Abstract: A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.

Abstract: In order to provide a component manufacturing apparatus and a component manufacturing method that can normally chuck and fix a component holding film to a chuck table in a heated state, the present component manufacturing apparatus 1 includes a chucking and fixing means 20 that chucks and fixes a component holding film to a heated chucking surface 21a, and a preventing means 30 that prevents heat convection, occurring on the chucking surface 21a, from contacting the film. The present component manufacturing method includes a setting step of chucking and fixing the film to the heated chucking surface 21a, and the setting step includes a preventing step of preventing heat convection, occurring on the chucking surface 21a, from contacting the film.

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteristic is measured after curing the ultraviolet curable adhesive resin material by irradiating with an ultraviolet ray, a storage elastic modulus at 5° C. E? (5° C.) is 2.0×106 to 2.0×109 Pa, and a storage elastic modulus 100° C. E? (100° C.) is 1.0×106 to 3.0×107 Pa.

Abstract: A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

Abstract: A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

Abstract: Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

Abstract: A component manufacturing method includes: a step of arranging a plurality of electronic components in a state where electrodes are exposed, on a support having a substrate and a holding layer, with the holding layer interposed therebetween; and a step of evaluating electric characteristics of 80 or more of the electronic components among the electronic components arranged on the support by bringing all or some of the exposed electrodes and probes into contact with each other and simultaneously performing conduction evaluation. A component manufacturing film includes a resin base layer, the holding layer provided on one surface side of the resin base layer, and a joint layer that is provided on an opposite side of the resin base layer and bonds the component manufacturing film to the substrate. A component manufacturing tool includes the substrate and the holding layer provided to one surface of the substrate.

Abstract: A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan ? at ?5° C. of 0.25 to 0.85.

Abstract: Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

Abstract: A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at ?15° C. is defined as E? (?15° C.) and a storage elastic modulus at 100° C. is defined as E? (100° C.) in a case where a viscoelastic characteristic is measured, E? (100° C.) is 1.0×106 to 3.5×107 Pa, and E?) (100° C./E? (?15° C.) is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray has a storage elastic modulus at 5° C. of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. of 1.0×106 to 3.0×107 Pa.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan ? at ?5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E? (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E? (100° C.) of 1.0×106 to 3.0×107 Pa.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E? (100° C.)/E? (?15° C.) is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tan ? at ?5° C. of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, is 0.25 to 0.85.