Patents Assigned to Mitsui
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Publication number: 20240263106Abstract: Disclosed are azeotropic or azeotrope-like compositions containing a hydrofluoroether and a chlorotrifluoropropene. The hydrofluoroether is at least one of methyl nonafluorobutyl ether, ethyl nonafluorobutyl ether, 2,2,2-trifluoroethyl-1,1,2,2-tetrafluoroethyl ether including isomers thereof. The compositions are azeotropic or azeotrope-like and are useful in cleaning applications.Type: ApplicationFiled: July 20, 2022Publication date: August 8, 2024Applicant: CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.Inventor: HIDEAKI KIKUCHI
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Publication number: 20240263008Abstract: A xylylene diisocyanate composition includes a xylylene diisocyanate and a 4-methylbenzenesulfonyl isocyanate.Type: ApplicationFiled: April 7, 2022Publication date: August 8, 2024Applicant: MITSUI CHEMICALS, INC.Inventor: Masayuki TAKAGUCHI
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Patent number: 12058819Abstract: There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M1 having a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M2 (M2 is a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T2/T1, a ratio of a thickness of the release-assisting layer, T2, to a thickness of the adhesion layer, T1, is more than 1 and 20 or less.Type: GrantFiled: November 14, 2019Date of Patent: August 6, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Rintaro Ishii, Takenori Yanai, Yoshinori Matsuura
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Publication number: 20240258151Abstract: A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E? (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E? (100° C.) of 1.0×106 to 3.0×107 Pa.Type: ApplicationFiled: May 27, 2022Publication date: August 1, 2024Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Hiroto YASUI, Hiroyoshi KURIHARA, Jin KINOSHITA
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Publication number: 20240258568Abstract: A non-aqueous electrolytic solution for a battery includes a compound represented by Formula (P) and a sulfuric ester compound. In Formula (P), each of R1 to R4 independently represents an alkyl group having from 1 to 6 carbon atoms or an aryl group having from 6 to 12 carbon atoms, L1 represents an alkylene group having from 1 to 6 carbon atoms or an arylene group having from 6 to 12 carbon atoms, and n represents an integer from 0 to 2. In a case in which n is 2, two R4s may be the same as or different from each other, and two L1s may be the same as or different from each other.Type: ApplicationFiled: May 26, 2022Publication date: August 1, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Yu MIZUNO, Yuri SUGIHARA
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Publication number: 20240258172Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan ? at ?5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.Type: ApplicationFiled: May 27, 2022Publication date: August 1, 2024Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Hiroto YASUI, Hiroyoshi KURIHARA, Jin KINOSHITA
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Publication number: 20240258150Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E? (100° C.)/E? (?15° C.) is 2.0×10?3 to 1.5×10?2.Type: ApplicationFiled: May 27, 2022Publication date: August 1, 2024Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Hiroto YASUI, Hiroyoshi KURIHARA, Jin KINOSHITA
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Publication number: 20240258152Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10?3 to 1.5×10?2.Type: ApplicationFiled: May 27, 2022Publication date: August 1, 2024Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Hiroto YASUI, Hiroyoshi KURIHARA, Jin KINOSHITA
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Publication number: 20240249967Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tan ? at ?5° C. of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, is 0.25 to 0.85.Type: ApplicationFiled: May 27, 2022Publication date: July 25, 2024Applicant: MITSUI CHEMICALS TOHCELLO, INC.Inventors: Hiroto YASUI, Hiroyoshi KURIHARA, Jin KINOSHITA
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Patent number: 12044042Abstract: A door opening device for an access door includes an upper lock device, a lower lock device, and a handle device, the lower lock device has a first bias member for biasing a lower opening lever in an opposite direction to an unlocking direction, the handle device has a handle into which an unlocking operation is inputted, a first lever to which an upper cable and a lower cable are connected, a second lever which rotates in a first direction in response to an unlocking operation and transmits this rotation to the first lever, and a second bias member for restoring the second lever to an initial position, and the second lever has a play stroke defined between a point in time when the second lever starts to rotate from the initial position to a point in time when the second lever transmits the rotation to the first lever.Type: GrantFiled: April 2, 2020Date of Patent: July 23, 2024Assignee: Mitsui Kinzoku Act CorporationInventors: Yosuke Matsuda, Tatsuya Takayama, Takao Taga
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Patent number: 12043684Abstract: The optical lens of the present invention contains a molded product constituted with a cyclic olefin-based copolymer having a constitutional unit (A) derived from an ?-olefin having 2 to 20 carbon atoms, a constitutional unit (B) derived from a cyclic olefin, and a constitutional unit (C) derived from an aromatic vinyl compound represented by a specific chemical formula.Type: GrantFiled: March 15, 2019Date of Patent: July 23, 2024Assignee: MITSUI CHEMICALS, INC.Inventors: Hideki Wasa, Sunil Krzysztof Moorthi, Haruka Saito, Futoshi Fujimura
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Patent number: 12046572Abstract: A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.Type: GrantFiled: March 12, 2021Date of Patent: July 23, 2024Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Jung-Lae Jo
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Publication number: 20240244978Abstract: Provided is a polymer piezoelectric film element which generates electricity at a high sensitivity upon vibrations across a broad frequency band, including those caused by the motion of humans or animals or faint contact stress, and those caused by automobiles and so on, which can be made into a thin film and at a high yield, and which can be used as a stably driving power supply device, a tactile sensor, or a vital sensor. The present invention pertains to: a polymer piezoelectric film element characterized in that an electrode sheet is formed on both surfaces of a polymer piezoelectric film, and by having a structure which has bumps and dips or a wave-shaped structure which has peaks and valleys in an axis perpendicular to said surfaces; and a power storage device, a sensor, or a vital sensor.Type: ApplicationFiled: April 18, 2022Publication date: July 18, 2024Applicant: Mitsui Chemicals, Inc.Inventors: Jun OKABE, Tadahiro SUNAGA, Shizuo TOKITO
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Publication number: 20240237639Abstract: Described are a plant disease control composition with enhanced efficacy and improved rainfastness of D-tagatose, and a plant disease control method using the composition. The plant disease control composition includes D-tagatose as an active ingredient, an oil component and a surfactant, and is effective against plant diseases, especially diseases caused by fungi and bacteria.Type: ApplicationFiled: June 1, 2022Publication date: July 18, 2024Applicant: MITSUI CHEMICALS CROP & LIFE SOLUTIONS, INC.Inventors: Toshiaki OHARA, Tomoyuki KITANO, Takeshi FUKUMOTO, Niiha SASAKURA, Keita OKAMOTO, Kazuki NOMURA
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Patent number: 12036778Abstract: The present invention has an object of providing a laminate which is composed of a layer containing a melt shapable fluororesin and a layer of an ethylene-?-olefin-nonconjugated polyene copolymer composition, and is excellent in adhesiveness, and the present invention relates to a laminate including: a layer including an ethylene-?-olefin-nonconjugated polyene copolymer composition, and a layer comprising a melt shapable fluororesin; wherein the ethylene-?-olefin-nonconjugated polyene copolymer composition includes 100 parts by mass of an ethylene-?-olefin-nonconjugated polyene copolymer (A), 1.0 to 6.0 parts by mass of at least one compound (C) selected from the group consisting of 1,8-diazabicyclo(5.4.0)undecene-7 salts, 1,5-diazabicyclo(4.3.0)nonene-5 salts, 1,8-diazabicyclo(5.4.0)undecene-7 and 1,5-diazabicyclo(4.3.0)nonene-5, and 3 to 20 parts by mass of magnesium oxide.Type: GrantFiled: October 31, 2019Date of Patent: July 16, 2024Assignees: Mitsui Chemicals, Inc., Daikin Industries, Ltd.Inventors: Yoshiharu Kikuchi, Kotaro Ichino, Kozue Osawa, Yuki Kuwajima
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Patent number: 12037818Abstract: A door latch device includes: electric components; a machine mechanism; a circuit board; a case; a first cover forming a first housing space in which a motor and the machine mechanism are housed; a second cover forming a second housing space in which the circuit board is housed; and an external waterproof seal disposed between the case and the second cover and waterproofs the second housing space. Further, the case includes: a recessed part forming a part of the second housing space; a surrounding wall surrounding the recessed part; and a seal groove formed along an outer circumference of the surrounding wall and in which the external waterproof seal is disposed, the second housing space is formed by covering the recessed part by the second cover, and an entire circumference between the recessed part and the second cover is waterproofed by the external waterproof seal.Type: GrantFiled: August 27, 2021Date of Patent: July 16, 2024Assignee: MITSUI KINZOKU ACT CORPORATIONInventors: Shintaro Okawa, Yasuyuki Watanabe
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Patent number: 12036532Abstract: An exhaust gas purification catalyst comprises a substrate and a catalyst layer on the substrate, and has a first section upstream along a flow direction of the exhaust gas and a second section downstream from the first section. The catalyst layer in the first section comprises a first catalyst layer comprising palladium and a second catalyst layer comprising rhodium and covering the first catalyst layer. A pore volume proportion, which is a proportion of a total volume of the pores having a pore diameter of 0.06-30.0 ?m as measured by mercury press-in method and existing in the substrate and the catalyst layer in the first section to a volume of a entire first section, is 12-18%. A wash coat amount, which is a mass per unit volume of the catalyst layer in the first section to the volume of the substrate existing in the first section, is 100-190 g/L.Type: GrantFiled: May 12, 2020Date of Patent: July 16, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventor: Hiroki Tanaka
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Patent number: 12036311Abstract: One aspect of the present invention provides an anti-obesity agent, an anti-dementia agent, a deodorant, an anti-aging agent, an anti-glycation agent, an anti-type I allergy agent, a hypotensive agent, a flavor improving agent, a muscle enhancing agent, and a bone metabolism improving agent which contain a bagasse decomposition extract as an active ingredient.Type: GrantFiled: May 30, 2019Date of Patent: July 16, 2024Assignee: Mitsui Sugar Co., Ltd.Inventors: Toma Furuta, Masami Mizu, Kiyoaki Miyasaka, Sayoko Fujii, Kazuyo Shiomi, Satoru Itou, Miki Sakazaki
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Publication number: 20240227377Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).Type: ApplicationFiled: February 8, 2022Publication date: July 11, 2024Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Hiroto IIDA, Makoto HOSOKAWA, Misato MIZOGUCHI, Shinya HIRAOKA, Toshiyuki SHIMIZU
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Publication number: 20240228759Abstract: A thermoplastic elastomer composition, including 100 parts by mass of an ethylene??-olefin non-conjugated polyene copolymer (A), 20 to 5,000 parts by mass of a soft propylene-based copolymer (B), a melting point (TmB) is not observed or is lower than 115° C., 10 to 500 parts by mass of a crystalline polyolefin (C), a melting point (TmC) is 115° C. or higher, 0 to 70 parts by mass of a softener (D), and 0.01 to 10 parts by mass of a crosslinking agent (E), the soft propylene-based copolymer (B) further satisfies the following requirements (b-1) and (b-2): (b-1) 90 to 50 mol % of a constituent unit derived from propylene, 0 to 30 mol % of a constituent unit derived from 1-butene, and 5 to 30 mol % of a constituent unit derived from ethylene, are contained; (b-2) a molecular weight distribution (Mw/Mn) obtained by gel permeation chromatography (GPC) is in a range of 1.0 to 3.5.Type: ApplicationFiled: June 23, 2022Publication date: July 11, 2024Applicant: MITSUI CHEMICALS, INC.Inventors: Nana TAKAYAMA, Hidetake NAKANO, Takeshi KANEHARA, Yasuhiro KITAHARA, Remi KUSUMOTO
