Patents Assigned to Mitsui
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Patent number: 7493802Abstract: There is provided an identification device capable of accurately, rapidly, and easily identifying a hydrocarbon-based liquid and alcohol-based liquid. An identification sensor unit (2) is arranged to face a flow passage (20) of a liquid to be measured and includes a liquid type detection unit with indirect heating (21) having a heating body and a temperature-sensitive body, and a liquid temperature detecting unit (22) for detecting the temperature of the liquid to be measured. The identification device further includes an identification calculation unit for applying a single pulse voltage to the heating body of the liquid type detection unit (21) so as to generate heat and identifying the liquid to be measured according to an output of a liquid type detection circuit formed by the temperature-sensitive body of the liquid type detecting unit (21) and the liquid temperature detection unit.Type: GrantFiled: January 25, 2005Date of Patent: February 24, 2009Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Toshiaki Kawanishi, Takayuki Takahata, Kiyoshi Yamagishi
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Patent number: 7495035Abstract: It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.Type: GrantFiled: August 10, 2004Date of Patent: February 24, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Yugo Yamamoto, Yasushi Mizuta, Yuichi Ito
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Patent number: 7494187Abstract: A hook member of a vehicle seat lock engages with a striker fixed to a vehicle body. An opening lever is pivotally secured to the first base plate to constitute the first subassembly. The hook member is pivotally secured to the second base plate to constitute the second subassembly. The first base plate is coupled to the second base plate. Between the first and second base plates, a sensing member is pivotally secured in parallel with the hook member to detect invasion of the striker in the hook member.Type: GrantFiled: January 23, 2007Date of Patent: February 24, 2009Assignees: Mitsui Mining and Smelting Co., Ltd., Toyota Boshoku Kabushiki KaishaInventors: Hisashi Inoue, Shigeo Kakuta, Naoya Seto, Masahito Minoura, Shinji Suzuki, Toshikazu Araki, Kazunori Tahashi
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Publication number: 20090047428Abstract: Disclosed is a method for manufacturing carbon fibrous structures each of which comprises a three dimensional network of carbon fibers, which is characterized in that, in the procedure of carbon fiber vapor phase deposition utilizing decomposition of organic carbon compound, at least two kinds of organic carbon compounds as carbon sources are in existence at least at predetermined thermal decomposition reaction temperature range in a reaction furnace and partial pressures of gases of these compounds are regulated so that these compounds are decomposed at mutually different decomposition temperatures, and/or a raw material gas supplied into the reaction furnace is forced to form a turbulent flow. It is possible to obtain efficiently the carbon fibrous structures each of which comprises a three dimensional network of carbon fibers and which are suitable as additives to be added to solid materials, such as resin, ceramics, metal, etc.Type: ApplicationFiled: November 20, 2006Publication date: February 19, 2009Applicants: BUSSAN NANOTECH RESEARCH INSTITUTE INC., MITSUI & CO., LTD.Inventors: Jiayi Shan, Takayuki Tsukada, Fuminori Munekane, Hirosuke Kawaguchi
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Publication number: 20090044971Abstract: The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat layer, a cover plating layer formed on the upper surface of the Cu nodule layer and a first metal plating layer formed on the upper surface of the cover plating layer, and on the upper surface of the wiring circuit, a protruded and depressed surface attributable to protrusions and depressions of the upper surface of the Cu nodule layer is formed. The printed wiring board can be produced by depositing the above metal layers such as the Cu nodule layer with regulating a sidewall surface of a pattern formed from the photosensitive resin. Ruther conductive bonding is possible by the use of an adhesive only.Type: ApplicationFiled: November 13, 2006Publication date: February 19, 2009Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Tatsuo Kataoka, Hirokazu Kawamura
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Publication number: 20090045689Abstract: A rotor includes: a rotor core fixedly attached to a rotational shaft and having a magnet-inserted hole portion; a magnet inserted into the magnet-inserted hole portion; and a resin portion injected into the magnet-inserted hole portion. The rotor core is constructed by axially stacking a plurality of electromagnetic steel sheets. The electromagnetic steel sheets include: an electromagnetic steel sheet having the magnet-inserted hole portion and a weight-reducing-purpose hole portion provided separately from the magnet-inserted hole portion; and an electromagnetic steel sheet located on at least one axial end of the rotor core and having a portion covering the hole portion formed in the electromagnetic steel sheet.Type: ApplicationFiled: March 9, 2007Publication date: February 19, 2009Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, MITSUI HIGH-TEC, INCInventors: Kentaro Haruno, Taketo Takeuchi, Katsumi Amano, Takashi Fukumoto, Kazutoshi Ueda
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Publication number: 20090047539Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.Type: ApplicationFiled: March 9, 2007Publication date: February 19, 2009Applicant: MITSUI MINING & SMELTING CO., LTDInventors: Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka, Jo Nishikawa, Takeo Taguchi
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Patent number: 7491468Abstract: A method for producing a cathode material for a secondary battery, characterized in that it comprises admixing a compound liberating a phosphate ion in a solution (phosphoric acid H3PO4, phosphorus pentoxide PO5, ammonium dihydrogenphosphate NH4H2PO4 and the like), water and metallic iron, adding lithium carbonate, lithium hydroxide or a hydrate thereof to the resultant mixture, and firing the resultant reaction product, to thereby synthesize LiFePO4.Type: GrantFiled: October 17, 2003Date of Patent: February 17, 2009Assignees: Japan as represented by the President of the University of Kyusyu, Mitsui Engineering & Shipbuilding Co., Ltd. et al.Inventors: Shigeto Okada, Jun-ichi Yamaki, Naoki Hatta, Izumi Uchiyama, Toshikazu Inaba
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Patent number: 7491840Abstract: This invention provides a compound represented by the following general formula (1) and capable of suppressing the blooming, which is observed in the compounding of the resorcin or the RF resin, as far as possible while maintaining the workability and high humidity-aged adhesion of the rubber composition obtained by compounding with rubber, reducing the deterioration of the adhesiveness during the storage of the rubber composition and stably developing the adhesiveness as well as the composition containing the above-mentioned compound as a main component: (wherein R represents a divalent aliphatic group having a carbon number of 1-16).Type: GrantFiled: February 24, 2006Date of Patent: February 17, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Kazuya Tsukamoto, Nobumasa Arashiba, Akinori Nagatomo, Kouki Oogaki, Takeshi Kobayashi
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Publication number: 20090042107Abstract: A pellicle that is used in a semiconductor lithography process and that can be used in an exposure device with an optical system having a numerical aperture of 1.0 or above, is provided. The pellicle of the present invention uses a pellicle film that has had its film thickness adjusted so as to exhibit transmittance of 95% or above at angles of incidence of exposure light with respect to the pellicle film in the range of from 0° to 20°. By using the pellicle of the present invention, it is possible to produce a semiconductor having an unprecedented fine circuit pattern at good yield while preventing adherence of dust to a reticle.Type: ApplicationFiled: January 30, 2007Publication date: February 12, 2009Applicant: Mitsui Chemicals Inc.Inventors: Masahiro Kondou, Toshihiko Nakano
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Patent number: 7488014Abstract: A door opening/closing device includes, between a door operating lever and an open-door latch unit, a first connection link connected to the door operating lever and a third wire cable. One end of the third wire cable is connected to the first connection link and the other end is connected to the open-door latch unit to connect the first connection link and the open-door latch unit to each other.Type: GrantFiled: April 9, 2007Date of Patent: February 10, 2009Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Hideaki Nozawa, Jiro Mitsui
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Patent number: 7488789Abstract: A propylene/1-butene random copolymer containing 60 to 90 mol % of propylene units and 10 to 40 mol % of 1-butene units and has a triad isotacticity of not less than 85% and not more than 97.5%, a molecular weight distribution of from 1 to 3, an intrinsic viscosity of from 0.1 to 12 dl/g, a melting point of from 40 to 75° C. and a crystallization rate at 45° C. of 10 minutes or less, and satisfying the following relation, 146 exp (?0.022M)?Tm?125 exp (?0.032M), and an olefin catalyst for preparation thereof.Type: GrantFiled: December 26, 2003Date of Patent: February 10, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Shigenobu Ikenaga, Keiji Okada, Hiroshi Hoya, Norihide Inoue, Naritoshi Hirota, Hiromu Kaneyoshi, Munehito Funaya, Koji Kawai, Nobuo Kawahara, Shinichi Kojoh, Norio Kashiwa, Ryoji Mori
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Patent number: 7488777Abstract: A resin composition containing 1 to 50% by weight of a propylene-based copolymer (a) which has a melting point (Tm (a)) as measured by a differential scanning calorimeter (DSC) of 100° C. or lower, or has no melting point, and 50 to 99% by weight of a polymer (b), and a film obtained therefrom are provided, and preferably the initial elastic modulus of the film measured according to JISK6781 is 300 MPa or less. The film has excellent transparency, heat sealing property and tear resistance.Type: GrantFiled: August 24, 2005Date of Patent: February 10, 2009Assignee: Mitsui Chemicals, Inc.Inventor: Norihide Inoue
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Patent number: 7488532Abstract: The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.Type: GrantFiled: April 13, 2004Date of Patent: February 10, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Youichi Kodama, Hiroshi Maruyama, Isao Naruse
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Publication number: 20090032139Abstract: Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.Type: ApplicationFiled: April 27, 2006Publication date: February 5, 2009Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Takahiko Sakaue, Keita Furumoto, Katsuhiko Yoshimaru
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Publication number: 20090036711Abstract: Disclosed is an industrially advantageous process for producing O-methyl-N-nitroisourea. Disclosed is a process for obtaining O-methyl-N-nitroisourea represented by the following chemical formula (1) or a salt thereof in a high yield by performing the nitration of O-methylisourea represented by the following chemical formula (2) or a salt thereof with nitrating agents in the presence of fuming sulfuric acid.Type: ApplicationFiled: February 7, 2007Publication date: February 5, 2009Applicant: MITSUI CHEMICALS, INC.Inventors: Hiroyuki Katsuta, Kiyoshi Takahashi
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Publication number: 20090035541Abstract: The present invention relates to a polyimide metal laminate which is a metal laminate comprising a stainless steel layer/a conductor layer/a polyimide resin layer/a metal layer, wherein the conductor layer is interposed between the stainless steel layer and the polyimide resin layer as a ground, and having a strong adhesion between the conductor layer and the polyimide resin layer, thus being able to be processed and used as a hard disk suspension. Specifically, the metal laminate of the present invention is characterized in that a surface of the conductor layer in contact with the polyimide resin layer is not smooth (preferably its 10-point average surface roughness is 0.5 ?m or more).Type: ApplicationFiled: April 14, 2006Publication date: February 5, 2009Applicant: Mitsui Chemicals, Inc.Inventors: Shuichi Yokozawa, Koji Hirota, Shuji Tahara
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Patent number: 7485401Abstract: It is an object of the present invention to provide a resin composition for a toner and a toner excellent in low temperature fixation property, high temperature offset resistance, blocking resistance, and excellent in coloration. The present invention relates to a resin composition for a toner, which contains a crystalline polymer having a melting point of 180 to 280° C. and heat absorption of 25 to 150 mJ/mg at a melting point measured by a differential scanning calorimeter (DSC) and a non-crystalline polyester having a glass transition temperature of 30 to 80° C.Type: GrantFiled: July 30, 2003Date of Patent: February 3, 2009Assignee: Mitsui Chemicals, Inc.Inventors: Kenichi Matsumura, Akihiro Niki, Takashi Shinjo, Hideyuki Takahashi
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Patent number: 7485361Abstract: An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board.Type: GrantFiled: December 9, 2004Date of Patent: February 3, 2009Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kensuke Nakamura, Tetsuro Sato
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Publication number: 20090029186Abstract: It is an object of the present invention to provide a surface-treated copper foil comprising an electrodeposited copper foil with a chromium-free rust-proofing layer which exhibits good performance in peel strength and resistance to peel loss after chemical treatment as a printed wiring board. To achieve this object, a surface-treated copper foil comprising an rust-proofing layer and a silane coupling agent layer formed on the bonding surface of an electrodeposited copper foil to an insulating resin substrate, wherein the rust-proofing layer comprises a nickel layer having a thickness by weight of 5 to 40 mg/m2 and a tin layer having a thickness by weight of 5 to 40 mg/m2 stacked in this order, and the rust-proofing layer is provided with the silane coupling layer on the surface is applied.Type: ApplicationFiled: June 12, 2006Publication date: January 29, 2009Applicant: MITSUI MINING & SMELTING CO., LTD.Inventor: Tetsuhiro Matsunaga