Abstract: A probe head includes at least one guide plate, and a plurality of probes respectively inserted through a plurality of guide holes of the guide plate and including at least one probe pair. The probe pair is formed of two probes. The head portion and/or tail portion of each probe of the probe pair includes a reduced cross-section segment, and at least one adjacent segment adjacent to the reduced cross-section segment. The reduced cross-section segment is smaller in cross-sectional area than the adjacent segment, so that each probe of the probe pair includes at least one recess formed by the reduced cross-section segment. The reduced cross-section segment is at least partially located in the guide hole. Accordingly, impedance matching between the probe head as a whole and the device under test is effectively improved, return loss during transmission of test signals is reduced, and testing accuracy is ensured.

Abstract: A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.

Abstract: A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.

Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.

Abstract: A method of determining probing parameters for a probe system to test a DUT includes defining a SD-OD relation dataset according to the probe type of the probing assembly of the probe system and the contact pad type of the DUT, and providing the controller a skate distance value, for which the probe tip is set to skate after contacting the contact pad, or an overdrive value, for which the probing assembly and the DUT are set to be relatively moved after the probe tip contacts the contact pad, and a probe target position or a present probe position, to obtain both the skate distance value and the overdrive value and a position for positioning the probing assembly and the DUT to each other, thereby conveniently and quickly obtaining the required probing parameters for operating the probe system to test the DUT for great and consistent testing performance.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A probe device includes a main body, a probe having a supporting portion protruding from the main body and a probe end disposed at an end of the supporting portion, and a protective cover disposed on the main body. The protective cover is switchable between a protection position and a non-protection position while remaining connected to the main body and is selectively positionable at either position. When at the protection position, a protective portion of the protective cover shields at least one side of the probe end to block external forces approaching the probe end from at least one direction. When at the non-protection position, the protective cover is spaced away from the probe end. Accordingly, the device protects the probe end while eliminating the need for additional storage space and reducing the risk of loss of the protective cover and its associated components.

Abstract: A method for adjusting position of probing base comprises steps of providing a probing machine comprising a probing holder, a first probing base having a first probing needle comprising a plurality of first probing bodies wherein two adjacent tips of the first probing bodies h a first pitch, and a second probing base having a second probe comprising a plurality of second probing bodies in which two adjacent tips of the second probing bodies has a second pitch, thereafter, grabbing the first probing base and connecting the first probing base to the probing holder, acquiring first image with respect to the plurality of first probing bodies through visual identification module, and finally, adjusting roll angle of probing tips of the plurality of first needle bodies according to the first image. Alternatively, the present invention further provides a probing machine using the method for testing DUTs having different pitches.

Abstract: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

Abstract: A fixture device for IC substrate testing includes a base defining length, width and height axes, and two positioning rods disposed on the base to extend along the length axis, and each formed downward from their top surface's edge with a main step including clamping and supporting surfaces, wherein at least one positioning rod is slidable on the base along the width axis to adapt to a substrate's width, and fixable to the base so that the substrate is clamped by the two positioning rods. The clamping surfaces of the two positioning rods, at least one of which is formed from resilient material, face each other, and clamp the substrate, making its lower surface's non-tested contact region on the supporting surfaces, and tested contact region have a gap from the base. This invention meets testing requirements of substrates of various sizes and multiple substrates, having high testing flexibility.

Abstract: A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.

Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole to provide compensating impedance between the guide-hole pair, improve impedance matching when probing the device under test with the probe pair, and reduce return loss between the probe head and the device under test.

Abstract: The present invention provides a quick coupling probe card, utilized to test circuit board. The quick coupling probe card comprises a base, a coaxial connector, mechanical connector, and probe holding part, wherein the base has a first surface and a second surface corresponding to the first surface, the coaxial connector arranged on the base has one end above the first surface, and is coupled to the test machine for transmitting the high frequency signal, the mechanical connector is arranged on the first surface for coupling to the test machine, and is closer to a center of the base than the coaxial connector, and the probe holding part, arranged on the second surface and utilized to couple to the coaxial connector, has one end connected to a high frequency probe corresponding to one specific kind of the different kinds of pitches.

Abstract: The present invention provides a testing method, a probe head, a probe card and a probe system for a micro-bump test. The testing method includes providing a DUT with first and second bump units for transmitting power or ground signal and test signal, respectively, wherein the first bump unit has micro-bumps grouping together; placing the DUT on a chuck; providing the probe card wherein the interval between the head portions of the adjacent probes is larger than or equal to the width of one micro-bump; and testing the DUT by using the head portions of the probes to contact the bump units of the DUT, respectively. That lowers the manufacturing difficulty and cost of the probe card, and the difficulty of using it on the machine for testing, prevents the DUT from too complicated design, and prevents the adjacent probes from collision and the resulting short circuit or interference.

Abstract: A circuit board detection device includes a base, a stage assembly, a first gantry support, and a first probe assembly. The stage assembly is arranged on the base and includes a linear drive module, a rotary motor, and a platform. The platform is configured to carry a circuit board and can be driven by the linear drive module to move along a first axial direction. The platform can also be driven by the rotary motor to rotate relative to a first rotation axis. The first gantry support is fixed on the base and includes a first beam. The first beam extends along a second axial direction perpendicular to the first axial direction to span over the linear drive module, and includes a first probe guide rail. The first probe assembly is arranged on the first probe guide rail to be movable along the second axial direction.

Abstract: A probe unit includes first and second probes of equal length. A probe body of at least one of the probes has a slot extending along a longitudinal direction thereof to define two slats. A total cross-sectional area of the slats of the first probe is greater than that of the second probe. Alternatively, the probe body of the second probe is solid, and the total cross-sectional area of the slats of the first probe is greater than the cross-sectional area of the solid probe body of the second probe. The slats are shaped in such a way that a contact force of the first probe is greater than that of the second probe, thereby meeting testing requirements of conductive contacts of different sizes on an electronic device under test, while reducing problems of different probe tip wear rates and excessive probe mark area ratio differences.

Abstract: A contact probe defined with widths and thicknesses along first and second horizontal axes respectively and cross-sectional areas perpendicularly to a vertical axis includes a body portion for being curved at least along the first horizontal axis while disposed between upper and lower die units, a probe tip for contacting a contact pad of a device under test, and a probe tail including a contact end portion with a contact end surface for contacting a contact pad of an interface board. The contact end portion is at least partially smaller in width and thickness than the body portion, so that the contact end surface has an area smaller than a cross-sectional area of the body portion, thereby capable of stable contact with the contact pad of the interface board and prevented from exceeding its edge, obtaining stable contact resistance to ensure test results with stable and high accuracy.

Abstract: A test system and method for performing high-voltage testing on a device under test (DUT), which provides a gas monitoring device and a control unit of the test system. The high-voltage test probe card system is equipped with synchronized pressure and flow monitoring functionality. A pressure and flow sensor is arranged upstream of a gas space of a probe card assembly, in coordination with the gas monitoring device and the control unit of the test system, thereby forming a complete and closed-loop control mechanism.

Abstract: A probe head includes a probe seat, vertical probes, and coaxial probes. The vertical probes are slidably inserted in guiding holes of the probe seat, and have lower end portions for contacting electrically conductive contacts of a device under test. The coaxial probe includes a probe main body provided from the outside to the inside thereof coaxially with an outer conductor, a dielectric layer and an inner conductor in order, and a tip unit disposed at a lower end portion of the probe main body and including first and second tips electrically connected with the outer and inner conductors respectively for contacting electrically conductive contacts of the device under test. The coaxial probes include first and second loopback probes composing a loopback probe pair for being configured as a part of a loopback test path. As a result, the present invention meets the high-frequency loopback test requirements.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.