Abstract: A new type of calibration standards is presented, which has the uncalibrated peer-ports terminated to matching impedances such as 50?. Terminating peer-ports increases calibration accuracy since the calibration process is less affected by the undesired crosstalk in the error-network that is being calibrated or in the calibration standards themselves. Using the disclosed peer-terminated standards were shown to have less calibration errors over using conventional dual standards. This is applicable to any electrical measurement and calibration, where the calibration standards are designed to simultaneously connect multiple ports.

Abstract: A circuit board detection device includes a base, a stage assembly, a first gantry support, and a first probe assembly. The stage assembly is arranged on the base and includes a linear drive module, a rotary motor, and a platform. The platform is configured to carry a circuit board and can be driven by the linear drive module to move along a first axial direction. The platform can also be driven by the rotary motor to rotate relative to a first rotation axis. The first gantry support is fixed on the base and includes a first beam. The first beam extends along a second axial direction perpendicular to the first axial direction to span over the linear drive module, and includes a first probe guide rail. The first probe assembly is arranged on the first probe guide rail to be movable along the second axial direction.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.

Abstract: A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.

Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.

Abstract: A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

Abstract: A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.

Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.

Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

Abstract: A display method of a display apparatus is provided. The method includes: displaying, on a touch display apparatus, a first window and a second window that overlap with each other, where the first window is smaller than the second window; displaying a first image on the first window, and displaying a second image on the second window, where the second image is an image captured by the camera module in real time; displaying the first image on the second window and displaying the second image on the first window according to the first touch instruction; and displaying the first image on the first window and displaying the second image on the second window according to the second touch instruction.

Abstract: A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.