Abstract: A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

Abstract: In a laminated iron core formed by laminating a plurality of iron core pieces, at least one of an inner circumferential portion or an outer circumferential portion of the iron core piece is provided with a connection recess part which is connected with a connection part of a caulking piece detachable in a radial direction from the connection recess part, an outer circumferential edge of the connection part has the same shape as an inner circumferential edge of the connection recess part, and a bottom portion of the connection recess part is not configured by a single straight line.

Abstract: A die apparatus includes an upper die and a lower die used for blanking a thin plate, a stripper which is formed on the upper die and is arranged between the upper die and the lower die, and a punch which blanks a part of the thin plate. The stripper or the lower die is provided with a protruding part which reduces flexure of the stripper occurring when a test punching is performed by actuating the punch without the thin plate.

Abstract: The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.

Abstract: The present invention relates to a polymerizable composition based on allyl carbonate monomers comprising: —from 40% to 90% of a first reactive component (component A) comprising at least 50% by weight of diethylene glycol bis(allyl carbonate); from 10% to 60% of a second reactive component (component B) consisting of at least one compound having general formula (II) or having general formula (III) from 0.4 to 10.0 phm (parts by weight per 100 parts of the total weight of components A and B) of at least one peroxide radical initiator. The present invention also relates to the polymerized products that can be obtained from the above composition, their preparation process and their use as organic glass.

Abstract: Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (?m) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (?m) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

Abstract: A polymerizable composition for an optical material according to the present invention includes one or two or more compounds selected from the group consisting of component (A): an ester compound having a specific structure and component (B): an ether compound having a specific structure, and a polymerizable compound.

Abstract: A layer-forming device that enables highly efficient layer formation and has a simplified configuration includes: a substrate feeding mechanism; a plasma-generating electrode; a space-partitioning wall; and a plurality of injectors. The plasma-generating electrode faces towards a feeding pathway of the substrate, and generates plasma using a reactive gas upon a supply of electric power. The space-partitioning wall is disposed between the feeding pathway and the plasma-generating electrode. A plurality of slit-shaped through-holes, through which radicals, ions generated from the plasma, or a portion of the plasma can pass, are formed at predetermined intervals in the space-partitioning wall.

Abstract: A process for producing a plastic lens includes a step of stirring and mixing a solution including a polymerization reactive compound in a preparation tank; a step of transferring the polymerizable composition obtained in the step from the preparation tank to a lens casting mold; a step of curing the polymerizable composition; and a step of obtaining a plastic lens molded product by separating the obtained resin from the lens casting mold. The step of transferring the polymerizable composition includes a step of re-mixing the polymerizable composition discharged from the preparation tank and injecting the polymerizable composition into the lens casting mold.

Abstract: An internal release agent includes at least one phosphodiester represented by the following general formula (1). In the formula, R1 and R2 independently represent a hydrocarbon group having 1 to 30 carbon atoms, which is optionally substituted with at least one hydroxyl group, and R3 represents an alkylene group having 2 to 4 carbon atoms. A plurality of R3's may be the same as or different from each other. M represents a hydrogen atom, an ammonium ion, an alkali metal ion, or a monovalent/divalent alkali earth metal ion, and n is an integer of 1 to 60.

Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.

Abstract: There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

Abstract: A layered body includes: a polymer film (A), the polymer film (A) including an organic piezoelectric material having a weight average molecular weight of from 50,000 to 1,000,000, having a standardized molecular orientation MORc at a reference thickness of 50 ?m of from 1.0 to 15.0 as measured by a microwave transmission molecular orientation analyzer, having a degree of crystallinity of from 20% to 80% as measured by a DSC method, and having an internal haze of 50% or less with respect to visible light; and a peelable protective film (B) that contacts one main face of the polymer film (A). The maximum indentation depth hmax on a face of the protective film (B) that contacts the polymer film (A) is from 53 nm to 100 nm as measured by a nanoindentation method.

Abstract: A method for manufacturing a rotor core includes detecting a height of a projecting portion formed on a lower die by a height detecting unit, and placing onto the lower die a core body in which a magnet insertion hole is formed such that the projecting portion is positioned in the magnet insertion hole when the height detecting unit has determined that the height of the projecting portion is within a set range. Additionally, the method includes bringing a permanent magnet in the magnet insertion hole into contact with an upper end of the projecting portion, and placing onto the core body a holding member after bringing the permanent magnet into contact with the upper end of the projecting portion. Melted resin is injected into the magnet insertion hole in which the permanent magnet has been inserted after placing the holding member onto the core body.

Abstract: The manufacturing method of a motor core includes attaching an ID code to a stack of blanked members in which a magnet insertion hole to fill with a resin material is formed, the ID code containing information in accordance with a type of the stack, reading the information from the ID code which is attached to the stack, and setting a mold condition based on the information read from the ID code. The mold condition includes at least one type of condition including: the resin material to be injected to the magnet insertion hole, an injection amount of the resin material, and a discharge position of the resin material. A mold device is controlled to inject the resin material to the magnet insertion hole in accordance with the mold condition.

Abstract: A method for manufacturing a semiconductor device of the present invention includes at least following four steps. (A) A step of preparing a structure having an adhesive film having a radiation-curable adhesive resin layer and one or two or more semiconductor chips adhered to the adhesive resin layer ; (B) a step of irradiating the adhesive film with a radiation to crosslink the adhesive resin layer; (C) a step of, after the step (B), confirming the operation of the semiconductor chips in a state of being adhered to the adhesive resin layer; and (D) a step of, after the step (C), picking up the semiconductor chips from the adhesive resin layer.

Abstract: A method for manufacturing a semiconductor device includes at least the following three steps: (A) A step of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer; (B) A step of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer; and (C) A step of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. The adhesive film includes a base material layer and an ultraviolet-curable adhesive resin layer provided on one surface side thereof. The adhesive resin layer includes an ultraviolet-curable adhesive resin, and a saturated electrostatic potential V1 of a surface of the adhesive resin layer after ultraviolet curing, which is measured using a specific method, is equal to or less than 2.0 kV.

Abstract: In a process for producing a (poly) sulfide compound represented by General Formula (2) of the present invention, thiol compounds represented by General Formula (1) are reacted with each other in the presence of a basic compound represented by General Formula (4) or General Formula (5) and sulfur.

Abstract: The purpose of the present invention is to provide: a vinyl chloride resin composition having exceptional impact resistance, processability, and heat resistance. The present invention provides: a resin composition that contains 3-15 parts by mass of a rubber-based impact-absorbing material and 0.1-10 parts by mass of a modified olefin wax per 100 parts by mass of a vinyl chloride resin. This resin composition satisfies the following requirements (I)-(III). (I) The chlorine content of the vinyl chloride resin is 55-75% by mass. (II) The glass transition temperature (Tg) in differential scanning calorimetry (DSC) of the rubber-based impact-absorbing material (B) is 0° C. or lower. (III) The modified olefin wax contains at least one polar group selected from halogens and carboxylic acid derivatives, and the polar group content is within the range of 0.1-50% by mass.

Abstract: A lubricant composition includes a lubricant base oil (A) having a kinematic viscosity at 100° C. of 1 to 10 mm2/s, and an ethylene/?-olefin copolymer (B) in which (B1) the peak top molecular weight is 3,000 to 10,000, (B2) the copolymer shows no melting peak, (B3) the value B is not less than 1.1 and (B4) the kinematic viscosity at 100° C. is 140 to 500 mm2/s. The lubricant composition has a kinematic viscosity at 100° C. of not more than 20 mm2/s, a peak top of molecular weight in the range of 3,000 to 10,000, and a weight fraction of components having a molecular weight not less than 20,000 of 1 to 10% relative to all components having a molecular weight not less than the molecular weight that gives the peak top.