Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.

Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.

Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.

Abstract: A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.

Abstract: A probe head includes a probe base, a film, and a probe assembly. The probe base includes first, second, and third guiding boards. The second guiding board is fixed between the first and third guiding boards. The film is fixed to the probe base and has a hole. The probe assembly passes through the first, second, and third guiding boards and the hole, and includes a probe and an outer spring sleeve. The probe has a tip passing out through the third guiding board. The outer spring sleeve is sleeved at the exterior of the probe and has a spring area and a plurality of non-spring areas. The spring area is disposed between adjacent two of the non-spring areas. One of the non-spring areas has a bonding section mounted to the probe and retained between the third guiding board and the film.

Abstract: A temperature controlling equipment includes a connection head of a fluid output device, an isolation hood, a drying chamber and a dry air source. The connection head of the fluid output device has an output nozzle and a first fluid output pipe. The isolation hood has a hood body and a second fluid output pipe. The hood body defines a working space. The output nozzle is communicated with the working space. The second fluid output pipe is communicated with the working space and the first fluid output pipe. The first fluid output pipe and the second fluid output pipe have a connection interface in between. The connection interface is at least partially located in the drying chamber. The dry air source is communicated with the drying chamber and is configured to provide a dry air to the drying chamber.

Abstract: A test machine includes a base, a testing platform, a probe platform, a control lever, a temporary positioning mechanism and a damper. The testing platform connects with the base and carries a device under test. The probe platform connects with the base and moves along a longitudinal direction. The probe platform connects with a probe. The control lever connects with the base and the probe platform which is driven by the control lever to move along the longitudinal direction. The temporary positioning mechanism connects with the control lever and temporarily holds the probe platform and the control lever at a specific position. The damper connects with the base. When a distance between the probe and the DUT is shorter than a buffering distance, the damper abuts against the control lever or the probe platform to reduce a velocity of the probe moving towards the DUT.

Abstract: A fluid discharge device includes a discharge tube, an outer tube and at least one baffle. The discharge tube has a discharge port. The discharge tube has an end surface adjacent to the discharge port. The outer tube is sleeved outside the discharge tube. The outer tube has at least one passage. The passage is configured to flow a clean dry air. The passage has an outlet. The baffle is disposed outside the outlet. When the clean dry air passes through the outlet, at least part of the clean dry air is blocked by the baffle and is directed to the end surface of the discharge tube.

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Abstract: A probe device includes a spring probe and a probe seat. The spring probe includes a needle and a spring sleeve sleeved onto the needle and provided with at least one spring section and at least one non-spring section. The probe seat includes a plurality of dies stacked together and at least one guiding hole through which the spring probe is inserted. An upper edge and a lower edge of the guiding hole of the probe seat are arranged corresponding in position to the non-spring section of the spring sleeve. As a result, the spring probe is prevented from getting jammed due to the contact of the spring section of the spring sleeve with the upper and lower edges of the guiding hole.

Abstract: An integrating sphere cover covering an integrating sphere having a light receiving entrance is provided and includes a first casing and a fixing assembly. The first casing partially covers the integrating sphere and includes a first opening where the light receiving entrance passes. A curvature radius of the first casing is greater than that of the integrating sphere. The fixing assembly is disposed at the first casing, and the first casing is fixed to the integrating sphere through the fixing assembly. The first casing or the fixing assembly includes a nozzle. When the first casing covers the integrating sphere, a first interval communicating with the first opening and the nozzle is between the first casing and the integrating sphere to form a first hollow intermediate layer. An air flow passes through the first hollow intermediate layer via the nozzle and the first opening. An integrating sphere module is also provided.

Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.

Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: A temperature control system and method are provided. The system includes a first channel, a second channel, a heating element, a DUT chamber, a converter, a first PID controller, and at least one switching regulator. The heating element is disposed downstream of the first and the second channels to heat the first air from the first channel or the second air from the second channel according to an input power so as to provide mixing air with a temperature into the DUT chamber. The converter converts an AC power to a DC power. The first PID controller provides a first input signal according to a first set point and an amount of power consumed by the heating element. The input power is adjusted by the switching regulator to drive the heating element according to the first input signal. Thus, the use of electrical power is more efficient.

Abstract: An electrical testing device includes a base having two parallel first rails, a platform provided on the base, a support provided between the first rails, a test arm, a rotary table provided on the test arm, a plurality of holders provided on the rotary table, and a plurality of probe sets respectively provided on the holders. The support has a second rail provided thereon, and is moveable relative to the base and the platform. The test arm is provided on the second rail and above the platform, wherein the test arm is moveable along with the support, and is also movable relative to the support. The rotary table is moveable or rotatable relative to the test arm. The holders are moveable along with the rotary table, and are also moveable or rotatable relative to the rotary table. The probe sets are moveable along with the holders.

Abstract: A probe card for transmitting power signals from a tester to two devices under test (DUTs) is provided, which includes two signal pins, two power conducting circuits, and at least a matching part. The signal pins are made of conductive materials, wherein one end of the signal pin contacts one of the DUTs. The two power conducting circuits are electrically connected to the two signal pins respectively to transmit the power signals to the DUTs. One of two ends of the power conducting circuits is connected to the signal pins; the other end of the power conducting circuits is electrically connected to the tester. The matching part is electrically connected to the power conducting circuit in parallel to lower a resistance of the power conducting circuit below a predetermined value, or to lower a percentage error of resistance of the power conducting circuit below a predetermined percentage error.

Abstract: A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer.

Abstract: A probe module includes a substrate having a through hole, and at least four probe-needle rows arranged on the substrate. The probe-needle rows are arranged from a first side to a second side along a first direction. Each of the probe-needle rows has at least two needles arranged along a second direction. Each of the needles has a contact segment and an arm segment having an included angle with the contact segment. An end of the arm segment is connected to the substrate, and the other end of which extends toward the through hole to connect the contact segment. The lengths of the contact segments of the needles of each of the probe-needle rows are the same. The included angles of the needles of the probe-needle rows along the first direction are gradually increased from the first side to the second side.