Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.

Abstract: The hair cosmetic composition contains a solvent-containing silicone emulsion (A) which is prepared by emulsifying a mixture of high-molecular-weight polyorganosiloxane (a) obtained by emulsion polymerization and a volatile solvent (b), a surfactant (B) and water (C). The component solvent-containing silicone emulsion (A) is contained at a ratio of 0.1-10 wt % as a total amount of the high-molecular-weight polyorganosiloxane (a) and the volatile solvent (b). And, the component surfactant (B) is contained at a ratio of 0.05-40 wt %. Hair is provided with outstanding smoothness and softness, and particularly good finger combing when rinsing the hair.

Abstract: Provided is a curable polyorganosiloxane composition which advantageously forms a cured product suitable for LED or optical lens, wherein the cured product has excellent light transmission properties in a short wavelength region, i.e., in the blue to ultraviolet region and is unlikely to suffer yellowing due to exposure to heat.

Abstract: A curable polyorganosiloxane composition which has an (A) alkenyl group-containing polyorganosiloxane, a (B) polyalkylhydrogensiloxane and (C) a platinum group metal compound. The (A) alkenyl group-containing polyorganosiloxane which includes (A1) branched polyorganosiloxane comprising an SiO4/2 unit and an R3SiO1/2 unit with a molar ratio of R3SiO1/2 unit to SiO4/2 unit in the range of 1:0.8 to 1:3, and optionally an R2SiO unit and/or an RSiO3/2 unit, wherein at least three R per molecule are alkenyl groups, and optionally (A2) linear polyorganosiloxane having R bonded to a silicon atom, wherein at least two R per molecule are alkenyl groups, and 100 mol % of the R, excluding the alkenyl groups, are methyl groups. The (B) polyalkylhydrogensiloxane includes an SiO4/2 unit and an R3(CH3)2SiO1/2 unit with a molar ratio of R3(CH3)2SiO1/2 unit to SiO4/2 unit is in the range of 1.5:1 to 2.

Abstract: The present invention provides a silica-containing heat curing silicone rubber compound composition which can be produced safely and hardly suffers from inclusion of foreign substances. More specifically, when (A) 100 parts by weight of a polyorganosiloxane base polymer and (B) 1 to 100 parts by weight of a reinforcing silica are mixed together, (C) 0.05 to 80 ppm of an ionic liquid whose anionic component is bis(trifluoromethanesulfonyl)imide is added thereto.

Abstract: This is to provide a sealing agent for a display element which shows not only good elasticity, adhesiveness and durability which are characteristic features of the polyorganosiloxane, but also low moisture permeability after curing. It is a sealing agent for a display element comprising (A) 100 parts by weight of a linear polyorganosiloxane represented by the formula (I); (B) a polyorganohydrogen siloxane having hydrogen atoms bonded to a silicon atom in a number of exceeding 2 in the molecule in an amount where a number of hydrogen atoms bonded to a silicon atom per one alkenyl group existing in (A) being 0.5 to 10.0; (C) a compound of a platinum group metal in an amount where a platinum group metal atom being contained with 0.1 to 1,000 ppm by weight based on the amount of (A); and (D) 20 to 200 parts by weight of mica powder.

Abstract: The present invention relates to a thermal conductive silicone composition containing a siloxane which contains a hydrolytic group represented by the formula (1): where R1 is a group containing an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a siloxy represented by the following formula (2) or a monovalent hydrocarbon group having 6 to 18 carbon atoms, X is a divalent hydrocarbon group having 2 to 10 carbon atoms, a and b are integers of 1 or more, c is an integer of 0 or more, the sum of a+b+c is an integer of 4 or more, R3 is a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom, provided that R3s may be the same as or different from each other; R4 is a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a group selected from a methyl group, a vinyl group and R1, and d is an integer of 2 to 500.