Abstract: The present invention provides a testing method, a probe head, a probe card and a probe system for a micro-bump test. The testing method includes providing a DUT with first and second bump units for transmitting power or ground signal and test signal, respectively, wherein the first bump unit has micro-bumps grouping together; placing the DUT on a chuck; providing the probe card wherein the interval between the head portions of the adjacent probes is larger than or equal to the width of one micro-bump; and testing the DUT by using the head portions of the probes to contact the bump units of the DUT, respectively. That lowers the manufacturing difficulty and cost of the probe card, and the difficulty of using it on the machine for testing, prevents the DUT from too complicated design, and prevents the adjacent probes from collision and the resulting short circuit or interference.

Abstract: A circuit board detection device includes a base, a stage assembly, a first gantry support, and a first probe assembly. The stage assembly is arranged on the base and includes a linear drive module, a rotary motor, and a platform. The platform is configured to carry a circuit board and can be driven by the linear drive module to move along a first axial direction. The platform can also be driven by the rotary motor to rotate relative to a first rotation axis. The first gantry support is fixed on the base and includes a first beam. The first beam extends along a second axial direction perpendicular to the first axial direction to span over the linear drive module, and includes a first probe guide rail. The first probe assembly is arranged on the first probe guide rail to be movable along the second axial direction.

Abstract: A probe unit includes first and second probes of equal length. A probe body of at least one of the probes has a slot extending along a longitudinal direction thereof to define two slats. A total cross-sectional area of the slats of the first probe is greater than that of the second probe. Alternatively, the probe body of the second probe is solid, and the total cross-sectional area of the slats of the first probe is greater than the cross-sectional area of the solid probe body of the second probe. The slats are shaped in such a way that a contact force of the first probe is greater than that of the second probe, thereby meeting testing requirements of conductive contacts of different sizes on an electronic device under test, while reducing problems of different probe tip wear rates and excessive probe mark area ratio differences.

Abstract: A contact probe defined with widths and thicknesses along first and second horizontal axes respectively and cross-sectional areas perpendicularly to a vertical axis includes a body portion for being curved at least along the first horizontal axis while disposed between upper and lower die units, a probe tip for contacting a contact pad of a device under test, and a probe tail including a contact end portion with a contact end surface for contacting a contact pad of an interface board. The contact end portion is at least partially smaller in width and thickness than the body portion, so that the contact end surface has an area smaller than a cross-sectional area of the body portion, thereby capable of stable contact with the contact pad of the interface board and prevented from exceeding its edge, obtaining stable contact resistance to ensure test results with stable and high accuracy.

Abstract: A test system and method for performing high-voltage testing on a device under test (DUT), which provides a gas monitoring device and a control unit of the test system. The high-voltage test probe card system is equipped with synchronized pressure and flow monitoring functionality. A pressure and flow sensor is arranged upstream of a gas space of a probe card assembly, in coordination with the gas monitoring device and the control unit of the test system, thereby forming a complete and closed-loop control mechanism.

Abstract: A probe head includes a probe seat, vertical probes, and coaxial probes. The vertical probes are slidably inserted in guiding holes of the probe seat, and have lower end portions for contacting electrically conductive contacts of a device under test. The coaxial probe includes a probe main body provided from the outside to the inside thereof coaxially with an outer conductor, a dielectric layer and an inner conductor in order, and a tip unit disposed at a lower end portion of the probe main body and including first and second tips electrically connected with the outer and inner conductors respectively for contacting electrically conductive contacts of the device under test. The coaxial probes include first and second loopback probes composing a loopback probe pair for being configured as a part of a loopback test path. As a result, the present invention meets the high-frequency loopback test requirements.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: A method, a system, and a media related to system drift verification are provided. In the method, first measuring with one or more modified measurement parameters is performed, to generate a first measured result of the modified measurement parameter. Second measuring with one or more modified measurement parameters is performed in response to measuring with the modified measurement parameter, to generate a second measured result of the modified measurement parameter. The second measured result with the first measured result is compared. The modified measurement parameter is different from the original measurement parameter. A compared result of the first measured result and the second measured result is used for verifying a system drift.

Abstract: A probe seat includes upper and lower die units, and a supporting structure including supporting pillars disposed between the upper and lower die units. The upper die unit includes upper through holes penetrating through upper and lower surfaces thereof. The lower die unit includes lower through holes penetrating through upper and lower surfaces thereof. An accommodating space is formed around the supporting pillars and between the upper and lower die units for probes to be inserted through the respective upper through holes, the accommodating space, and the respective lower through holes. The supporting pillars include upper supporting pillars protruding out of the lower surface of the upper die unit, and lower supporting pillars protruding out of the upper surface of the lower die unit and in contact with the upper supporting pillars respectively. As such, the probe seat has great structural strength, thereby uneasily deformed.

Abstract: A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.

Abstract: A testing method for a micro-bump test includes providing a device under test arranged with a first bump unit for transmitting the power or ground signal and a second bump unit for transmitting the test signal, the first and second bump units both having grouping micro-bumps, or one of them only having a single relatively larger bump, the micro-bumps of the second bump unit including a selected micro-bump and a dummy micro-bump; providing a test apparatus including a chuck and a probe card whose probes' body portions are substantially the same in size; placing the device under test on the chuck, and testing it by the probes. The probe card is lowered in manufacturing difficulty, cost and difficulty in usage on a testing machine, and prevented from different probe wear loss and the resulting poor probe planarity problem. The device under test is prevented from too complicated design.

Abstract: A probe system for double side probing includes a chuck having a through hole for a substrate including a DUT to be disposed on the chuck and defined with an edge part supported by the chuck and a central part located correspondingly to the through hole, upper and lower probe devices, including electrical and optical probe devices, disposed above and below the through hole respectively for testing the DUT on top and bottom sides of the substrate, and a support device disposed on the side of the chuck opposite to the electrical probe device. When an electrical probe of the electrical probe device contacts the top or bottom side of the substrate, a supporter of the support device contacts the other side and is located adjacent to the electrical probe with the substrate located therebetween to resist the force from the electrical probe to avoid substrate deformation.

Abstract: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

Abstract: A method of determining probing parameters for a probe system to test a DUT includes defining a SD-OD relation dataset according to the probe type of the probing assembly of the probe system and the contact pad type of the DUT, and providing the controller a skate distance value, for which the probe tip is set to skate after contacting the contact pad, or an overdrive value, for which the probing assembly and the DUT are set to be relatively moved after the probe tip contacts the contact pad, and a probe target position or a present probe position, to obtain both the skate distance value and the overdrive value and a position for positioning the probing assembly and the DUT to each other, thereby conveniently and quickly obtaining the required probing parameters for operating the probe system to test the DUT for great and consistent testing performance.

Abstract: A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.