Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.

Abstract: The present invention is an addition reaction type polyorganosiloxane composition which can be cured rapidly at room temperature. A cured product of the composition exhibits high elongation, excellent stress relaxation properties and good reliability under conditions of high temperature and high humidity and exhibits excellent reliability in cold/heat cycling. The composition contains: (A1) a straight chain polysiloxane containing alkenyl groups at both terminals; (B1) a straight chain polysiloxane containing SiH groups at both terminals; (B2) a crosslinkable polyorganohydrogensiloxane; one or more types selected from the group consisting of (A2) a straight chain polysiloxane containing an alkenyl group at one terminal and (B3) a straight chain polysiloxane containing a SiH group at one terminal; and (C) a platinum-based catalyst.

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4?(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

Abstract: There is provided a silicone rubber composition that has improved moldability, in particular, extrusion moldability, while ensuring that a cured product obtained therefrom has sufficient strength. The silicone rubber composition contains: (A) a 100 part by mass base polymer consisting of (A1) a polyorganosiloxane diol whose viscosity at 25° C. is 1 to 100 Pas and (A2) a polyorganosiloxane whose viscosity at 25° C. is 0.2 to 40000 Pas, with a ratio of (A1) being 20 to 100% by mass to the whole (A), the base polymer having a viscosity of 5 to 20000 Pas at 25° C. and having an alkenyl group content of 0.001 to 0.3 mmol/g; (B) a 10 to 50 part by mass silica powder whose specific surface area is 50 to 400 m2/g; (C) a 1 to 10 part by mass organosilazane; and (D) a catalytic amount of a curing agent.

Abstract: A resin composition which includes: (A) a polyorganosiloxane that contains a mercaptoalkyl group bonded to a silicon atom and has a viscosity at 23° C. of 20 to 3,000 cP; (B) a polyorganosiloxane containing an aliphatic unsaturated group; (C) a photoreaction initiator; (D) a chemically surface-treated silica having a BET specific surface area of 50 to 250 m2/g and a pH of 5.0 to 9.0; and (E) a polyoxyalkylene glycol, and/or a derivative of the polyoxyalkylene glycol. (B) includes: a linear polyorganosiloxane; and optionally a branched polyorganosiloxane. The ratio of mercaptoalkyl groups in (A) to the total aliphatic unsaturated groups in (B) is 0.45 to 2.00, the content of (D) is 0.5 to 26 parts relative to 100 parts by mass of (B), the content of (E) is 0.001 to 1.0 mass % relative to the total mass of (A) to (E), and the viscosity at 23° C. is 500 to 100,000 cP.

Abstract: A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3?a?0.6, 0?b?0.1, 0.4?c?0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.

Abstract: This flame-retardant polyorganosiloxane includes (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule and whose viscosity (25° C.) is 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane which includes Q unit and has 1.5 or more alkenyl groups on average, and in which a molar ratio of alkoxy groups to alkyl groups is 0.030 or less; (C) an amount of a polyorganohydrogensiloxane, whose average degree of polymerization is 10 or more, and in which a Si—H content is 5.0 mmol/g or more, in which Si—H/(a total of alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A flame-retardant polyorganosiloxane composition capable of reducing an amount of a platinum-based metal compound is provided.

Abstract: The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more.

Abstract: A heat-curable polyorganosiloxane composition which includes (A) an alkenyl group-containing linear polyorganosiloxane of the formula (I) below, wherein Ra represents a C2-C6 alkenyl and Rb represents a C1-C6 alkyl or a phenyl; (B1) a linear polyorganohydrogensiloxane of the formula (II) below, wherein Rc is hydrogen and Rd represents a C1-C6 alkyl or a phenyl; (B2) a cyclic polyorganohydrogensiloxane including Re2HSiO1/2, wherein Re represents a hydrogen atom or C1-C6 alkyl group, and SiO4/2, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, wherein the formula (I) and the formula (II) are as follows:

Abstract: A heat-curable addition-reactive type silicone rubber composition which gives a molded article having excellent antistatic property, heat resistance, compression set property. The heat-curable addition-reactive type silicone rubber composition includes: (A) a mixture containing a heat curable addition-reactive silicone rubber and a curing agent, (B) an ionic liquid in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass, (C) a heterocyclic compound containing nitrogen atoms in an amount of 30 to 3000 ppm relative to 100 parts by mass of the component (A), wherein the curing agent is not included in the 100 parts by mass.

Abstract: The present invention provides a heat-curable silicone rubber composition capable of giving a stable and high antistatic property for a long time without degrading inherent properties of a silicone rubber, such as thermal stability. The heat-curable silicone rubber composition includes: (A) 100 parts by mass of a mixture of a polyorganosiloxane obtained by polymerization by using an alkali metal hydroxide as a polymerization catalyst and by neutralization, and a curing agent, and (B) 50 to 1000 ppm of an ionic substance containing an anion and a cation, and being a bis(trifluoromethanesulfonyl)imide as the anion.

Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4?(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

Abstract: There is provide an addition-curable silicone composition from which a silicone cured product having excellent adhesiveness and external appearance, being able to protect metal, in particular, silver, from corrosion, and having less shrinkage and change in hardness due to heat, is obtained. The addition-curable silicone composition contains: 100 parts by mass of a polyorganosiloxane having alkenyl groups; an amount of a polyorganohydrogensiloxane such that an amount of Si—H groups is 0.9 to 3.0 mol relative to 1 mol of the alkenyl groups; a catalyst amount of a hydrosilylation reaction catalyst; 0.01 to 10 parts of an adhesiveness imparting agent; and 0.001 to 0.015 parts by mass, in terms of metal atoms of (R3COO)kM (where M is Ce, Fe, Cr, La, Nd, Pr or Sm, k is 2, 3 or 4, and R3 represents a substituted or unsubstituted hydrocarbon group having 4 to 17 carbon atoms).

Abstract: The invention is directed to a silicone compound of the general formula (I) and a personal care composition comprising the silicone compound (I) as described herein, and to personal care applications containing the same and processes of making the silicone compound.

Abstract: The invention is directed to phenyl-containing functional polysiloxanes and polycarbonate-polysiloxane copolymer compositions made therefrom having improved optical clarity and better low temperature impact resistance.

Abstract: The invention provides dam compositions which can give cured products serving as dam materials exhibiting appropriate hardness and adhesion with respect to adherends and which are preferably such that the dam materials also have inconspicuous joints with fillers. The invention also provides image displays manufactured with the compositions. An image display sealant dam composition includes (A) a polyorganosiloxane having a mercaptoalkyl group bonded to a silicon atom, and having a viscosity at 23° C.

Abstract: There are provided a composition for silicone rubber foam, a manufacturing method of a silicone rubber foam, and a silicone rubber foam in which it is possible to control the foaming states. The composition for silicone rubber foam contains: (A) 100 parts by mass of polyorganosiloxane having a degree of polymerization of 4,000 to 10,000 and having two or more alkenyl groups at a content of 0.001 mmol/g or more and less than 0.3 mmol/g; an amount of polyorganohydrogensiloxane having an average of two or more Si-atom-bonded hydrogen atoms so that a molar ratio of the hydrogen atoms to the alkenyl groups in the (A) component is 0.001 to 5; 0.1 to 10 parts by mass of an organic foaming agent with a decomposition temperature of 50 to 250° C.; 5 to 200 parts by mass of silica powder; and a catalyst amount of a platinum-based metal catalyst activated with ultraviolet rays.

Abstract: Provided is a resin composition with high dielectric insulation properties that has a dielectric constant of at least 20, a dielectric tangent of 0.1 or less, outstanding insulation properties (at least 1012 ?·cm), and for use in electrical power, communication devices, and the like. A resin composition with high dielectric insulation properties comprises a constituent (A), which is 100 parts by mass of a polymer material that acts as a dispersion medium for constituent (B), and a constituent (B), which is 100-3000 parts by mass of a perovskite complex oxide powder comprising secondary particles formed by the mutual bonding of primary particles through sintering and represented by the formula: ABO3.

Abstract: An image display sealant dam composition including (A) a polyorganosiloxane having a mercaptoalkyl bonded to a silicon; (B) an aliphatic unsaturated group-containing polyorganosiloxane including an aliphatic unsaturated group-containing linear polyorganosiloxane (B1), and a branched polyorganosiloxane (B2) having SiO4/2 units, R?3SiO1/2 units and R?2SiO2/2 units, and optionally having R?SiO3/2 units, at least three R? groups per molecule of the branched polyorganosiloxane (B2) are aliphatic unsaturated groups, the proportion of the number of the aliphatic unsaturated groups in (B2) to the total number of the aliphatic unsaturated groups in (B) is more than 50% and not more than 95%; (C) a photoreaction initiator; (D) a silane compound; and (E) an MQ resin having a weight average molecular weight of 2,000 to 2,500,000 and/or an MDQ resin having a weight average molecular weight of 2,000 to 1,000,000.

Abstract: A method of preparing a curable polyorganosiloxane composition including kneading a uniform mixture of an alkenyl group-containing polyorganosiloxane, a polyorganohydrogensiloxane, and a platinum group metal compound, and defoaming the kneaded mixture under reduced pressure, the alkenyl group-containing polyorganosiloxane includes a linear polyorganosiloxane of the formula (I): R is R1 or R2, and at least two Rs are R1; R1 is C2-C6 alkenyl; R2 is C1-C6 alkyl; and n is a value that yields a viscosity at 23° C. of 10 to 10,000 cPs, a branched polyorganosiloxane containing SiO4/2 and R?3SiO1/2 units, optionally a R?2SiO and/or a R?SiO3/2, R? represents a monovalent aliphatic or alicyclic, and at least three R? groups per molecule are alkenyls, the alkenyl group-containing polyorganosiloxane having a weight ratio of the branched to linear polyorganosiloxane of 1 to 5; and a number of hydrogens bonded to a silicon atom of the polyorganohydrogensiloxane exceeds 2.