Patents Assigned to Mitsui
  • Publication number: 20090075103
    Abstract: A resin composition comprises a polyimide resin composition or precursor thereof obtained from an acid dianhydride component containing a compound represented by the following Formula (1) and a diamine component containing a diamine compound represented by the following Formula (2), and a bismaleimide compound represented by the following Formula (3), wherein the diamine component contains a diamine compound (a) in which m in the Formula (2) represents an integer of 0 or 1 and a diamine component (b) in which m in the Formula (2) represents an integer of 2 to 6 in a molar ratio (a:b) of from 100:0 to 50:50, wherein, in the Formula (2), when m is 2 or more, each X may be independently the same or different, and represents O, SO2, S, CO, CH2, C(CH3)2, C(CF3)2 or a direct bond, wherein, in the Formula (3), n represents an integer of 0 to 6.
    Type: Application
    Filed: March 17, 2006
    Publication date: March 19, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masao Kawaguchi, Kiyomi Imagawa, Shuji Tahara, Eiji Ohtsubo
  • Publication number: 20090076208
    Abstract: A polymerizable composition including a compound represented by the following formula (1) and elemental sulfur. (In the following formula (1), M represents a metal atom; X1 and X2 each independently represent a sulfur atom or an oxygen atom; R1 represents a divalent organic group; m represents an integer of 0 or 1 or more; p represents an integer of 1 or more and n or less; n represents the valency of the metal atom M; Y each independently represent an inorganic or organic residue; and when n?p is 2 or more, Y's may bind to each other to form a ring containing the metal atom M.
    Type: Application
    Filed: February 27, 2007
    Publication date: March 19, 2009
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shinichi Usugi, Mitsuo Nakamura, Hiroshi Naruse
  • Publication number: 20090076233
    Abstract: A novel hybrid polymer has a structure in which a polyolefin segment and a polar polymer segment are connected not via a bonding group containing a heteroatom. A method of the invention produces the hybrid polymer with industrial advantages. The hybrid polymer includes a polyolefin segment (A) and a polar polymer segment (B), the polar polymer segment being obtained by radical polymerization of a radically polymerizable monomer.
    Type: Application
    Filed: February 21, 2006
    Publication date: March 19, 2009
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Hideyuki Kaneko, Shinichi Kojoh, Nobuo Kawahara, Shingo Matsuo, Tomoaki Matsugi, Norio Kashiwa
  • Publication number: 20090068578
    Abstract: A binder resin for toner includes a hybrid resin of a crystalline resin (X) and an amorphous resin (Y), having a peak molecular weight of 30,000 or larger, and an amorphous resin (Z) having a peak molecular weight of smaller than 30,000.
    Type: Application
    Filed: June 16, 2006
    Publication date: March 12, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Shuichi Murakami, Yoshihito Hiroto, Masaaki Shin
  • Publication number: 20090069515
    Abstract: A solid titanium catalyst component (I) of the present invention is characterized in that it contains titanium, magnesium, halogen, and a cyclic ester compound (a) represented by the following formula (1): wherein n is an integer of 5 to 10; R2 and R3 are each independently COOR1 or R, and at least one of R2 and R3 is COOR1; a single bond (excluding Ca—Ca bonds, and a Ca—Cb bond in the case where R3 is R) in the cyclic backbone may be replaced with a double bond; a plurality of R1's are each independently a monovalent hydrocarbon group having 1 to 20 carbon atoms; and a plurality of R's are each independently a hydrogen atom or a substituent, but at least one of R's is not a hydrogen atom. When using this solid titanium catalyst component (I), an olefin polymer having a broad molecular weight distribution can be produced.
    Type: Application
    Filed: January 19, 2006
    Publication date: March 12, 2009
    Applicant: MITSUI CHEMICALS,INC.
    Inventors: Kazuhisa Matsunaga, Hisao Hashida, Toshiyuki Tsutsui, Kunio Yamamoto, Atsushi Shibahara, Tetsunori Shinozaki
  • Publication number: 20090069478
    Abstract: To provide a polyamide resin composition which inhibits generation of a gas, formation of decomposition products and discoloration of molded articles even under high molding temperature conditions, is excellent in incombustibility and toughness, and heat resistance in a reflow soldering step being required for surface mounting. The present invention provides a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.01 to 0.45% by mass of an antimony compound (C) and 0.5 to 10% by mass of a salt of zinc or calcium (D).
    Type: Application
    Filed: March 9, 2006
    Publication date: March 12, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masashi Seki, Kunihiro Ohuchi
  • Publication number: 20090064597
    Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).
    Type: Application
    Filed: April 14, 2006
    Publication date: March 12, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Akinori Etoh, Setsuko Oike, Tomokazu Ishizuka, Shigeharu Fujii, Kiyotaka Shindo
  • Publication number: 20090069479
    Abstract: A flame-retardant polyamide composition having excellent properties in mechanical properties such as toughness, in heat resistance, incombustibility and flowability in a reflow soldering process, and in heat stability during molding. There is provided a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide resin (A), 5 to 40% by mass of flame retardant with specific bromine content and molecular weight (B) and 0.5 to 10% by mass of flame retardant auxiliary agent (C) optionally together with hydrotalcite compound of specific composition (D).
    Type: Application
    Filed: March 9, 2006
    Publication date: March 12, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventor: Masashi Seki
  • Patent number: 7501178
    Abstract: The object of the present invention is to provide fiber for artificial hair which is deformable by hands at will and has the shape-retaining property. The present invention relates to fiber for artificial hair containing a plastically deformable filament (A) containing a thermoplastic resin having the restoration angle of not more than 30 degrees, after 10 minutes from bending it at 90 degrees. Further, it relates to fiber for artificial hair, which has the shape retention of not less than 30% when it is wound ten times on a cylindrical collar having a diameter of 10 mm and allowed to stand for 10 minutes, and the cylindrical collar was removed and allowed to stand for 5 minutes. The invention also relates to fiber for artificial hair, which is utilized for periwigs, wigs, doll hair, hair accessories, eyelashes, beards or the like by further coloring them.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: March 10, 2009
    Assignee: Mitsui Chemicals Inc
    Inventor: Issei Sato
  • Patent number: 7501312
    Abstract: A protecting method for a semiconductor wafer in a step of processing a semiconductor wafer which involves a first step of adhering an adhesive film for protection of a semiconductor wafer in which an adhesive layer is formed on one surface of a base film to a circuit-formed surface of the semiconductor wafer, a second step of heating the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered, a third step of processing a non-circuit-formed surface of the semiconductor wafer by fixing the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered on a grinding machine or an abrasive machine, and a fourth step of peeling the adhesive film for protection of the semiconductor wafer from the semiconductor wafer. The method addresses warpage problems and can prevent breakage of wafers during conveyance even if the thickness of a wafer is reduced to approximately 150 ?m or less.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: March 10, 2009
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takanobu Koshimizu, Makoto Kataoka, Masafumi Miyakawa, Hideki Fukumoto, Yoshihisa Saimoto
  • Patent number: 7500502
    Abstract: An inspection apparatus and method of inspection enable an inspector to conduct visual inspection of film carrier tapes for mounting electronic components in a natural sitting position regardless of the magnification of a magnifier. The inspection apparatus is compact to permit effective use of the space inside the inspection room. The inspection apparatus includes a feed reel and a take-up reel adjacent to each other, and an inspection part that is located so that the adjacent feed and take-up reels are in the order of the feed reel and the take-up reel in relation to the inspection part. A film carrier tape from the feed reel is transported in a substantially vertical direction to the inspection part and is inspected with a magnifier along a substantially vertical direction.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: March 10, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Masahiko Yamamoto, Yoshihiro Kouzan, Sachio Noto, Kiyohito Kobayashi
  • Publication number: 20090056437
    Abstract: A liquid level detecting method is provided for detecting the level of a liquid at a high accuracy by performing correction by using the density of the liquid, in the case of detecting the liquid level by using a pressure sensor. The pressure sensor (3) is arranged to have a contact with the liquid. A liquid pressure applied to the pressure sensor (3) is detected by the pressure sensor, and the liquid level is calculated based on the liquid pressure and the density of the liquid.
    Type: Application
    Filed: October 20, 2005
    Publication date: March 5, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshiaki Kawanishi, Kiyoshi Yamagishi
  • Publication number: 20090061185
    Abstract: There is provided by the present invention a nonwoven fabric laminate which comprises a first spunbonded nonwoven fabric comprising a propylene-based polymer (first SB nonwoven fabric), a melt blown nonwoven fabric comprising a propylene-based polymer and laminated on the first spunbonded nonwoven fabric, and a second spunbonded nonwoven fabric (second SB nonwoven fabric) comprising a propylene-based polymer and laminated on the melt blown nonwoven fabric, and which has overall basis weight of not more than 30 g/m2, wherein the basis weight of the first SB nonwoven fabric is in the range of 3 to 25 g/m2, the basis weight of the second SB nonwoven fabric is in the range of 1 to 11 g/m2, the ratio of the basis weight of the first SB nonwoven fabric to the basis weight of the second SB nonwoven fabric is not less than 1.6, the ratio of a thickness of the first SB nonwoven fabric to a thickness of the second SB nonwoven fabric is not less than 1.
    Type: Application
    Filed: January 30, 2007
    Publication date: March 5, 2009
    Applicant: MITSUI CHEMICALS, INC.
    Inventor: Takashi Hisamoto
  • Publication number: 20090058108
    Abstract: A striker of a vehicle door latch device comprises a longitudinal plate-like metal base and a U-shaped metal engaging member including a first leg part, a second leg part and a front connecting part. The first leg part has, at a front side portion thereof, a latch engaging part which is engageable with an engaging recess of a latch of the vehicle door latch device. The first leg part has, at a rear side portion thereof, a reinforced large diameter part with a larger diameter than that of the latch engaging part. A length of the reinforced large diameter part being 20% or more of the length of the first leg part.
    Type: Application
    Filed: October 28, 2008
    Publication date: March 5, 2009
    Applicant: Mitsui Kinzoku Kogyo Kabushiki Kaisha
    Inventors: Yukio SAWAJIRI, Hiroyuki SAKAGAMI, Miki OGINO
  • Publication number: 20090061554
    Abstract: The present invention provides a resinous hollow package that includes a moisture-proof island that is a planar structure disposed below a semiconductor element mounting surface of the resinous hollow package, the semiconductor element mounting surface having an area of 200 mm2 or more and the maximum wave height of a wave curve of 35 ?m or less. The resinous hollow package of the invention has an excellent moisture resistance due to the moisture-proof island included therein. Further, since the flatness of the semiconductor element mounting surface is excellent, decrease in the amount of light in a peripheral portion of an image can be suppressed in a digital single-lens reflex camera or the like with a large solid-state image sensor, even when a wide angle lens is used.
    Type: Application
    Filed: January 30, 2007
    Publication date: March 5, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Daisuke Suzuki, Masayuki Kondo
  • Patent number: 7498098
    Abstract: A method for producing a cathode material for a lithium battery, characterized in that it comprises admixing a compound liberating a phosphate ion in a solution and metallic iron, and dissolving the metallic iron, followed by firing, thereby synthesizing ferric phosphate. The above method further comprising reacting a raw material mixture while grinding it down or refluxing can produce ferric phosphate cathode material having a fine particle diameter and exhibiting high activity, through a precursor before firing having a fine particle diameter.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: March 3, 2009
    Assignees: Japan as Represented by President of the University of Kyusyu, Mitsui Engineering & Shipbuilding Co., Ltd.
    Inventors: Shigeto Okada, Jun-ichi Yamaki, Yike Chen, Takafumi Yamamoto, Naoki Hatta
  • Publication number: 20090053525
    Abstract: Disclosed is a nickel ink which is obtained by dispersing nickel particles in a dispersion medium. This nickel ink contains a methyldimethoxysilane coupling agent. The dispersion medium contains a glycol having a boiling point at room temperature of not more than 300 & ring; C, an alkoxyethanol having 3-10 carbon atoms, and an ether having carbon atoms. The ink is preferably controlled to have a surface tension of 15-50 mN/m and a viscosity at 25 & ring; C of 0.6-60 mPa-sec. This ink is preferably used in inkjet printing systems.
    Type: Application
    Filed: March 23, 2007
    Publication date: February 26, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoichi Kamikoriyama, Hiroki Sawamoto, Mikimasa Horiuchi
  • Publication number: 20090050196
    Abstract: The present invention provides a resin composition for a solar cell package and a resin composition for a wet solar cell package which are excellent in transparency, moisture resistance, weather resistance and chemical resistance and are suitable as a material of a package for a solar cell, and a package for a wet solar cell and a transparent substrate for a wet solar cell which are obtained by molding the resin composition. The resin composition for a solar cell package of the present invention contains a cyclic olefin polymer having one kind or two or more kinds of structures represented by the following general formula (1) (provided that, in the formula, x and y represent the copolymerization ratio and are a real number satisfying 0/100?y/x?95/5. n is the number of substitution of a substituent Q and an integer of 0?n?2. R1 is a 2+n valent group selected from the group consisting of hydrocarbon groups having 2 to 20 carbon atoms.
    Type: Application
    Filed: March 15, 2006
    Publication date: February 26, 2009
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Kazuyoshi Kaneko, Hiroyasu Yamaoka
  • Publication number: 20090049808
    Abstract: In order to maintain the dust collection efficiency, it comprises: a filtration chamber 20 which has an carbon fiber outlet 10 from which carbon fibers are discharged and to which a gas including the carbon fibers is introduced; a flexible cylindrical filter cloth 22 one end of which is suspended in the filtration chamber and which collects the carbon fibers in the gas in order to clean up the gas; and a pathway 30 for cleaned-up gas which is connected to the filtration chamber 20 through the cylindrical filter cloth 22 and which allows the cleaned-up gas to pass through it.
    Type: Application
    Filed: January 25, 2006
    Publication date: February 26, 2009
    Applicants: BUSSAN NANOTECH RESEARCH INSTITUTE INC., MITSUI & CO., LTD.
    Inventors: Hirosuke Kawaguchi, Fuminori Munekane, Kojuro Takahashi
  • Patent number: 7495177
    Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: February 24, 2009
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi, Yutaka Iguchi