Abstract: A cable harness for use in a backplane is provided. The cable harness includes a primary hybrid signal and power backplane connector having a primary housing. The primary housing includes a primary signal pair element and a primary power connector. The cable harness also includes a secondary hybrid signal and power backplane connector having a secondary housing. The secondary housing includes a secondary signal pair element and a secondary power connector. The primary hybrid signal and power backplane connector is connected with the secondary hybrid signal and power backplane connector with a signal cable. Each of the primary and secondary hybrid signal and power backplane connectors is electrically connected with a power supply unit each via a power cable.
Type:
Grant
Filed:
August 18, 2023
Date of Patent:
December 3, 2024
Assignee:
Molex, LLC
Inventors:
Tommy Lawrence, Robert Dillman, Michael David Rost, Jeffrey Alan Joniak
Abstract: Cable interface devices and mounting assemblies are provided for data storage assemblies. A data storage assembly can include media, such as a solid-state drive, a cable interface housing, and a cable interface housing locating feature. A cable interface device is mounted within the cable interface housing. The cable interface device includes a body extending in a first direction that defines an opening at the front side with a protruding connector of a solid-state drive extended through the opening. The cable interface device further includes electrically conductive contacts at least partially disposed inside the body and exposed to the opening. The cable interface device also includes a cable interface device locating feature positioned on, or defined by, the body and complementary in shape to the cable interface housing locating feature, to collectively locate the cable interface device within the cable interface housing.
Abstract: A gas sensor network system provides near real-time monitoring of fugitive emissions of VOC compounds in chemical plants and facilities. The present disclosure provides a sensor placement method which determines where to place sensors within a facility. The sensor placement method includes obtaining plant layout, gas composition, meteorological conditions and/or other types of information regarding a facility, determining the types of gas and ancillary sensors needed, and generating the minimum detection distances required based on the sensitivities of the sensors to the gas compounds involved. And, then calculating the minimal number of sensors required for each sensor type with optimized sensor locations to ensure best coverage of potentially leaking components within the facility.
Type:
Grant
Filed:
May 22, 2020
Date of Patent:
October 29, 2024
Assignee:
Molex, LLC
Inventors:
Eben Daniel Thoma, Alexander S. Chernyshov, Wenfeng Peng, Ling-Yin Lin, Jingxue Xu
Abstract: An electrical connector includes a plurality of signal terminal groups. Each signal terminal group includes a plurality of signal terminals having a first contact portion and a second contact portion, wherein the first contact portion has relatively more elasticity and the second contact portion has relatively less elasticity comparatively. The first contact portion and the second contact portion of each signal terminal are staggered with respect to each other. The connector includes a plurality of grounding members corresponding to the terminal groups, each having two side walls and a rear wall integrally constructed to surround a corresponding signal terminal group from at least three sides, two ground terminals integrally constructed positioned at a left side and a right side, third contact portions having relatively more elasticity, and fourth contact portions having relatively less elasticity, the third contact portion and the fourth contact portion are staggered with respect to each other.
Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver.
Abstract: A connector is provided with a half body part, each of which including a connector main body and a plurality of terminals arranged at a predetermined pitch and integrated with the connector main body by insert molding, a main body end part formed at both ends of the connector main body by coupling the connector main bodies of the half body parts arranged in parallel, and a reinforcing metal fitting integrated with the main body end part.
Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
Type:
Grant
Filed:
October 17, 2023
Date of Patent:
September 24, 2024
Assignee:
Molex, LLC
Inventors:
Kirk B. Peloza, Vivek Shah, Andrew Kolak, Dan Wenzel, Matt Cox, Ayman Isaac