Patents Assigned to MPI Corporation
  • Patent number: 7679382
    Abstract: A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: March 16, 2010
    Assignee: MPI Corporation
    Inventors: Fu-Chin Lu, Chi-Chong Chien
  • Patent number: 7595651
    Abstract: A cantilever-type probe card includes a circuit board, a grounding block electrically connected to a zero potential, signal probes, and at least one grounding probe connected to the grounding block. Each signal probe has a probing tip, a connection portion affixed to the circuit board, and a front arm defined between the connection portion and the probing tip. The front arm of each of the signal probes is suspended in the grounding block and spaced from the grounding block at a predetermined pitch.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: September 29, 2009
    Assignee: MPI Corporation
    Inventors: Wei-Cheng Ku, Chih-Hao Ho, Shu-Kan Lin
  • Publication number: 20090212801
    Abstract: A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition.
    Type: Application
    Filed: May 1, 2009
    Publication date: August 27, 2009
    Applicant: MPI Corporation
    Inventors: Wei-Cheng Ku, Kuan-Chun Chou
  • Patent number: 7579857
    Abstract: An electrical contact device of a probe card includes a base and probes on the base. The base has a top side with a cavity thereon, and the cavity has sidewalls connected to the top side. Anchored portion are provided on the sidewalls of the cavity. Each of the probes has a first end and a second end, wherein the first end is connected to the anchored portion, and the second end is extended toward the cavity respectively.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: August 25, 2009
    Assignee: MPI Corporation
    Inventor: Chih-Chung Chen