Abstract: A power supply device includes an input terminal to which a direct-current power supply can be connected, an output terminal, a power converter circuit, a first switch placed between the input terminal and a power converter circuit, a second switch placed between the power converter circuit and the output terminal, and a controller configured to control the first switch and the second switch to switch between an on-state and an off-state. For cutting off an electrical connection between the input terminal and the output terminal, the controller is configured to switch the first switch into an off-state and thereafter switch the second switch into an off-state.

Abstract: A multilayer inductor includes a body. The body includes, within a magnetic member having a stack of magnetic layers containing iron powder, a coil including a coil conductor wound around and a through conductor that is electrically connected to the coil conductor and exposed in a bottom surface of the magnetic member. The multilayer inductor also includes an outer electrode that is on the through conductor and is electrically connected to the through conductor; and an exterior resin layer on the bottom surface of the magnetic member. The outer electrode includes protrusions that protrude perpendicular to a stacking direction of the magnetic layers in an upper end portion on a far side from the through conductor and a lower end portion on a near side from the through conductor in the stacking direction. The exterior resin layer extends across between the protrusions in the upper and lower end portions.

Abstract: Circuitry and methods for an improved gate driver circuit for power converters. The improved gate driver circuit substantially reduces propagation delay and transition losses in the floating-gate side of the gate driver circuit. One embodiment includes an inverter having an input configured to receive a state transition signal and an output configured to be coupled to a control input of a switching device. The inverter includes a first NFET having a control gate configured to be coupled to the state transition signal, a second NFET having a control gate coupled to the output of a reference circuit, and a PFET having a control gate configured to be coupled to the state transition signal, wherein the output of the inverter is a node between the conduction channels of the first NFET and the second NFET and the conduction channels of the first NFET, second NFET, and PFET are coupled in series.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

Abstract: A ground plane is disposed on or in an inner layer of a dielectric substrate. Moreover, a feed line is disposed on or in the dielectric substrate. A first antenna element and a second antenna element are supported on the dielectric substrate. The first antenna element and the second antenna element include a first radiating element and a second radiating element connected to the feed line, respectively, and are disposed on a same side when seen from the ground plane. With a height of the ground plane being a reference, a top portion of the second antenna element is located higher than a top portion of the first antenna element. There is provided an antenna device of which the band can be expanded and of which the internal space of the casing can be effectively utilized.

Abstract: An electronic device and a method for manufacturing an electronic device. The electronic device includes: a board equipped with a pair of differential transmission lines, each line of the pair having an opening extending between two line terminals; and a capacitor module that includes: a base; and two 3D capacitors supported by the base, each 3D capacitor comprising two capacitor terminals respectively connected to the two line terminals of one line of the pair of transmission lines.

Abstract: An inductor component includes an element assembly; a coil inside the element assembly and helically wound along an axis; and first and second outer electrodes in the element assembly and electrically connected to the coil. The element assembly has insulating layers stacked along the axis. The coil has pieces of coil wiring stacked along the axis and via wiring extending along the axis and connecting the pieces of coil wiring adjacent in a direction of the axis. The pieces are each wound along a plane, are electrically connected in series in a helix, and have first and second coil wirings at a respective endmost on one and other sides in a direction parallel to the axis and respectively connected to the first and second outer electrodes. An end surface on the one side has an area smaller than that of an end surface on the other side.

Abstract: A power amplifier that includes a substrate, and an emitter layer, a base layer, and a collector layer laminated in this order on a major surface of the substrate includes an electrical insulator provided adjacent to the emitter layer, an emitter electrode provided between the substrate and both the emitter layer and the electrical insulator, a base electrode electrically connected to the base layer, and a collector electrode electrically connected to the collector layer. The emitter electrode, the electrical insulator, and the base layer are provided between the substrate and the base electrode in a direction perpendicular to the major surface of the substrate.

Abstract: A filter includes a series resonator or a longitudinally coupled resonator on a path connecting a first input-and-output terminal and a second input-and-output terminal, and parallel resonators each connected between the path and a ground. Among the parallel resonators, a second parallel resonator and a first parallel resonator are connected in parallel without another resonator being interposed therebetween. An IDT electrode of the first parallel resonator includes different electrode finger pitches. An average of all the electrode finger pitches of the IDT electrode of the first parallel resonator is larger than an average of all the electrode finger pitches of an IDT electrode of the second parallel resonator.

Abstract: A fluid control device includes a first main plate, a second main plate, a driving body, a frame body, a plurality of support bodies, a plurality of gaps, a side wall member, a valve film, and a fixing member. A pump chamber is formed by a flat plate part consisting of the first main plate, the frame body, and the plurality of support bodies, and the second main plate and the side wall member. The valve film is disposed on a main surface of the first main plate on the side where the pump chamber is located. The valve film has an annular shape and fixed to the first main plate by the fixing member so that an outer end thereof is a movable end. The outer end of the valve film overlaps the plurality of gaps located between the plurality of support portions in plan view.

Abstract: An antenna module includes feed elements each having a flat plate shape and a ground electrode arranged opposite the feed elements. The feed element radiates a radio wave of a first frequency band. The feed element radiates a radio wave of a second frequency band that is higher than the first frequency band. In a plan view of the feed element, the distance from the center of the feed element to an end portion of the ground electrode in a first direction is shorter than or equal to ½ of a free space wavelength of a radio wave radiated from the feed element. A feed point of the feed element is arranged at a location shifted in a second direction from the center of the feed element, and the second direction is different from the first direction.

Abstract: A method of de-embedding a feed line is shown. The method includes measuring network parameters of a multilayered planar substrate and obtaining network parameters of a feed line using a short-open-calibration (SOC) according to an ABCD-matrix. An “a” block of the ABCD-matrix includes a first matrix multiplied by a transpose of a first short-circuit current. The first matrix is an inverse of a difference of an open-circuit current and a second short-circuit current. A “c” block of the ABCD-matrix includes the open-circuit current multiplied by the “a” block. The method includes de-embedding the network parameters of the feed line from the network parameters of the multilayered planar substrate to obtain microwave circuit network parameters and, responsive to the microwave circuit network parameters being within or not within a specified range, respectively approving or rejecting customer shipment of the microwave circuit.

Abstract: The radio frequency module includes a module substrate, an electronic component disposed on a main surface, a resin member covering at least part of the main surface and at least part of a side surface of the electronic component, and a metal shield layer that is formed on a surface of the resin member and is set to a ground potential. The electronic component has a top surface in contact with the metal shield layer, a bottom surface facing the main surface, a circuit portion formed at a position closer to the bottom surface than to the top surface, and a metal layer formed between the metal shield layer and the circuit portion. The metal layer is a barrier metal.

Abstract: An elastic wave device includes a piezoelectric layer including a first main surface and a second main surface facing the first main surface, an acoustically reflective layer stacked on the first main surface of the piezoelectric layer, an excitation electrode disposed on the piezoelectric layer, and a support layer. The acoustically reflective layer overlaps at least the excitation electrode in a plan view of the piezoelectric layer from the side of the second main surface. The support layer surrounds the acoustically reflective layer in a plan view of the piezoelectric layer from the side of the second main surface.

Abstract: An acoustic wave device includes a dielectric film covering an IDT electrode. The IDT electrode includes first and second edge regions and first and second high acoustic velocity regions. The first and second edge regions are low acoustic velocity regions. The first and second high acoustic velocity regions are on outer sides of an intersecting width region where first and second electrode fingers are adjacent to each other in an acoustic wave propagation direction. A thickness of the dielectric film on the first and second edge regions is greater than that of the dielectric film on the first and second high acoustic velocity regions.

Abstract: A transducer includes a first connection portion connecting a first tip and a second tip to each other. The first connection portion is surrounded by a split slit connecting a center of the first tip, a center of a base, and a center of the second tip, the first tip, and the second tip.

Abstract: An inductor component includes an element body having a rectangular parallelepiped shape; an inner wire inside the body and including a coil spirally wound along a coil axial direction; a first outer electrode electrically connected to one end portion of the inner wire and on one of the end surfaces of the body; and a second outer electrode electrically connected to the other end portion of the inner wire and on the other end surface of the body. In a section parallel to the coil axial direction and orthogonal to a direction in which the inner wire extends, the inner wire has four corners, and a part of the inner wire at either end in a direction parallel to the coil axial direction includes the corner that is adjacent to a corner portion of the body and has a shape different from shapes of the remaining three corners.

Abstract: A switching power supply device includes a power conversion circuit including input and output capacitors, a switching element, and an inductor, a common-mode choke coil between a DC power supply and the power conversion circuit, and a multilayer circuit board on which the power conversion circuit and the common-mode choke coil are mounted. The common-mode choke coil includes a first winding having one end connected to a low-potential side of the DC power supply via a first reference potential wiring pattern P-and another end connected to a low-potential side of a load via a second reference potential wiring pattern L-, and a second winding of which one end is connected to a high-potential side of the DC power supply via a DC positive potential wiring pattern and another end is connected to an input side of the power conversion circuit via an input positive potential wiring pattern.

Abstract: A semiconductor device is flip-chip mounted on a mounting substrate. A mold resin seals the semiconductor device. An insulating heat transfer member having a thermal conductivity higher than a thermal conductivity of the mold resin is on a surface of the semiconductor device facing the mounting substrate. The semiconductor device includes a device layer including a transistor, a plurality of bumps that are on a surface of the device layer facing the mounting substrate and are connected to the mounting substrate, and an insulating layer that is on a surface of the device layer opposite to the surface facing the mounting substrate. When the mounting substrate is viewed in plan view, the transistor has a non-overlapping portion that does not overlap with any of the bumps. The heat transfer member is continuous from a region overlapping with the non-overlapping portion to at least one of the bumps.

Abstract: Outer terminal electrodes form exposed surfaces that extend in the form of a substantially L shape while at least part thereof are embedded in a component main-body. A loop conductor layer of the coil conductor has a lower side portion, lateral side portions, oblique side portions, and an upper side portion. The lower side portion has a length shorter than a gap between outer terminal electrodes, and is positioned within a range of the gap.