Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

Abstract: An adhesive film includes a base material layer; an adhesive resin layer (A) provided on a first surface side of the base material layer; and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F2.5) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130° C., and an integrated tacking force value (F30) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130° C.

Abstract: Provided are a protective film and a back grinding method for a semiconductor wafer, which can suppress occurrence of suction defect. A protective film is a film that protects a surface of a semiconductor wafer on which a circuit is formed when a back surface of the semiconductor wafer is ground in a state where the surface of the semiconductor wafer is sucked to a fixture. The protective film has a pressure-sensitive adhesive layer, a base material layer, and an auxiliary layer. The pressure-sensitive adhesive layer is a layer to be stuck to the semiconductor wafer, the auxiliary layer is a layer to be contact to the fixture, and the semiconductor wafer is a semiconductor wafer having a level difference on an outer peripheral edge of the surface on which the circuit is formed.

Abstract: A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

Abstract: A gas barrier polymer is formed by heat-curing a mixture including polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum, when a straight line connecting a measurement point at 1493 cm?1 and a measurement point at 1780 cm?1 is set as a baseline, an absorption intensity at 1660 cm?1 is set as I(1660), and an absorption intensity at 1625 cm?1 is set as I(1625), R represented by Equation (1) is greater than 1. R=I(1660)/I(1625)?{?0.65×(total amine/COOH)+0.

Abstract: A solar cell sealing material of the present invention is a solar cell sealing material that is used to seal a solar cell element and includes an ethylene.?-olefin copolymer, an organic peroxide (A) having a one-hour half-life temperature in a range of equal to or higher than 100° C. and equal to or lower than 130° C., and an organic peroxide (B) having a one-hour half-life temperature in a range of higher than 130° C. and equal to or lower than 160° C., and a ratio (X2/X1) of a content X2 of the organic peroxide (B) to a content X1 of the organic peroxide (A) in the solar cell sealing material is equal to or more than 0.05 and equal to or less than 1.10.

Abstract: A gas barrier film formed of a cured product of a mixture including a polycarboxylic acid, a polyamine compound, and a polyvalent metal compound, in which in an infrared absorption spectrum of the gas barrier film, an area ratio of an amide bond represented by B/A is equal to or less than 0.380, an area ratio of a carboxylic acid represented by C/A is equal to or less than 0.150, and an area ratio of carboxylate represented by D/A is equal to or more than 0.520.

Abstract: Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E?(160)/E?(?40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at ?40° C. is RE?0.01, and the elastic modulus E?(?40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Abstract: A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.

Abstract: A method for manufacturing a semiconductor device includes at least the following three steps: (A) A step of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer; (B) A step of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer; and (C) A step of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. The adhesive film includes a base material layer and an ultraviolet-curable adhesive resin layer provided on one surface side thereof. The adhesive resin layer includes an ultraviolet-curable adhesive resin, and a saturated electrostatic potential V1 of a surface of the adhesive resin layer after ultraviolet curing, which is measured using a specific method, is equal to or less than 2.0 kV.

Abstract: A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

Abstract: An adhesive laminate film has a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, a peel strength P0 between the heat-resistant resin layer and the flexible resin layer, which is based on JIS Z0237 and measured under defined conditions, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P1 between the heat-resistant resin layer and the flexible resin layer after a thermal treatment of the adhesive laminate film at 160° C. for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm.

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.

Abstract: Provided is a packaging film including: a substrate layer that includes polyethylene; and a coating layer that includes a resin and is provided in contact with one surface of the substrate layer or is provided over one surface of the substrate layer through an anchor coat layer. In one preferable aspect of the packaging film, when a glass transition temperature of the coating layer is represented by Tgc and a glass transition temperature of the substrate layer is represented by Tgs, a value of Tgc is ?25° C. to 120° C. and a value of Tgc-Tgs is 90° C. to 245° C.

Abstract: An adhesive film includes a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer and of which an adhesive force is reduced by an external stimulus. When a mass of the adhesive film after heating and drying at 130° C. for 30 minutes is defined as W1 and the mass of the adhesive film after the heated and dried adhesive film is left for 24 hours at 25° C. under an atmosphere of 50% RH to absorb water is defined as W2, an average water absorption rate indicated by 100×(W2?W1)/W1 is 0.90% by mass or less.

Abstract: A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.