Patents Assigned to Mitsui
  • Publication number: 20220146468
    Abstract: Provided is a fluorine-containing solvent for gas chromatography mass spectrometry of fluorine-containing substances found contaminating surfaces of fluororesin melt-molded products and detrimental to the use of such products for handling fluids in semiconductor manufacture. Also provided is a quantitative determination method for such fluorine-containing substances and a qualitative analysis method for such fluorine-containing substances based on a gas chromatography mass spectrometry method using the fluorine-containing solvent to enable the determination of the presence or absence of trace amounts of contaminant fluorine-containing substances existing as fine particles on surfaces of melt-molded fluororesin products.
    Type: Application
    Filed: March 4, 2020
    Publication date: May 12, 2022
    Applicant: CHEMOURS-MITSUI FLUOROPRODUCTS CO. LTD.
    Inventors: HIROMASA YABE, HIROKO ITAGAKI
  • Publication number: 20220145052
    Abstract: A propylene resin composition includes a propylene polymer (A) satisfying requirements (1) to (3) below: (1) having a number average molecular weight (Mn) measured by gel permeation chromatography (GPC) of 5000 to 22000; (2) having a ratio (Mw/Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn) measured by gel permeation chromatography (GPC) being 1.2 to 3.5; and (3) having a proportion of a component eluted at a temperature of not more than ?20° C. in temperature rising elution fractionation (TREF) being not more than 3.5 mass %.
    Type: Application
    Filed: March 17, 2020
    Publication date: May 12, 2022
    Applicants: MITSUI CHEMICALS, INC., PRIME POLYMER CO., LTD.
    Inventors: Keita ITAKURA, Katsuhiko KOIKE, Ryoko HIROI, Hiroyuki FUKUSHIMA, Kou TSURUGI, Atsushi SHIBAHARA, Fumiaki NISHINO, Kohei TANAKA, Yasuhiro KAI, Naoya NODA, Kenji MICHIUE, Takanori FURUTA
  • Publication number: 20220146859
    Abstract: A lens ordering system includes: a computer, the computer being provided with a CPU, a storage unit, and a selection unit that is configured to be controlled by the CPU. The storage unit stores data, configured to enable determination of lens information that includes a resin material type, a pigment type, and a coating type that are used for a lens material, based on user information that includes basic information pertaining to a user, and at least one of usage information pertaining to lens usage desired by the user or psychosomatic information including psychosomatic symptoms and conditions including the eyes of the user. The selection unit determines and outputs the lens information based on the user information acquired pertaining to the user and the data stored in the storage unit.
    Type: Application
    Filed: March 10, 2020
    Publication date: May 12, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventor: Shinsuke ITO
  • Publication number: 20220149463
    Abstract: Provided are an outer packaging film for a lithium-ion battery, a lithium-ion battery, and a lithium-ion battery stack. The outer packaging film for a lithium-ion battery has a layered structure that includes a thermal adhesive layer, a metal layer, and a gas barrier layer, wherein the thermal adhesive layer, the metal layer, and the gas barrier layer are arranged in this order, and wherein the layered structure further includes a self-extinguishing layer.
    Type: Application
    Filed: March 26, 2020
    Publication date: May 12, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Shinji YAMAMOTO, Yuri SUGIHARA
  • Publication number: 20220135787
    Abstract: Provided is a photocurable composition used for forming a resin layer of a concave-convex structure including a substrate and a resin layer provided on the substrate and having fine concavities and convexities formed on a surface thereof. A cured film of the photocurable composition has a surface free energy of 15 mJ/m2 to 40 mJ/m2 as measured based on the Kitazaki-Hata theory and a hardness of 0.05 GPa to 0.5 GPa as measured using a nanoindenter.
    Type: Application
    Filed: March 31, 2020
    Publication date: May 5, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Takashi ODA, Hisanori OHKITA, Hiroko WACHI, Shingo YAMAMOTO
  • Publication number: 20220139865
    Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.
    Type: Application
    Filed: March 2, 2020
    Publication date: May 5, 2022
    Applicants: Mitsui Mining & Smelting Co., Ltd., Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kei ANAI, Shinichi YAMAUCHI, Jung-Lae JO, Takahiko SAKAUE
  • Patent number: 11319403
    Abstract: The polyurethane resin composition contains, a polyisocyanate component containing p-MDI, a polyol component, an organic metal catalyst, and a reaction retardant represented by general formula (1) below, wherein the mole ratio of the reaction retardant relative to 1 mol of the organic metal catalyst is 0.50 or more and 2.50 or less. (in general formula (1), A represents an aliphatic ring or an aromatic ring, R1 represents a hydrocarbon group composing ring A, R2 represents an aliphatic hydrocarbon group bonded to ring A. R3 represents a hydrogen atom or alkyl group bonded to nitrogen atom included in ring A. R1 represents a hydrogen atom or carboxyl group bonded to ring A. m is 1 or 2, n is 0 or 1, and total of n and no is 2 or less.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: May 3, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Toshihiro Tanaka, Hiroshi Kanayama, Minoru Watanabe, Hiroki Inoue, Junji Saito
  • Patent number: 11311642
    Abstract: Disclosed are: a composition for hard tissue repair with excellent penetrability to an adherend such as a cancellous bone and excellent adhesion to an adherend, which comprises a monomer (A), a polymer powder (B) comprising 54% by mass or more of a polymer powder (b1) having a volume mean particle diameter of 27 to 80 ?m and a polymerization initiator (C); and a kit for hard tissue repair comprising members in which the components of the monomer (A), the polymer powder (B) and the polymerization initiator (C) contained in this composition for hard tissue repair are encased in three or more divided groups in an optional combination.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Kengo Goto, Shinya Aoki, Takashi Miura, Tetsuya Hamada, Ayako Bando
  • Patent number: 11314119
    Abstract: A lens includes: a substrate that includes a diffraction region where a plurality of protruding strips are coaxially and alternately formed. The diffraction region includes a first diffraction region and a second diffraction region that is located in at least a part of a region different from the first diffraction region. The second diffraction region includes: groove spaces lying between adjacent ones of the protruding strips with one another; and a communication space communicating between adjacent ones of the groove spaces with one another.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yoshinobu Okada, Eiichiro Hikosaka, Toshifumi Hino, Akifumi Aono, Akihiro Muramatsu
  • Patent number: 11317522
    Abstract: Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 26, 2022
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshimi Nakamura, Yoshinori Matsuura
  • Patent number: 11312857
    Abstract: A polymerizable composition of the present invention includes a polymerization reactive compound (A), and an internal release agent (B) including a polyether-modified silicone compound (b1) represented by General Formula (1) and a polyether-modified silicone compound (b2) represented by General Formula (2), in which the polymerization reactive compound (A) is one or more compounds selected from a polyiso(thio) cyanate compound, a poly(thio) epoxy compound, a polyoxetanyl compound, a polythietanyl compound, an alkyne compound, a poly(thi)ol compound, a polyamine compound, an acid anhydride, or a polycarboxylic acid compound.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Motoharu Oiki, Koju Okazaki
  • Patent number: 11311462
    Abstract: Provided are adhesive monomers for dental materials including compounds represented by the general formula (1) below, in which the core (X) and the terminal group (Y1) are bonded to each other directly or via the linking group (Z): X(Y1)n1a(Z—Y1)n1b(1) wherein n1a represents the number of terminal groups (Y1) directly bonded to the core (X), n1b represents the number of terminal groups (Y1) bonded to the core (X) via the linking group (Z), and the sum of n1a and n1b is equal to the valence of the core (X); the core (X), the linking group (Z) and the terminal group (Y1) are further defined. The adhesive monomers can enhance adhesive strength to the tooth in dental treatment, and impart high mechanical strength to cured products.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 26, 2022
    Assignees: MITSUI CHEMICALS, INC., KULZER GMBH
    Inventors: Yoko Kosugi, Akiko Matsumoto, Kazuhiko Yoshinaga, Michael Gerlach, Maria Lechmann-Dorn, Jutta Schneider, Andreas Utterodt
  • Patent number: 11312114
    Abstract: The present invention has an object of providing an ethylene/?-olefin/non-conjugated polyene copolymer composition excellent in the adhesive strength with a layer of a saponified ethylene/vinyl acetate copolymer; and the present invention relates to a laminate comprising a layer of a copolymer composition comprising 100 parts by mass of an ethylene/?-olefin/non-conjugated polyene copolymer (A) and one or more additives selected from the following (1) to (3), and a layer of the saponified ethylene/vinyl acetate copolymer (B). (1) 1.7 to 20 parts by mass of dicumyl peroxide and 2 to 20 parts by mass of a metal oxide; (2) 20 to 120 parts by mass of a hydrophilic fumed silica; and (3) 5 to 50 parts by mass of an ethylene/vinyl acetate copolymer (B).
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Yoshiharu Kikuchi, Kotaro Ichino
  • Patent number: 11312815
    Abstract: A polyurethane resin is a reaction product of a polyisocyanate component containing a bis(isocyanatomethyl)cyclohexane with a macropolyol component having a number average molecular weight of above 400 and 5000 or less. The shore A hardness thereof is 80 or less, a temperature at which a storage elastic modulus E? thereof shows 1×106 Pa is 200° C. or more, and a ratio (E?150/E?50) of a storage elastic modulus E?150 at 150° C. with respect to a storage elastic modulus E?50 at 50° C. is 0.1 or more and 1.4 or less.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Daisuke Hasegawa, Hidetaka Honda, Hiroshi Kanayama, Hirofumi Morita, Satoshi Yamasaki
  • Publication number: 20220124943
    Abstract: A cooling device, satisfying at least one of following (1) or (2): (1) comprising a casing and a flow channel that is disposed inside the casing, the casing comprising a metal portion and a resin portion that is bonded to at least a portion of the metal portion. (2) comprising a casing that comprises a metal, a flow channel that is disposed inside the casing, and a component that comprises a resin and is bonded to a surface of the casing.
    Type: Application
    Filed: May 15, 2020
    Publication date: April 21, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Takahiro TOMINAGA, Kazuki KIMURA
  • Publication number: 20220119998
    Abstract: A nonwoven fabric layered body includes a first nonwoven fabric layer including a crimped fiber (A), which is a fiber made of a thermoplastic polymer and which has an average crimp diameter of 800 ?m or less; and a hydrophilic agent.
    Type: Application
    Filed: March 4, 2020
    Publication date: April 21, 2022
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Yusuke SEKIOKA, Shohei SAITA, Kosuke OTA, Koichi SHIMADA, Taiichiro ICHIKAWA
  • Publication number: 20220120935
    Abstract: The present invention provides an optical member including an organic polymer. This optical member includes a surface A which has an area of 1 mm2 or more, and in which the flatness of a region having an area of 1 mm2, as measured by a non-contact type optical flatness meter, is 80 ?m or less.
    Type: Application
    Filed: February 4, 2020
    Publication date: April 21, 2022
    Applicants: MITSUI CHEMICALS, INC., AHIKO FINETEC, LTD.
    Inventors: Soichiro AHIKO, Daisuke TANAKA, Shinichi UMEDA
  • Patent number: 11306160
    Abstract: An object of the present invention is to provide a curable composition having sufficient polymerization properties even under acidic conditions. The curable composition of the present invention includes (a) a polymerizable monomer having an acidic group, (b) a transition metal compound, (c) at least one compound selected from benzoxazole compounds and benzothiazole compounds, and (d) a reducing agent.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: April 19, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Takenori Mitamura, Yoko Kosugi
  • Patent number: 11310910
    Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: April 19, 2022
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi, Kenshiro Fukuda
  • Patent number: D950066
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: April 26, 2022
    Assignee: MITSUI CHEMICALS, INC.
    Inventors: Takashi Yukita, Yuki Iwabuchi, Akira Hasegawa