Patents Assigned to N/A
  • Patent number: 12111999
    Abstract: According to an embodiment, a method for a touch scan is proposed. The method includes operating a device in first and second modes corresponding to the device, respectively, being wirelessly and not wirelessly charged. In each mode for each frame, the method includes dividing a frequency range corresponding to a touch-sensing technology into M or N positive integer numbers of equal and sequential frequency intervals, where N is greater than M. In the first mode, the method includes determining a first frequency interval of the M frequency intervals with the least noise and performing the touch scan using a first frequency within the first frequency interval. In the second mode for each frame, the method includes determining a second frequency interval of the N frequency intervals with the least noise and performing the touch scan using a second frequency within the second frequency interval.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: October 8, 2024
    Assignee: STMicroelectronics International N.V.
    Inventors: Sang Soo Lee, MooKyung Kang
  • Patent number: 12112319
    Abstract: Systems and methods for communication of electronic data in which one or more memory-coupled entity processors programmed to execute a stateless application that persists no data except configuration data in the stateless application and causes the at least one entity processor to receive data in a first format from a data source to which the stateless application executing on the at least one entity processor is loosely coupled; translate the received data to a second format for a data destination; and submit the data in the second format to the data destination to which the stateless application executing on the at least one entity processor is also loosely coupled.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: October 8, 2024
    Assignee: Citibank, N.A.
    Inventors: Alex McMahon, Paul Carey, Archana Loganathan, Wayne Crombie
  • Publication number: 20240329098
    Abstract: An insulating encapsulation encapsulates a semiconductor die having an integrated Hall current sensor configured to measure an electric current flowing adjacent an active surface of the semiconductor die. An electrically conductive trace is embedded in the insulating encapsulation. First electrically conductive formations extend through the insulating encapsulation towards opposed ends of the electrically conductive trace. The first electrically conductive formations are configured to cause an electrical current subject to measurement to flow in a current flow path through the electrically conductive trace. Second electrically conductive formations extend through the insulating encapsulation towards the active surface of the semiconductor die. The second electrically conductive formations are configured to activate the Hall current sensor integrated in the semiconductor die.
    Type: Application
    Filed: March 25, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Roberto TIZIANI, Francesca DE VITI
  • Publication number: 20240331767
    Abstract: The present disclosure is directed to a device and method for accurately estimating a write self-time of a memory array. The write self-time is estimated by performing a simulated write operation on a write self-time bit cell having the same structure and arrangement as each of the bit cells of the memory array. The write operations on the bit cells of the memory array are stopped in response to detecting completion of the simulated write operation.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Praveen Kumar VERMA, Anuj DHILLON
  • Publication number: 20240332033
    Abstract: A “package-less” integrated circuit semiconductor device is produced by laminating first and second insulating films on opposed first and second surfaces of a semiconductor wafer having semiconductor dice integrated therein. Electrically conductive formations towards die pads of the semiconductor dice are provided in vias to the semiconductor wafer opened through the first insulating film laminated on the first surface of the semiconductor wafer. The semiconductor wafer provided with these electrically conductive formations is singulated at separation lines between neighboring semiconductor dice to produce individual semiconductor devices. Each device has: opposed first and second device surfaces having protective portions of the first and second insulating films laminated thereon, and side surfaces extending between the opposed first and second device surfaces, these side surfaces being left uncovered by the first and second insulating films.
    Type: Application
    Filed: March 25, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Michele DERAI, Guendalina CATALANO
  • Publication number: 20240330066
    Abstract: A method and a system for automated performance of capacity allocation, brokerage, placement, and provisioning of compute, network, and storage resources are provided. The method includes: receiving a first data set that relates to resource requirements of a user; retrieving, from a memory, a second data set that relates to resource availability; analyzing the first data set and the second data set in order to determine a proposed allocation of resources and a proposed timing that corresponds to the proposed allocation; and provisioning the resources to the user based on the proposed allocation and the proposed timing. A machine learning model that is trained by using historical resource allocation data may be applied to the first data set and the second data set in order to perform the analysis.
    Type: Application
    Filed: May 17, 2023
    Publication date: October 3, 2024
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Jessie RINCON-PAZ, Francine SHEPHARD, Navin NAGARAJAIAH, Tijelino J BRAVO, Louis FLORES, Andres Lucas GARCIA FIORINI, Anmol P MEHTA, Nisha KAW, Rajesh GUNTHA, Shiv GURUSWAMY, Joseph E LEIDEMER
  • Publication number: 20240332413
    Abstract: The HEMT device has a body including a heterostructure configured to generate a 2-dimensional charge-carrier gas; and a gate structure which extends on a top surface of the body and is biasable to electrically control the 2-dimensional charge-carrier gas. The gate structure has a channel modulating region of semiconductor material; a functional region of semiconductor material; and a gate contact region of conductive material. The functional region and the gate contact region extend on a top surface of the channel modulating region and the gate contact region is arranged laterally with respect to the functional region. The channel modulating region has a different conductivity type with respect to the functional region.
    Type: Application
    Filed: March 21, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Ferdinando IUCOLANO, Alessandro CHINI, Maria Eloisa CASTAGNA, Aurore CONSTANT, Cristina TRINGALI
  • Publication number: 20240327203
    Abstract: A method for manufacturing a MEMS device includes forming a first solid body by forming, on a substrate, a layered structure having a thickness of a value comprised between 4 and 10 ?m, with the layered structure having a first surface that is uniformly flat or planar throughout the extension thereof that faces the substrate. The method further includes forming, on a second surface of the layered structure opposite to the first surface in a direction, multiple transducer devices. The method then proceeds with coupling the first solid body to a supporting structure, and completely removing the substrate to expose said uniformly flat or planar surface.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Mark Andrew SHAW, Fabio QUAGLIA, Domenico GIUSTI, Marco FERRERA
  • Publication number: 20240329911
    Abstract: A method, a system and devices for data sharing by teleconferencing with local projection of the same shared data in a local meeting room are described. A method, a system and devices for synchronizing display of content in a local room and remote sharing of the same content as well are also described. A method, a system and devices for providing access to shared multimedia content within a defined room environment as well as with a remote user are also described.
    Type: Application
    Filed: January 26, 2024
    Publication date: October 3, 2024
    Applicant: BARCO N.V.
    Inventors: Steven LIEN, Madhwan MISRA, Audi HSU
  • Publication number: 20240331768
    Abstract: An electronic device includes a memory and includes a plurality of word lines selectively driven by a decoder, with each pair of adjacent word lines having an underdrive circuit coupled therebetween. That underdrive circuit includes first and second transistors source/drain coupled in series with one another between the pair of adjacent word lines, the first and second transistors being replicas of a pull-down transistor and a pass gate transistor of bitcells the memory. One of the first and second transistors has its gate driven by a supply voltage and the other of the first and second transistor has its gate driven by a first read assist control signal.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Praveen Kumar VERMA, Ashfaque AHMED
  • Publication number: 20240330306
    Abstract: Various methods, apparatuses/systems, and media for integration of user defined metrics of cloud hosted relational databases with cloud monitoring services are disclosed. A processor receives via a serverless function implemented within the processor a configuration file containing configuration of collection of database connection string and respective metrics query. The serverless function connects to the secrets provider to fetch a password or authorization token to connect with a plurality of different types of cloud hosted relational databases. The processor returns, in response to receiving the respective metrics query, a table with two columns where one column includes a user defined metric name and the other column includes the metric query to fetch a user defined metric value for the given user defined metric name from the databases; and automatically integrates the fetched user defined metric value of the databases with the cloud monitoring service.
    Type: Application
    Filed: May 10, 2023
    Publication date: October 3, 2024
    Applicant: JPMorgan Chase Bank, N.A.
    Inventor: Ashutosh PAREEK
  • Publication number: 20240333292
    Abstract: An electronic device applies a frequency offset function to a first signal having a first frequency. The device includes a delay element configured to output a second signal corresponding to the first signal delayed by a duration equal to a first period of said signal divided by four. A circuit branch includes a first circuit configured to divide the frequency of the first signal by a given number coupled in series with a second circuit configured to implement an integration. The circuit branch outputs a third signal and a fourth signal. A single side band mixing circuit processes the first signal, second signal, third signal and fourth signal to generate an output signal.
    Type: Application
    Filed: March 26, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Cao-Thong TU, David COUSINARD, David CHAMPION, Matteo CONTALDO
  • Publication number: 20240332210
    Abstract: An integrated circuit optical package includes a support substrate having a mounting face and an electrical interconnection network between the mounting face and contact pads located on a lower face of the support substrate. A cap includes a lateral wall fastened on the mounting face and an upper wall including a first opening. A first optical element is fastened on the upper wall of the cap to seal the first opening. An electromagnetic shielding element is embedded in the cap and configured to be coupled to a reference supply point via the interconnection network and at least one contact pad. A first electronic chip is mounted on the mounting face and in optical cooperation with the first optical element.
    Type: Application
    Filed: March 27, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Patrick LAURENT, Jean-Michel RIVIERE
  • Publication number: 20240332436
    Abstract: The present disclosure is directed to an optical sensor package with light shielding material covering five sides. The optical sensor package includes a transparent layer, a substrate layer, sensor elements between the transparent layer and the substrate layer, a first layer of light shielding material on the side of the substrate layer opposite the transparent layer, and a second layer of light shielding material covering five sides of the optical sensor package. The first and second layers of light shielding material prevent light from entering the sides of the optical sensor package or from traveling through the substrate layer and reflecting toward the sensor elements.
    Type: Application
    Filed: March 15, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Yiying KUO, David GANI, Hui-Tzu WANG
  • Publication number: 20240330097
    Abstract: A method and a system for forecasting technology-related incidents and/or failures using artificial intelligence models and machine learning techniques are provided. The method includes: receiving a data set that relates to a system; analyzing the data set to identify a potential problem with respect to the system; and generating a report that includes a forecast that relates to the identified potential problem. The analysis is performed by applying an artificial intelligence (AI) algorithm that is trained by using historical data that relates to incidents and failures associated with the system.
    Type: Application
    Filed: May 15, 2023
    Publication date: October 3, 2024
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Huzefa RANGWALA, Aman Pratap SINGH
  • Publication number: 20240332366
    Abstract: A polycrystalline silicon carbide (SiC) substrate with a density gradient between a first side of the polycrystalline SiC substrate and a second side of the polycrystalline SiC substrate opposite to the first side. A first density at the first side of the polycrystalline SiC substrate is less than a second density at the second side of the polycrystalline SiC substrate. The polycrystalline SiC substrate with the density gradient may be formed by forming a polycrystalline SiC base substrate with a sintering process followed by a post-sintering process. For example, the post sintering process may be at least one of the following of: applying a first temperature to the first side and a second temperature to the second side of the polycrystalline SiC substrate and performing a chemical vapor deposition (CVD) process to impregnate further silicon (Si) and carbon (C) atoms into the polycrystalline SiC base substrate.
    Type: Application
    Filed: March 22, 2024
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Björn MAGNUSSON LINDGREN, Carlo RIVA
  • Publication number: 20240324644
    Abstract: A consortium of specific probiotic bacteria comprising Bifidobacterium bifidum and Bifidobacterium breve with specific carbohydrate degrading properties, specific human milk oligosaccharide and preferably also beta-galacto-oligosaccharides with a higher degree of polymerization, is particularly effective for improving intestinal microbiota resilience.
    Type: Application
    Filed: June 13, 2024
    Publication date: October 3, 2024
    Applicant: N.V. Nutricia
    Inventors: Cornelus Johannes Petrus van Limpt, Kaouther Ben Amor, Jan Knol, Ana Maria GIL RODRÍGUEZ
  • Publication number: 20240324998
    Abstract: A guidance apparatus is provided for use with a portable imaging apparatus and an image display device. The guidance apparatus includes a sleeve portion structured for receiving an imaging apparatus and a coupling mechanism. The coupling mechanism has a rotating portion and first and second connecting portions structured for coupling the image display device to the imaging apparatus. During use, the coupling mechanism facilitates orienting the image display device relative to the imaging apparatus to provide a direct line of sight of an area imaged by the imaging apparatus. The coupling mechanism may be adjustable for facilitating rotation of the image display device about a longitudinal axis of the imaging apparatus. Also, the coupling mechanism can be structured to allow the combination of the coupling mechanism, the image display device, and the imaging apparatus to be held in a single hand of a user during performance of a medical procedure.
    Type: Application
    Filed: November 3, 2023
    Publication date: October 3, 2024
    Applicant: V.E.I.N., LLC
    Inventor: Max L. Moss
  • Publication number: 20240330399
    Abstract: A neural network includes an internal storage unit. The internal storage unit stores feature data received from a memory external to the neural network. The internal storage unit reads the feature data to a hardware accelerator of the neural network. The internal storage unit adapts a storage pattern of the feature data and a read pattern of the feature data to enhance the efficiency of the hardware accelerator.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: STMicroelectronics International N.V.
    Inventors: Carmine CAPPETTA, Surinder Pal SINGH, Giuseppe DESOLI, Thomas BOESCH
  • Patent number: D1046296
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: October 8, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Jos Van Roosmalen, Frank Verbrugge, Jens Andersson, Roel Krooshof, Simon Van Anken, Peter Gal, Lieven Adriaenssen, Roshan Hakkim, Mingshuo Zhang