Abstract: A material for lithography containing a tellurium-containing compound or a tellurium-containing resin, a production method therefor, a composition for lithography, a pattern formation method, a compound, a resin, and a method for purifying the compound or the resin are provided. The compounds and materials can provide for high solubility in a safe solvent.

Abstract: A photosensitive polyimide resin composition containing: a ring-closed polyimide resin (A) having a structure represented by Formula (1); and a polyfunctional radically polymerizable compound (B) having radically polymerizable functional groups and oxyalkylene groups, wherein a number of the radically polymerizable functional groups in the polyfunctional radically polymerizable compound (B) is 3 or greater and 100 or less, and wherein a total number of moles of the oxyalkylene groups added in the polyfunctional radically polymerizable compound (B) is 5 or greater and 100 or less.

Abstract: A method for producing fluorenone including a pretreatment step of heating fluorene in the presence of a lower aliphatic carboxylic acid, a bromine compound, and a metal catalyst, and an oxidation step of continuously supplying fluorene and oxygen to perform an oxidation reaction, in the order indicated.

Abstract: An aldehyde composition containing an aldehyde represented by Formula (1) and an aldehyde represented by Formula (2) is provided. A mass ratio [(1)/(2)] of the aldehyde represented by Formula (1) to the aldehyde represented by Formula (2) is from 96/4 to 99.97/0.03.

Abstract: A thermoplastic resin including a constituent unit (A) derived from a monomer represented by general formula (1). In general formula (1), R1 and R11 each independently represent a hydrogen atom, an aryl group having 6-12 carbon atoms, or a linear or branched alkyl group having 1-4 carbon atoms, and X represents one of general formulas (a) to (d). In general formulas (a) to (d), R21 to R57 each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, a linear or branched alkyl group having 1-4 carbon atoms, or a linear or branched alkoxy group having 1-7 carbon atoms.

Abstract: An object of the present invention is to provide a bioabsorbable and stretchable fibrous medical material that enables formation of ligation which provides a small and hard-to-unravel knot even with a weak force. The present invention provides a fibrous medical material which is a fibrous material composed of a molded article provided by spinning and drawing a bioabsorbable aliphatic polymer, wherein an elongation at break is 75% or greater, an intermediate elastic modulus in tension at a strain ranging from 0.25% and 10% is lower than an initial elastic modulus in tension at a strain ranging from 0.05% to 0.25%, the intermediate elastic modulus in tension is 400 MPa or less, and a residual strain rate after 100% deformation is 70% or less.

Abstract: A polyester resin containing: a diol constituent unit containing a unit a1 derived from spiroglycol represented by formula (1) and a unit a2 derived from ethylene glycol; and a dicarboxylic acid constituent unit containing a unit b derived from terephthalic acid and/or an ester thereof. A content of the unit a1 is from 5 to 60 mol % and a content of the unit a2 is from 30 to 95 mol %, based on a total amount of the unit a1 and the unit a2. A content of the unit b is from 80 to 100 mol % based on a total amount of the dicarboxylic acid constituent unit.

Abstract: There is provided a urethane resin that is excellent in adhesive strength, and maintains high adhesive strength even after exposure to high temperature and humidity. A urethane resin obtained by reacting a glycol-modified aromatic hydrocarbon-formaldehyde resin (A) modified with a glycol with a polyisocyanate (B) having two or more free isocyanate groups in a molecule.

Abstract: The present invention relates to triarylmethane compounds of the formula (I), which suitable as monomers for preparing thermoplastic resins having beneficial optical properties and which can be used for producing optical devices. R1 , R2 are e.g. hydrogen; Y is an alkylene group having 2, 3 or 4 carbon atoms, Ar is selected from mono- or polycyclic aryl and mono- or polycyclic hetaryl; X1, X2, X3, X4 are CH, C—Rx or N, provided that in each ring at most two of X1, X2, X3, X4 are N; Rx is e.g. halogen, CN or CH?CH2. The invention also relates to thermoplastic resins comprising a polymerized unit of the compound of formula (I).

Abstract: Provided is a method for producing fluorenone comprising an oxidation step of oxidizing fluorene in the presence of an aliphatic carboxylic acid having 2 to 3 carbon atoms, a metal catalyst, a bromine compound, and oxygen, a solvent removal step of removing the aliphatic carboxylic acid, a heating step at 120 to 350° C., and a distillation step in the order indicated.

Abstract: An alicyclic alcohol of Formula (1) and a fragrance composition including the same is described. An alicyclic alcohol composition containing an alicyclic alcohol of Formula (1) and an alicyclic alcohol of Formula (2), is also described, and this composition may also include an alicyclic alcohol of Formula (3). The alicyclic alcohol composition may comprise Formula (1) at a content of 85 mass % to 98 mass %.

Abstract: The problem addressed by this invention is to provide a laminate for molding having excellent moldability and post-curing properties of the hard-coat layer, and which can maintain the surface of the hard-coat layer in a satisfactory state while uncured. This problem is solved by a laminate for molding containing a hard-coat layer and a masking film affixed to the surface of the hard-coat layer, having an adhesive surface, which is the hard-coat layer-side surface of the masking film, with a surface free energy of at least 30.0 (mN/m) measured in accordance with the OWRK method, before being affixed. The hard-coat layer is in an uncured state.

Abstract: Provided is a wound body of a commingled yarn, the wound body being capable of effectively suppressing fraying and sagging, disorder of a lower layer, or breakage of the commingled yarn during winding or use. Also provided is a method for manufacturing the wound body.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.

Abstract: A composition containing: a compound (a) represented by Formula (1): wherein Ar represents an aromatic ring, m represents an integer of 2 to 8, n represents an integer of 0 to 6, provided that m+n is equal to or less than a number of carbon atoms that constitute the aromatic ring, and R1 each independently represents an alkylthio group, an epoxyalkylthio group, a thiol group, a halogen group, a hydroxy group, a dialkylthiocarbamoyl group, or a dialkylcarbamoylthio group; and 1,2,3,5,6-pentathiepane (b).

Abstract: An etchant capable of selectively etching copper and a copper alloy while suppressing dissolution of nickel, tin, gold, and an alloy thereof. The etchant contains: (A) 5-10.5% by mass of hydrogen peroxide with respect to the total mass of the etchant; (B) 0.3-6% by mass of nitric acid with respect to the total mass of the etchant; (C) at least one nitrogen-containing 5-membered ring compound selected from triazoles and tetrazoles, which may have at least one substituent selected from a C1-6 alkyl group, an amino group, and a substituted amino group having a substituent selected from a C1-6 alkyl group and a phenyl group; and (D) (d1) one or more pH adjusters selected from an alkali metal hydroxide, ammonia, an amine, and an ammonium salt, (d2) a phosphoric acid compound, or (d3) a combination of (d1) and (d2).

Abstract: The present invention provides a material for built up edge formation having a resin block containing a high molecular weight compound having a weight average molecular weight of 5×104 or higher and 1×106 or lower, a medium molecular weight compound having a weight average molecular weight of 1×103 or higher and lower than 5×104, and a carbon.

Abstract: The present invention provides a method for producing an oxymethylene copolymer resin composition, comprising: adding to an oxymethylene copolymer (A), an Mn micromole of an amine-substituted triazine compound (B) per gram of the oxymethylene copolymer (A), an Mc micromole of a choline hydroxide (C) per gram of the oxymethylene copolymer (A), and 0.05 to 1.1 parts by weight of an antioxidant (D) with respect to 100 parts by weight of the oxymethylene copolymer (A), and melt kneading a mixture of the oxymethylene copolymer (A), amine-substituted triazine compound (B), the choline hydroxide (C), and the antioxidant (D), wherein Mn (?mol/g-POM) and Mc (?mol/g-POM) satisfy: 6.5<(Mn+Mc×8)<25, 0.5<Mn<7.0, and 0.0<Mc.

Abstract: A cleaning composition for semiconductor substrates. The cleaning composition comprises hydrogen peroxide, a hydrogen peroxide stabilizing agent, an alkaline compound, and water. The hydrogen peroxide stabilizing agent is oxalic acid, diethylenetriaminepentaacetic acid, hydroxyethyliminodiacetic acid, potassium oxalate, 5-phenyl-1H-tetrazole, triethylenetetraminehexaacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, 8-quinolinol, L(+)-isoleucine, DL-valine, L(-)-proline, hydroxyethylethylenediaminetriacetic acid, N,N-di(2-hydroxyethyl)glycine, glycine, L-tryptophan, 2,6-pyridinedicarboxylic acid, benzothiazole, or DL-alanine. The alkaline compound is a quaternary ammonium hydroxide or potassium hydroxide.

Abstract: Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.