Patents Assigned to Mitsubishi Shindoh Co., Ltd.
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Publication number: 20110097238Abstract: To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which ? phases at an area ratio of 2 to 17% are dispersed in an ?-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting.Type: ApplicationFiled: March 9, 2009Publication date: April 28, 2011Applicant: MITSUBISHI SHINDOH CO., LTD.Inventor: Keiichiro Oishi
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Patent number: 7909946Abstract: A copper alloy consists essentially of Cu: 69 to 88 mass %, Si: 2 to 5 mass %, Zr: 0.0005 to 0.04 mass %, P: 0.01 to 0.25 mass %, and Zn: balance; has relation of, in terms of content of element a, [a] mass %, f0=[Cu]?3.5[Si]?3[P]=61 to 71, f1=[P]/[Zr]=0.7 to 200, f2=[Si]/[Zr]=75 to 5000, and f3=[Si]/[P]=12 to 240; has a metal structure containing ? phase and, K phase and/or ? phase, and has relation of, in terms of a content of phase b, [b]%, in an area rate, f4=[?]+[?]+[K]?85 and f5=[?]+[K]+0.3[?]?[?]=5 to 95; and has an average grain diameter of 200 ?m or less in a macrostructure when melted and solidified.Type: GrantFiled: August 10, 2005Date of Patent: March 22, 2011Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Keiichiro Oishi
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Publication number: 20110056596Abstract: A high strength and high thermal conductivity copper alloy tube contains: Co of 0.12 to 0.32 mass %; P of 0.042 to 0.095 mass %; and Sn of 0.005 to 0.30 mass %, wherein a relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P, and the remainder includes Cu and inevitable impurities. Even when a temperature is increased by heat generated by a drawing process, a recrystallization temperature is increased by uniform precipitation of a compound of Co and P and by solid-solution of Sn. Thus, the generation of recrystallization nucleuses is delayed, thereby improving heat resistance and pressure resistance of the high strength and high thermal conductivity copper alloy tube.Type: ApplicationFiled: November 10, 2008Publication date: March 10, 2011Applicant: MITSUBISHI SHINDOH CO., LTD.Inventor: Keiichiro Oishi
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Patent number: 7883589Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 71.5 to 78.5 percent, by weight, of copper, 2.0 to 4.5 percent, by weight, of silicon, 0.005 percent up to but less than 0.02, by weight, of lead, and the remaining percent, by weight, of zinc.Type: GrantFiled: May 26, 2006Date of Patent: February 8, 2011Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Keiichiro Oishi
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Publication number: 20100172791Abstract: An aluminum-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Al of 5 to 10 mass %, Zr of 0.0005 to 0.04 mass %, and P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Si of 0.5 to 3 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass % as needed.Type: ApplicationFiled: February 13, 2007Publication date: July 8, 2010Applicant: Mitsubishi Shindoh Co., LtdInventor: Keiichiro Oishi
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Publication number: 20100166595Abstract: A phosphor-bronze alloy as raw materials for Semi Solid Metal casting has a component composition containing Sn of 4 to 15 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing Zn of 0.1 to 7.5 mass % as needed, and further containing one or more kinds of Pb of 0.01 to 4.5 mass %, Bi of 0.01 to 3.0 mass %, Se of 0.03 to 1.0 mass %, and Te of 0.01 to 1.0 mass % as needed.Type: ApplicationFiled: February 9, 2007Publication date: July 1, 2010Applicant: Mitsubishi Shindoh Co., Ltd.Inventor: Keiichiro Oishi
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Publication number: 20090320964Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5 [P]+0.9 [Sn]+0.1 [Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.Type: ApplicationFiled: September 9, 2009Publication date: December 31, 2009Applicant: MITSUBISHI SHINDOH CO., LTD.Inventor: Keiichiro Oishi
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Publication number: 20090294087Abstract: A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %.Type: ApplicationFiled: August 7, 2009Publication date: December 3, 2009Applicants: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials CorporationInventor: Keiichiro Oishi
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Patent number: 7608157Abstract: The present invention discloses a heat resistance copper alloy material characterized in that said copper alloy material comprises 0.15 to 0.33 mass percent of Co, 0.041 to 0.089 mass percent of P, 0.02 to 0.25 mass percent of Sn, 0.01 to 0.40 mass percent of Zn and the remaining mass percent of Cu and inevitable impurities, wherein each content of Co, P, Sn and Zn satisfies the relationships 2.4?([Co]?0.02)/[P]?5.2 and 0.20?[Co]+0.5[P]+0.9[Sn]+0.1[Zn]?0.54, wherein [Co], [P], [Sn] and [Zn] are said mass percents of Co, P, Sn and Zn content, respectively; and said copper alloy material is a pipe, plate, bar, wire or worked material obtained by working said pipe, plate, bar or wire material into predetermined shapes.Type: GrantFiled: September 19, 2003Date of Patent: October 27, 2009Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Keiichiro Oishi
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Patent number: 7485200Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.Type: GrantFiled: July 12, 2007Date of Patent: February 3, 2009Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Masahiko Ishida, Junichi Kumagai, Takeshi Suzuki
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Publication number: 20090016927Abstract: A brass alloy as raw materials for Semi Solid Metal casting has a component composition containing Zn of 8 to 40 mass %, Zr of 0.0005 to 0.04 mass %, P of 0.01 to 0.25 mass %, and a balance of Cu and inevitable impurities, further containing one or more kinds of Si of 2 to 5 mass %, Sn of 0.05 to 6 mass %, and Al of 0.05 to 3.5 mass % as needed, and further containing one or more kinds of Pb of 0.005 to 0.45 mass %, Bi of 0.005 to 0.45 mass %, Se of 0.03 to 0.45 mass %, and Te of 0.01 to 0.45 mass %.Type: ApplicationFiled: February 9, 2007Publication date: January 15, 2009Applicants: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials CorporationInventor: Keiichiro Oishi
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Patent number: 7422792Abstract: A metallized polyimide film includes: a polyimide film including a first side and a second side; an intermediate layer that contains at least one element selected from the group consisting of Mo, Cr, Ni, Si, Fe, and Al, a deposition amount of the at least one element being between 0.3 and 15 mg/m2; and a conductive layer that is made of one of copper and a copper alloy formed on the intermediate layer; an oxygen and water barrier film that is made of at least one member selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, tin oxide, indium oxide, magnesium fluoride, magnesium oxide, aluminum, and indium tin oxide (ITO), and that has a thickness of between 5 and 300 nm formed on the second side of the polyimide film.Type: GrantFiled: January 24, 2005Date of Patent: September 9, 2008Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Masayuki Aida
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Patent number: 7338631Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.Type: GrantFiled: September 23, 2004Date of Patent: March 4, 2008Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Masahiko Ishida, Junichi Kumagai, Takeshi Suzuki
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Publication number: 20080041507Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.Type: ApplicationFiled: July 12, 2007Publication date: February 21, 2008Applicant: Mitsubishi Shindoh Co., LtdInventors: Masahiko Ishida, Junichi Kumagai, Takeshi Suzuki
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Patent number: 7241490Abstract: A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m2.Type: GrantFiled: January 26, 2005Date of Patent: July 10, 2007Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Masayuki Aida
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Patent number: 7029760Abstract: A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 ?m.Type: GrantFiled: July 10, 2003Date of Patent: April 18, 2006Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Akihito Mori, Takeshi Suzuki, Tadao Sakakibara, Shuzo Umezu, Masahiko Ishida
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Patent number: 6767644Abstract: A metallized polyimide film of the present invention comprises a polyimide film 1 which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and silicon monoxide, which is formed on top of the surface which has undergone surface roughening treatment with an average thickness of 5 to 50% of the aforementioned Ra value, and a conductive metal layer 4 which is formed on top of the intermediate layer 2. This construction improves the bonding strength between the polyimide film and the metal layer.Type: GrantFiled: October 1, 2002Date of Patent: July 27, 2004Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Masayuki Aida
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Patent number: 6451448Abstract: A surface treated metallic material according to the present invention comprises a metallic substrate and a metallic compound layer formed thereon, wherein the entire surface of the metallic compound layer is covered with minute, upright, scaly protrusions. The width in the major axial direction of the scaly protrusions is between 0.05˜0.5 &mgr;m and the thickness between 0.01˜0.1 &mgr;m, and the thickness of the metallic compound layer is between 0.1˜1.0 &mgr;m. The metallic compound layer incorporates one, or two or more of, the materials selected from the group consisting of chromium oxide, chromium hydroxide, niobium oxide, niobium hydroxide, rhodium oxide, rhodium hydroxide, vanadium oxide, vanadium hydroxide, palladium oxide, palladium hydroxide, nickel oxide, and nickel hydroxide. By using surface treated metallic materials of this type, bonding strength to a resin layer can be improved.Type: GrantFiled: December 22, 1999Date of Patent: September 17, 2002Assignee: Mitsubishi Shindoh Co. Ltd.Inventors: Yuichi Kanda, Sin-ei Satoh, Shigenari Ohtake, Takeshi Suzuki, Hiroyuki Natume
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Patent number: 6298909Abstract: With a grooved-inner-surface heat transfer tube, an inner circumferential surface of a metal tube is formed with fins bent at bent portions in a zigzag and extending consecutively around a circumferential direction of the inner circumferential surface, and at at least a part of the bent portions of the fins, the height of the fins is set at 30 to 90% of the height of the fins excluding the bend portions. With such a heat transfer tube, pressure loss can be suppressed while increasing heat exchange performance.Type: GrantFiled: March 1, 2000Date of Patent: October 9, 2001Assignee: Mitsubishi Shindoh Co. Ltd.Inventors: Takao Fukatami, Tetsuya Furuuchi, Shin Kikuchi, Shunroku Sukumoda
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Patent number: 6251503Abstract: The present invention relates to a film condenser and a metalized film for manufacturing the same. The metalized film comprises a base film formed from an insulating material, and a metal coating layer formed on the base film. A plurality of uncoated portions are formed as area partition margins in the metal coating layer so as to respectively form, in the metal coating layer, a plurality of electrode regions, a plurality of fuse connecting regions surrounded by two or more of the electrode regions, and a plurality of fuse portions. The fuse portions electrically connect each one of the fuse connecting regions with the electrode regions surrounding the one of the fuse connecting regions.Type: GrantFiled: March 20, 2000Date of Patent: June 26, 2001Assignee: Mitsubishi Shindoh Co., Ltd.Inventor: Mitsuru Momose