Connector housing

- Molex, LLC
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Description

FIG. 1 is a rear-top-right perspective view of a connector housing showing our new design;

FIG. 2 is a left side view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is an enlarged view of FIG. 1 as identified by region 4 of FIG. 1;

FIG. 5 is a rear-top-left perspective cross-section view taken through line 5-5 of FIG. 1;

FIG. 6 is a front-top-left perspective a cross-section view taken through line 5-5 of FIG. 1;

FIG. 7 is a top cross-sectional view taken through line 5-5 of FIG. 1;

FIG. 8 is a bottom-right perspective cross-section view taken through line 8-8 of FIG. 1;

FIG. 9 is a second bottom-right perspective cross-section view taken through line 8-8 of FIG. 1; and,

FIG. 10 is a bottom view taken through line 8-8 of FIG. 1.

The uneven-length broken line immediately adjacent to the shaded area defines the bounds of the claimed design and forms no part thereof. The even-length broken lines depicting the remainder of the connector housing form no part of the claimed design. The even-length broken lines highlighting the region 4 represent the enlarged view and form no part of the claimed design. The uneven-length broken lines showing the cross-sectional lines represent the cross-sectional views and form no part of the claimed design.

Claims

The ornamental design for a connector housing as shown and described.

Referenced Cited
U.S. Patent Documents
6179477 January 30, 2001 De
6485192 November 26, 2002 Plotts et al.
D468269 January 7, 2003 Hwang
D468270 January 7, 2003 Hwang
6533603 March 18, 2003 Togami
D481676 November 4, 2003 Huang
D494930 August 24, 2004 Ishigami
6863448 March 8, 2005 Chiu et al.
7077686 July 18, 2006 Seo et al.
7194183 March 20, 2007 Thornton et al.
7226217 June 5, 2007 Benton et al.
D562327 February 19, 2008 Hsu
7361053 April 22, 2008 Boone et al.
D573949 July 29, 2008 Taira et al.
7416436 August 26, 2008 Togami
7559702 July 14, 2009 Fujiwara et al.
D610548 February 23, 2010 Ngo
D623138 September 7, 2010 Ngo
7963705 June 21, 2011 Staeber et al.
D647058 October 18, 2011 Ngo
D676384 February 19, 2013 Yang et al.
D687381 August 6, 2013 Yang et al.
9140862 September 22, 2015 Mccolloch
9176284 November 3, 2015 Megason et al.
9306306 April 5, 2016 Nishio et al.
9798092 October 24, 2017 Leigh et al.
D801930 November 7, 2017 Brandt et al.
10193268 January 29, 2019 Chow et al.
D887991 June 23, 2020 Liau
D936588 November 23, 2021 Hsiao
D948456 April 12, 2022 Yu
D950993 May 10, 2022 Beach
11387578 July 12, 2022 Karita et al.
D960104 August 9, 2022 Rodriguez
D987578 May 30, 2023 Choi
D1000390 October 3, 2023 Gurrapukonda
D1000391 October 3, 2023 Gurrapukonda
20140140666 May 22, 2014 Heimbuch
20150277070 October 1, 2015 Luo
20170153399 June 1, 2017 Rodriguez
20190027882 January 24, 2019 Wang
20200276948 September 3, 2020 Beska et al.
20200288589 September 10, 2020 Lavoie
20220039250 February 3, 2022 Amleshi
Foreign Patent Documents
111142196 May 2020 CN
212485602 February 2021 CN
201403155 January 2014 TW
D213693 September 2021 TW
2022037511 February 2022 WO
Other references
  • Hybrid Optical-Electrical Interconnects for Co-Packaged Optics, Posted Date Sep. 8, 2022 [Online], [Retrieved Dec. 20, 2023]. Retrieved From Internet, https://www.hpcwire.com/off-the-wire/molex-introduces-hybrid-optical-electrical-interconnects-for-co-packaged-optics/, Year: 2022, 3 pages.
  • 400G-QSFP-DD-500, Posted date Oct. 29, 2020 [Online], [Retrieved Nov. 20, 2023]. Retrieved From Internet, https://edgeoptic.com/products/400g-qsfp-dd/400g-qsfp-dd-500/ (Year: 2020), 5 pages.
  • Molex 1062680002, Posted Date Unknown [Online], [Retrieved Nov. 20, 2023]. Retrieved From Internet, https://www.molex.com/en-us/products/part-detail/1062680002 (Year: 2023), 2 pages.
Patent History
Patent number: D1047916
Type: Grant
Filed: May 23, 2022
Date of Patent: Oct 22, 2024
Assignee: Molex, LLC (Lisle, IL)
Inventors: Thomas R. Marrapode (Naperville, IL), Jesus Enrique Fung (Westmont, IL), Andrew Kolak (Villa Park, IL), Wenzong Chen (Naperville, IL), Sung-Ping Huang (Hsinchu), Chih Chung Wu (Hsinchu), Sheng-Pin Su (Hsinchu County), Chien-Lang Tai (Hsinchu)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/839,642
Classifications