Abstract: A silicone rubber composition contains: (A) 100 parts by weight of a dimethylpolysiloxane sequestered at both ends of the molecular chain thereof by a dimethylvinylsiloxy group; (B) 5 to 100 parts by weight of a dry silica, treated by a vinyl group-containing organosilicon compound and having a specific surface area of 50 m2/g or more; (C) 5 to 100 parts by weight of a copolymer of dimethylsiloxane and methylhydrogen siloxane; (D) platinum or a platinum compound as a curing agent in an amount of 1 to 1,000 ppm as platinum atom to the total amount of component (A) and component (C); and (E) triazole or a derivative of triazole, in an amount of 1 to 10,000 ppm to the total amount of (A) component and (C) component.

Abstract: The present invention provides a heat-curable silicone rubber composition having antistatic properties, even after secondary vulcanization at high temperatures. Specifically disclosed is a heat-curable silicone rubber composition which is obtained by adding 0.05 to 1000 ppm of (B) a poorly water-soluble or water-insoluble ionic substance whose anionic component is bis(trifluoromethanesulfonyl)imide, to 100 parts by weight of (A) a heat-curable silicone rubber.

Abstract: There is provided a silicone rubber composition whose compression set in a higher temperature range, particularly at 200° C. or higher, in a silicone rubber to be obtained is sufficiently suppressed. A heat curable silicone rubber composition contains: (A) 100 parts by mass of a polyorganosiloxane having an average degree of polymerization of 500 to 20,000 and having two or more alkenyl groups in a molecule; (B) 5 to 100 parts by mass of a filler; (C) an effective amount of an organic peroxide; and (D) 0.06 to 15 parts by mass of a hydrous cerium oxide and/or a hydrous zirconium oxide each having one absorption band in 3300 to 3500 cm?1 and two or more absorption bands in 1300 to 1700 cm?1 in infrared absorption spectrum measurement.

Abstract: A PG-coated product is produced by: producing a body by using PBN; providing a traceability display made of purified graphite in an arbitrary section of the body surface; and covering the body surface including the traceability display with a PG film. By setting the thickness of the PG film to 100 ?m or less, preferably 80 ?m or less, it is possible to provide transparency sufficient for reading the product serial number displayed on the body surface. Thus, this is a suitable way of displaying traceability. Because graphite does not adversely affect the physical properties of PBN and PG, the functions and durability intrinsic to the product are not impaired, even when the traceability display, which is formed by using graphite, is placed between the body surface made of PBN and the PG film.

Abstract: An ultraviolet-curable silicone resin composition including (A) a polyorganosiloxane having a mercaptoalkyl bonded to a silicon atom and having a viscosity at 23° C. of 20 to 25000 cP; (B) an organopolysiloxane having aliphatic unsaturated groups which includes (B1) a linear polyorganosiloxane having aliphatic unsaturated, and (B2) a branched organopolysiloxane which includes an SiO4/2 unit, an R?3SiO1/2 unit and an R?2SiO2/2 unit, and at least three of R? per one molecule are aliphatic unsaturated groups, provided that an amount of (B2) is an amount where a number of the aliphatic unsaturated groups in (B2) based on a total number of the aliphatic unsaturated groups in (B) is 50% or less; (C) a photoinitiator; and (D) a silane compound having an aliphatic unsaturated group.

Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalyst, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.

Abstract: One embodiment is related to a silicone composition for sealing a light emitting element, the composition comprising: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure; (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule; and (C) a hydrosilylation catalyst.

Abstract: There are provided a composition for silicone rubber foam, a manufacturing method of a silicone rubber foam, and a silicone rubber foam in which it is possible to control the foaming states. The composition for silicone rubber foam contains: (A) 100 parts by mass of polyorganosiloxane having a degree of polymerization of 4,000 to 10,000 and having two or more alkenyl groups at a content of 0.001 mmol/g or more and less than 0.3 mmol/g; an amount of polyorganohydrogensiloxane having an average of two or more Si-atom-bonded hydrogen atoms so that a molar ratio of the hydrogen atoms to the alkenyl groups in the (A) component is 0.001 to 5; 0.1 to 10 parts by mass of an organic foaming agent with a decomposition temperature of 50 to 250° C.; 5 to 200 parts by mass of silica powder; and a catalyst amount of a platinum-based metal catalyst activated with ultraviolet rays.

Abstract: The aqueous hair cleansing agent of the present invention comprises the following components (A) to (C): (A) an anionic surfactant; (B) side chain amino-modified organo polysiloxane having long chain alkyl at both ends represented by the following general formula (1) (R2R32)SiO—(R32SiO)x—(R3R4SiO)y—Si(R2R32)??(1) wherein formula (1), R2 represents linear or branched alkyl group having 12 to 30 carbon atoms 12 to C30, R3 represents substituted or non-substituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and R4 represents 3-aminopropyl group or N-(2-aminoethyl)-3-aminopropyl group, and x is an integer number of 1 to 2,000, y is an integer number of 1 to 100, and nitrogen content is 0.31 to 2 mass %; (C) a cationic galactomannan and water.

Abstract: Room temperature curable silicon group-containing polymer compositions comprising (A) a reactive silicon group-containing polymer obtained through a reaction between a polyoxypropylene polyol and a y-isocyanate propyltrialkoxysilane, (B) a curing catalyst, and (C) amino group-substituted alkoxysilane or a hydrolyzed and condensed product of an amino group-substituted alkoxysilane.

Abstract: A hair cosmetic composition which gives a feeling of light-sliding smoothness and a not-heavy feeling of not-unruliness to hair. The hair cosmetic composition contains a both terminally long-chain alkylamino group-modified polyorganosiloxane having a viscosity at 25° C. of 1,000 to 5,000,000 mPas, represented by the formula: MDxD?yM wherein M is a siloxy unit represented by the formula: R1R22SiO0.5, D is a siloxy unit represented by the formula: R22SiO, and D? is a siloxy unit represented by the formula: R2R3SiO, where R1 is an alkyl group having 12 to 50 carbon atoms, R2 is a substituted or unsubstituted hydrocarbon group having 1 to 6 carbon atoms, R3 is 3-aminopropyl group and/or N-(2-aminoethyl)-3-aminopropyl group, x is a value of 1 to 2,000, and y is a value of 1 to 50.

Abstract: This is to provide a curable polyorganosiloxane composition which gives a cured product excellent in cold resistance. This relates to a curable polyorganosiloxane composition which comprises (A) an alkenyl group-containing polyorganosiloxane comprising (A1) a linear polyorganosiloxane represented by the formula (1) (wherein Rs independently represent R1 or R2, and among Rs, at least two of which are R1s, R1s independently represent a C2-C6 alkenyl group, R2s independently represent a C1-C6 alkyl group, n is a number which makes a viscosity at 23° C.

Abstract: An ultraviolet-curable silicone resin composition including (A) a polyorganosiloxane having a mercaptoalkyl bonded to a silicon atom and having a viscosity at 23° C. of 20 to 25000 cP; (B) an organopolysiloxane having aliphatic unsaturated groups which includes (B1) a linear polyorganosiloxane having aliphatic unsaturated, and (B2) a branched organopolysiloxane which includes an SiO4/2 unit, an R?3SiO1/2 unit and an R?2SiO2/2 unit, and at least three of R? per one molecule are aliphatic unsaturated groups, provided that an amount of (B2) is an amount where a number of the aliphatic unsaturated groups in (B2) based on a total number of the aliphatic unsaturated groups in (B) is 50% or less; (C) a photoinitiator; and (D) a silane compound having an aliphatic unsaturated group.

Abstract: A curable polyorganosiloxane composition for use in an LED or optical lens, including: (A) an alkenyl group-containing polyorganosiloxane which contains a (A1) branched polyorganosiloxane including an SiO4/2 unit and an R3SiO1/2 unit, and optionally an R2SiO unit and/or an RSiO3/2 unit, wherein at least three R per molecule are vinyl groups, and optionally (A2) a linear polyorganosiloxane having R bonded to a silicon atom, wherein at least two R per molecule are vinyl groups, wherein 100 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) a polyalkylhydrogensiloxane including an SiO4/2 unit and an R3(CH3)2SiO1/2 unit, the polyalkylhydrogensiloxane having the formula [R3(CH3)2SiO1/2]8[SiO4/2]4 or [R3(CH3)2SiO1/2]10[SiO4/2]5, wherein each R3 represents a hydrogen atom, and (C) a platinum-vinylsiloxane complex. The composition having desirable light transmission properties, and is unlikely to suffer yellowing due to exposure to heat.

Abstract: A room-temperature-curable polyorganosiloxane composition includes: 100 parts by mass of polyorganosiloxane capped with hydroxyl groups at termini and having a viscosity (23° C.) of 0.02 to 1000 Pa·s; 1 to 200 parts by mass of a filler capable of imparting flame retardancy; 0.1 to 10 parts by mass of a partially hydrolyzed condensate of a silane compound of R1aSi(OR2)4-a wherein R1('s) and R2('s) independently represent a substituted/unsubstituted univalent hydrocarbon group, and ‘a’ represents a numerical value of 0?a?0.2 on average; 0.1 to 10 parts by mass of a silane compound of R32Si(OR4)2 wherein R3's and R4's) independently represent a substituted/unsubstituted univalent hydrocarbon group, or its partially hydrolyzed condensate having 3 or less Si atoms in its molecule; 0.

Abstract: The present invention provides cosmetic products, such as makeup cosmetics and skin care cosmetics, which have a good water-proof and perspiration resistance and an excellent use feel, such as spreadability, at the time of application and long-wearing capabilities. Specifically, a cosmetic product containing a silicone resin, composed of (A) and (B) described below: R3SiO1/2 unit??(A) RSiO3/2 unit??(B) at a proportion of (A):(B) being 1:1 to 1:7 and having a softening point of 50 to 110° C., wherein R represents a substituted or unsubstituted monovalent hydrocarbon group.

Abstract: This organic electroluminescent element sealing composition contains an addition reaction curing type silicone composition which is liquid at normal temperature and has a curing temperature of 100 degrees C. or below and a moisture content of 400 ppm or less. The addition reaction curing type silicone composition contains (A) polyorganosiloxane having an average of 0.2 to 5 alkenyl groups bonded to silicon atoms in one molecule, (B) polyorganohydrogensiloxane having at least two or more hydrogen atoms bonded to silicon atoms in one molecule, and (C) a platinum-based catalyst. The organic electroluminescent element sealing composition can prevent deterioration of the organic electroluminescent element and can provide the organic light-emitting device having a good light-emitting property for a long period.

Abstract: A hair cosmetic contains (A) a side chain amino-modified organopolysiloxane having long chain alkyl at both ends at 0.01 to 15 weight %, (B) one type or two or more types of cationic surfactant selected from tertiary amine compounds at 0.1 to 15 weight %, (C) a higher alcohol having 12 to 28 carbon atoms and one hydroxy group at 0.1 to 20 weight %, (D) a polydimethylsiloxane at 0.01 to 15 weight %, and (E) water, the side chain amino-modified organopolysiloxane having long chain alkyl at both ends having a nitrogen atom content of 0.31 to 2 weight %.

Abstract: A silicone composition for sealing a light emitting element includes: (A) a vinyl group-containing organopolysiloxane having a three-dimensional network structure represented by an average unit formula: (SiO4/2)a(ViR2SiO1/2)b(R3SiO1/2)c (where Vi represents a vinyl group, R's are identical or different substituted or unsubstituted monovalent hydrocarbon groups other than alkenyl groups, and a, b, and c are positive numbers satisfying that a/(a+b+c) is 0.2 to 0.6 and b/(a+b+c) is 0.001 to 0.2); (B) an organohydrogenpolysiloxane which has at least two hydrogen atoms, each hydrogen atom being bonded to a silicon atom per molecule, the organohydrogenpolysiloxane being contained in such an amount that an amount of a hydrogen atom bonded to a silicon atom is 0.3 to 3.0 mol per 1 mol of a vinyl group bonded to a silicon atom in the component (A); and (C) a hydrosilylation catalyst (catalytic amount), wherein a coefficient of linear expansion of the composition after curing is 10×10?6 to 290×10?6/° C.

Abstract: Disclosed is a heat dissipating material which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating material contains (A) 100 parts by weight of a silicone gel cured by an addition reaction having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein the heat dissipating material is interposed between the heat-generating electronic component and the heat dissipating body.