Abstract: To reduce the height in a thickness direction of a mounting substrate. A radio-frequency module includes a mounting substrate, an electronic component, first and second chip components. The electronic component is mounted on a first main surface of the mounting substrate. The first and second chip components are mounted on a second main surface of the mounting substrate. Each of the first and second chip components includes a substrate and a circuit portion. The substrate has first and second main surfaces facing each other. The circuit portion is formed on the first main surface side of the substrate. The second main surface of the substrate in each of the first and second chip components is exposed. A material of the substrate in the first chip component is the same as a material of the substrate in the second chip component.

Abstract: A switching power supply device includes a power conversion circuit including input and output capacitors, a switching element, and an inductor, and a common-mode choke coil that is between a DC power supply and the power conversion circuit and includes a core material around which first and second windings are linearly wound and aligned by being turned in one direction. The power conversion circuit and the common-mode choke coil constitute a noise equalization circuit that is an electric closed circuit including a low-frequency band blocking filter including an input capacitor and a mutual inductance of the common-mode choke coil, and a high-frequency band blocking filter including the mutual inductance and a stray capacitance of the common-mode choke coil. The noise equalization circuit cancels out noise generated by a switching operation of the switching element in each of a low-frequency band and a high-frequency band different from the low-frequency band.

Abstract: An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.

Abstract: A bandpass acoustic wave filter device includes an IDT electrode and a dielectric film disposed on a piezoelectric substrate including a LiNbO3 layer, and an acoustic wave resonator is defined by the IDT electrode. The acoustic wave resonator utilizes the Rayleigh wave, and a response of an SH wave excited by the acoustic wave resonator is outside a pass band of the acoustic wave filter device.

Abstract: An acoustic wave device includes a substrate including a piezoelectric layer, first and second resonators on the substrate, and a shared reflector. The second resonator is located on the substrate adjacent to the first resonator and has different frequency characteristics than the first resonator. The shared reflector is located on the substrate between the first resonator and the second resonator and is a reflector for both the first resonator and the second resonator. The first resonator includes a first interdigital transducer electrode with electrode fingers positioned with a first pitch. The second resonator includes a second interdigital transducer electrode with electrode fingers positioned with a second pitch. A lower limit frequency of a stop band of the shared reflector is between a lower limit frequency of a stop band of the first resonator and a lower limit frequency of a stop band of the second resonator.

Abstract: Acoustic resonators, filters, and methods. An acoustic resonator includes a substrate, a piezoelectric plate, and a diaphragm including a portion of the piezoelectric plate spanning a cavity in a substrate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second sets of interleaved interdigital transducer (IDT) fingers extending from first and second busbars respectively. The interleaved IDT fingers extend onto the diaphragm. Overlapping portions of the interleaved IDT fingers define an aperture of the acoustic resonator. First and second dielectric strips are on the front surface of the piezoelectric plate. Each dielectric strip has a first portion under the IDT fingers in a respective margin of the aperture and a second portion extending into a gap between the respective margin and the respective busbar.

Abstract: A piezoelectric resonator unit that includes a base, a cover, and a laminated structure disposed between the base and the cover. The laminated structure includes a piezoelectric resonator having a piezoelectric layer with a pair of principal surfaces facing each other, and a pair of excitation electrodes disposed on respective surfaces of the pair of principal surfaces so as to face each other with the piezoelectric layer therebetween, a semiconductor layer laminated on a side of one of the pair of principal surfaces of the piezoelectric layer, and a pair of measurement electrodes provided on the semiconductor layer. The pair of measurement electrodes measure signals based on temperature of the piezoelectric resonator through the semiconductor layer.

Abstract: There is disclosed acoustic resonators and filter devices. An acoustic resonator device includes a piezoelectric plate, and an interdigital transducer (IDT) formed on a front surface of the piezoelectric plate. The IDT includes interleaved fingers. At least one of the interleaved fingers includes a first layer adjacent the piezoelectric plate and a second layer over the first layer, wherein a width of the first layer is constant, and wherein a width of the second layer varies along a length of the at least one interleaved finger.

Abstract: A filter device includes first and second filters respectively having first and second passbands, the second passband being in a frequency range higher than the first passband. The first and second filters are commonly connected to a common terminal. In the first filter, multiple parallel arm resonators define a parallel connection unit in which the parallel arm resonators are connected in parallel with no serial arm resonators interposed therebetween. The parallel arm resonators in the parallel connection unit include first and second parallel arm resonators having anti-resonant frequencies different from each other. In combined impedance-frequency characteristics of the parallel arm resonators in the parallel connection unit, at least one anti-resonant frequency other than a highest anti-resonant frequency is equal to or higher than 2f1min?f2min and equal to or lower than 2f1max?f2max.

Abstract: Methods and devices to mitigate time varying impairments in sensors are described. The application of such methods and devices to pressure sensors facing time varying parasitic capacitances due to water droplets is detailed. Benefits of auto-zeroing technique as adopted in disclosed devices is also described.

Abstract: Provided is a secondary battery where a positive electrode includes a first covered part covered with a positive electrode active material layer and a positive electrode active material non-covered part on a positive electrode foil, and a negative electrode includes a second covered part covered with a negative electrode active material layer and a negative electrode active material non-covered part on a negative electrode foil, one or both of the positive electrode active material non-covered part and the negative electrode active material non-covered part have a surface formed by bending toward the central axis of the wound structure and overlapping each other, and the surface is joined to the positive electrode current-collecting plate or the negative electrode current-collecting plate.

Abstract: A module (101) includes a substrate (1) having a first main surface (1a) and including wiring, a first component (31) having a circuit surface (31a), mounted on the first main surface (1a) such that the circuit surface (31a) faces the first main surface (1a), and having a ground terminal (10) on the circuit surface (31a), a first sealing resin (6a) disposed to cover the first main surface (1a) and the first component (31), and a heat dissipation portion (5) provided along an upper surface of the first sealing resin (6a). The wiring is connected to the ground terminal (10), and the module further includes a heat conducting member (7) connecting the wiring and the heat dissipation portion (5).

Abstract: An acoustic resonator device includes a conductor pattern formed on a surface of a piezoelectric plate. The conductor pattern includes a first busbar, a second busbar, and n interleaved parallel fingers of an interdigital transducer (IDT), where n is a positive integer. The fingers extend alternately from the first and second busbars. A first finger and an n'th finger are at opposing ends of the IDT. The conductor pattern also includes a first reflector element proximate and parallel to the first finger and a second reflector element proximate and parallel to the n'th finger. A center-to-center distance pr between the first reflector element and the first finger and between the second reflector element and the n'th finger is greater than or equal to 1.2 times a pitch p of the IDT and less than or equal to 1.5 times the pitch p.

Abstract: Filters and methods of making filters are disclosed. A filter device includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between a surface of the substrate and a back surface of the piezoelectric plate. A conductor pattern on a front surface of the piezoelectric plate includes interdigital transducers (IDTs) of a plurality of resonators and a plurality of conductors to connect the plurality of resonators in a ladder filter circuit, the plurality of conductors including adjacent first and second conductors. A portion of the piezoelectric plate between the first and second conductors is removed.

Abstract: An acoustic wave device further includes a piezoelectric layer and first and second electrodes, first and second divided resonators, and a support substrate. The support substrate includes first and second energy confinement layers. The first energy confinement layer overlaps at least a portion of a first region of the piezoelectric layer. The second energy confinement layer overlaps at least a portion of a second region of the piezoelectric layer. The support substrate includes a wall portion between the first and second energy confinement layers.

Abstract: An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.

Abstract: An inductor that includes a body having a magnetic portion containing a magnetic powder and a first resin; a coil that is encapsulated in the body and includes a winding portion formed by winding a conductor and a pair of lead-out portions that extend from the winding portion; and a pair of outer electrodes to which at least end portions of the lead-out portions are connected at surfaces of the body. The outer electrodes each includes an electrically conductive resin layer and a first cover layer arranged on the electrically conductive resin layer. The electrically conductive resin layers each contain an electrically conductive powder and a second resin and a plurality of electrically conductive metal portions composed of the same material as the first cover layers are contained inside the electrically conductive resin layers.

Abstract: Circuits and methods that enable stable and reliable “hot switching” from one antenna to another without turning RF power to the antennas OFF in wireless RF systems during at least some transmission events. One embodiment comprises an RF switch circuit including a common port configured to pass an RF signal, a plurality of switch arms each coupled to the common port and including an associated port, and a shunt termination impedance selectively couplable to the common port through a switch. Another embodiment comprises a method for switching an RF signal applied to a common port of a switch from a first switch arm initially in an ON state to a second switch arm initially in an OFF state, including: setting the second switch arm to the ON state, and then setting the first switch arm to the OFF state.

Abstract: A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.

Abstract: A resonance device that includes a MEMS substrate including a resonator, an upper lid that seals a vibration space of the resonator, and a ground portion positioned between the MEMS substrate and the upper lid, the ground portion being extended to an inside of the upper lid and electrically connected to the upper lid.