Abstract: A package board that includes an inductor layer having: a first magnetic layer including first magnetic particles and a resin; an inductor wiring that functions as an inductor in the first magnetic layer; and a second magnetic layer on at least one surface of the first magnetic layer, including second magnetic particles that are higher in average flatness than the first magnetic particles and a resin, the second magnetic particles having a shape where the dimension in a direction along the main surface of the second magnetic layer is longer than the dimension in the thickness direction of the second magnetic layer.

Abstract: A radio-frequency module includes a first base made of a first semiconductor material; a second base that is made of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit; a third base including a transmission filter circuit; and a module substrate having a main surface on which the first base, the second base, and the third base are arranged. The first base is joined to the main surface via an electrode. The second base is arranged between the module substrate and the first base in a sectional view and is joined to the main surface via an electrode. At least part of the first base is overlapped with at least part of the second base and at least part of the third base in a plan view.

Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.

Abstract: A solid-state battery that includes: a solid battery laminate including a battery constituent unit including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed at least between the positive electrode layer and the negative electrode layer; a positive-electrode-side external electrode electrically connected to the positive electrode layer, the positive-electrode-side external electrode including at least one element selected from the group consisting of Cu, Ag, Ni, Ti, Cr, Pt, and Pd; and a negative-electrode-side external electrode electrically connected to the negative electrode layer.

Abstract: A ladder filter includes series arm resonators, parallel arm resonators, and first and second inductors. Second ends of the parallel arm resonators are connected in common to each other and are connected to a ground potential. A first end of each of the first and second inductors is connected to a series arm, and second ends thereof are connected in common to each other and are connected to the ground potential with a capacitor therebetween.

Abstract: A fluid control device includes piezoelectric pumps and a substrate. The substrate includes dielectric base members. Each of the dielectric base members has a recess and a through-hole. Each of the dielectric base members is laminated such that the recesses of the dielectric base members partially overlap and communicate with each other. A portion of the recesses not overlapping with the dielectric base member serve as a first opening and a second opening, respectively, to the outside. The first opening and the second opening open in opposite directions in the lamination direction. The first opening and the second opening have shapes that may be fit to each other. The piezoelectric pump is on the dielectric base member to communicate with the through-hole, and the piezoelectric pump is on the dielectric base member to communicate with the through-hole.

Abstract: A power amplifier circuit includes a differential amplifier circuit configured to amplify a radio-frequency signal, a transformer disposed on an output side with respect to the differential amplifier circuit and including a primary winding and a secondary winding, and a dispersion circuit coupled to a midpoint of the primary winding of the transformer and configured to operate as an adjustment circuit. The dispersion circuit is configured to adjust, based on a supply voltage controlled in accordance with the envelope of the radio-frequency signal, a bias (bias current or bias voltage) to be supplied to the differential amplifier circuit.

Abstract: A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, internal electrode layers on the dielectric layers, first and second main surfaces opposed to each other in a lamination direction, first and second lateral surfaces opposed to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and first and second end surfaces opposed to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction, and a first external electrode on the first main surface and a second external electrode on the second main surface, in which a portion or all of the internal electrode layers are not connected to any of the first external electrode or the second external electrode.

Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass. A glass-free conductive paste including a nickel powder, a metal powder, such as tin, having a melting point of lower than about 500° C., and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. The ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. The thermosetting resin is thermally decomposed or burned such that little or none remains, and the nickel powder and metal powder having a melting point of lower than about 500° C. are sintered to form a unified sintered metal body.

Abstract: An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.

Abstract: An electronic component includes a base body and a glass film covering an outer surface of the base body. The glass film has a groove extending on an outer surface of the glass film. The groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. The bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. In addition, the bottom portion of the groove has an arc shape in the specific section.

Abstract: A coil component comprises a first wire including a winding portion wound around a winding core portion of a core, a first end portion electrically connected to a terminal electrode provided in a first flange portion, and a first extended portion connecting the winding portion and the first end portion. In a first direction, the first end portion is positioned on a first side with respect to a central axis of the winding core portion, and a first boundary portion which is a boundary portion between the first extended portion and the winding portion is positioned on a second side with respect to the central axis. A corner of the winding core portion is positioned between the first boundary portion and the first end portion in a circumferential direction. A gap is interposed between the first extended portion and the corner.

Abstract: A radio frequency circuit supports a first power class and a second power class whose maximum output power is lower than that of the first power class, and includes: a first power amplifier; and a variable load matching circuit connected to an output end of the first power amplifier. Under a condition that the first power class is applied, a first power supply voltage is supplied to the first power amplifier, and a load impedance viewed from the first power amplifier is adjusted to a first impedance by the variable load matching circuit. Under a condition that the second power class is applied, a second power supply voltage is supplied to the first power amplifier, and the load impedance viewed from the first power amplifier is adjusted to a second impedance by the variable load matching circuit.

Abstract: A first radiation conductor layer is provided in a multilayer body. A second radiation conductor layer is provided in or on the multilayer body, is located above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in an up-down direction. A first floating conductor has a shape surrounding at least a part of a periphery of the first radiation conductor layer when viewed in the up-down direction, is located on a same layer as or above the first radiation conductor layer and on a same layer as or below the second radiation conductor layer in the up-down direction, and is not electrically connected to any conductor present in or on the multilayer body. A second floating conductor has a shape surrounding at least a part of a periphery of the second radiation conductor layer.

Abstract: An electronic device includes: an exterior case that has a first case and a second case engaged with each other; a first lead wire and a second lead wire extended from the inside of the exterior case; a first grommet through which the first lead wire is penetrated; and a second grommet through which the second lead wire is penetrated, where the first grommet is inserted in a first notch formed in the first case, the second grommet is inserted in a second notch formed at a position that substantially faces the first notch in the second case, and a continuous O-ring is interposed between the first case and the second case and between the first grommet and the second grommet.

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

Abstract: A multilayer coil component includes a body formed by multiple insulating layers stacked in a direction of stacking and having first and second end surfaces opposite each other in a length direction, first and second main surfaces opposite each other in a height direction, perpendicular to the length direction, and first and second lateral surfaces opposite each other in a width direction, perpendicular to the length direction and to the height direction; a coil inside the body and including multiple coil conductors electrically coupled together; and a first outer electrode extending from at least part of the first end surface of the body to part of the first main surface and electrically coupled to the coil. The direction of stacking of the insulating layers and the direction of the coil axis of the coil are parallel with the first main surface, which is the mounting surface, of the body.

Abstract: A common mode choke coil includes an element body of laminated insulating layers; electrically insulated first and second coils in the element body; first and second outer electrodes on the element body electrically connected to ends of the first coil; and third and fourth outer electrodes on the element body electrically connected to ends of the second coil. The first coil includes first to third coil conductors on first to third insulating layers. The second coil includes fourth to sixth coil conductor on fourth to sixth insulating layers. The second and third coil conductors are electrically connected via a via conductor overlapping at outer ends of the conductors. A dummy conductor overlapping the via conductor is provided on at least one of the first, fourth, fifth, and sixth insulating layers other than between the second and third insulating layers and electrically insulated from all the coil conductors.

Abstract: A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3?SR4<SR2 is satisfied.

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.