at least one surface of the base material layer and which has a refractive index that is lower than the refractive index of the base material layer, wherein the low-refractive-index layer includes a polymer of a first resin material including a fluorine-containing urethane acrylate and a (meth)acrylate.
Abstract: Provided are an aqueous composition with which the surface of stainless steel is adequately roughened in an efficient manner with few steps, a method for roughening stainless steel, etc. The problem mentioned above is solved by an aqueous composition for roughening the surface of stainless steel, the aqueous composition including 0.1-20 mass % of hydrogen peroxide with reference to the total amount of the aqueous composition, 0.25-40 mass % of copper ions with reference to the total amount of the aqueous composition, and 1-30 mass % of halide ions with reference to the total amount of the aqueous composition.
Abstract: A polyester resin containing: a diol constituent unit containing a unit a1 derived from spiroglycol represented by formula (1) and a unit a2 derived from ethylene glycol; and a dicarboxylic acid constituent unit containing a unit b derived from terephthalic acid and/or an ester thereof. A content of the unit a1 is from 5 to 60 mol % and a content of the unit a2 is from 30 to 95 mol %, based on a total amount of the unit a1 and the unit a2. A content of the unit b is from 80 to 100 mol % based on a total amount of the dicarboxylic acid constituent unit.
Abstract: The present invention enables provision of a production method for 1,2,3,5,6-pentathiepane, the method comprising, in the following order, step A for reacting a trithiocarbonate, sulfur, and a methane dihalide together using a phase-transfer catalyst in a multilayer system having a water layer and an organic layer, step B for separating the water layer from the organic layer, and step C for stopping the reaction using an acid.
Abstract: A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).
Abstract: Provided is a method for producing a methyl-adduct compound, the method including methylating, in the presence of potassium carbonate and dimethyl carbonate, a dinitrile compound represented by Formula (1) below to obtain a methyl-adduct compound represented by Formula (2) below: where in Formula (2), R1˜R4 each independently represent hydrogen or methyl, and from one to three of R1˜R4 are each methyl.
Abstract: Provided is a multilayer vessel excellent in gas barrier performance and transparency and its application. The multilayer vessel contains a layer (X) that contains at least one type of polyolefin resin as the major ingredient; and a layer (Y) that contains a polyamide resin (A) as the major ingredient, the polyamide resin (A) being composed of a structural unit derived from diamine, and a structural unit derived from dicarboxylic acid, 70 mol % or more of the structural unit derived from diamine being derived from metaxylylenediamine, meanwhile 30 to 60 mol % of the structural unit derived from dicarboxylic acid being derived from straight chain aliphatic ?,?-dicarboxylic acid having 4 to 20 carbon atoms, and 70 to 40 mol % being derived from isophthalic acid.
Abstract: The present invention provides a rubber composition comprising: a guanidine fatty acid salt (A), which is a salt of guanidine and a fatty acid; natural rubber and/or synthetic rubber (B); and an inorganic filler (C).
Type:
Grant
Filed:
July 11, 2019
Date of Patent:
February 20, 2024
Assignee:
Mitsubishi Gas Chemical Company, Inc.
Inventors:
Takuya Kageyama, Maya Okaniwa, Susumu Innan
Abstract: A composition that includes Compound (a) and Compound (b). Compound (a) is represented by formula (1): where: Ar represents an aromatic ring; m represents an integer of 2 to 8; n represents an integer of 0 to 6, provided that m+n is the number of carbon atoms constituting the aromatic ring, or less; and R1 each independently represents an alkylthio group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group. Compound (b) is represented by formula (2): where p represents an integer of 0 to 4, and q represents an integer of 0 to 2.
Abstract: An oxymethylene copolymer resin composition, which includes (i) an oxymethylene copolymer, (ii) a derivative of an aryl boron fluoride compound, and (iii) a layered double hydroxide; and a method for producing the same.
Abstract: Provided are: a laminated resin sheet for molding, which is less likely to cause an abnormal appearance during molding, and has an anti-glare layer but has excellent transparency; and a molded article using the same. This laminated resin sheet for molding comprises: a high-hardness resin layer containing a high-hardness resin; a base material layer which contains a polycarbonate resin (a1) and is disposed on one surface side of the high-hardness resin layer; and a hard coat anti-glare layer disposed on the other surface side of the high-hardness resin layer, wherein the glass transition point (Tg1) of the high-hardness resin and the glass transition point (Tg2) of the polycarbonate resin (a1) satisfy the following relationship, and the maximum valley depth (Rv) of the recesses and protrusions of the hard coat anti-glare layer is at most 0.9 ?m ?10° C.?(Tg1?Tg2)?40° C.
Type:
Grant
Filed:
February 3, 2021
Date of Patent:
February 13, 2024
Assignees:
MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC FILSHEET CO., LTD.
Abstract: An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTi4O9; (B) a filler different from the BaTi4O9 (A); and (C) a thermosetting resin; wherein a median particle size of the BaTi4O9 (A) is 0.10 to 1.00 ?m, and a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9(A):the filler (B), ranges from 15:85 to 80:20.
Type:
Application
Filed:
January 26, 2022
Publication date:
February 8, 2024
Applicant:
MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventors:
Takaaki OGASHIWA, Tetsuro MIYAHIRA, Tatsuro TAKAMURA, Sayaka ITO
Abstract: The problem of the present invention is to provide a roughening treatment method in which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good surface quality of the stainless steel after treatment. The above problem is solved by a roughening treatment method for stainless steel, which comprises a roughening treatment step that uses a first aqueous composition, and a post-treatment step that uses a second aqueous composition. Namely, the roughening treatment step is to roughen the surface of stainless steel containing copper or a metal having an ionization tendency larger than copper by bringing the first aqueous composition into contact with the surface, wherein the first aqueous composition comprises 0.1% to 20% by mass of hydrogen peroxide based on the total amount of the first aqueous composition, 0.
Abstract: A recess etching solution for recess etching a metal wiring in a semiconductor substrate manufacturing process; and a recess etching method employing the same. The recess etching solution is for applying recess etching to a surface of a cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate, and contains (A) an organic acid, one of or both of (B) a nitrogen-containing heterocyclic compound and (C) an organic solvent, and (D) water. The recess etching method includes applying recess etching to a surface of a cobalt-containing metal layer by bringing the recess etching solution into contact with the surface of the cobalt-containing metal layer embedded in a via or a trench formed in a semiconductor substrate.
Abstract: The problem of the present invention is to provide an aqueous composition with which the surface of stainless steel is sufficiently roughened in an efficient manner with few steps, while maintaining good quality (e.g., thickness) of the stainless steel after treatment. The above problem is solved by the following aqueous composition for roughening the surface of stainless steel. Namely, the aqueous composition comprises 0.1% to 10% by mass of hydrogen peroxide based on the total amount of the aqueous composition, 1% to 30% by mass of halide ions based on the total amount of the aqueous composition, and 0% to 3% by mass of copper ions based on the total amount of the aqueous composition.
Abstract: An objective of the present invention is to provide an anti-reflection film laminate which is for manufacturing an anti-reflection film having low surface reflectance and good anti-reflection properties, as well as excellent thermoformability and scratch resistance. The aforementioned problem is resolved by the following anti-reflection film laminate. This anti-reflection film laminate comprises: a first laminate having a base film that has a release surface, and an optical interference layer laminated on the release surface; and a second laminate having a substrate layer that contains a thermoplastic resin, and an uncured hardcoat layer that is laminated on one surface of the substrate layer and comprises a curable hardcoat composition. The first and second laminate bodies are pressure bonded such that the optical interference layer of the first laminate and the uncured hardcoat layer of the second laminate are in contact with each other.
Abstract: It is desired to develop a method of producing hydrogen peroxide, which is capable of producing hydrogen peroxide with high production efficiency. According to the present invention, provided is a palladium-containing composition comprising palladium particles and a coating agent that coats the surface of the palladium particles, wherein a compound having an O?X structure (wherein X represents any of a phosphorus atom, a sulfur atom, and a carbon atom) is comprised as the coating agent.
Type:
Grant
Filed:
September 12, 2019
Date of Patent:
January 30, 2024
Assignees:
MITSUBISHI GAS CHEMICAL COMPANY, INC., KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
Inventors:
Tatsumi Ishihara, Norikazu Okuda, Ken-ichi Kimizuka, Ken Tasaki