Patents Assigned to (N)TORUS TECHNOLOGIES
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Publication number: 20250148875Abstract: A lottery ticket vending machine including a housing, a ticket drawer column in the housing, the ticket drawer column including a plurality of ticket drawers, each of the ticket drawers configured to hold one or more packs of lottery tickets, and a ticket burster in the housing, the ticket burster defining a ticket inlet and a ticket outlet, the ticket burster movable to a plurality of different ticket receipt positions, each different ticket receipt position associated with and in alignment with a different one of the ticket drawers, the ticket burster including, in various embodiments, one or more or all of a ticket pack sensor, a ticket exit sensor, a barcode sensor, and a ticket drawer sensor.Type: ApplicationFiled: November 7, 2023Publication date: May 8, 2025Inventor: Robert Corvese
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Publication number: 20250148919Abstract: The present invention relates to a mobility sharing system that operates a mobility location strategy using a deep learning algorithm. A first vehicle determination unit divides an entire area into a plurality of unit areas and determines the number of vehicles to be located in each of the plurality of unit areas. A prediction unit, by inputting a prediction data set generated based on the number of vehicles departing from each of stations and the number of vehicles arriving at each of the stations into a bidirectional recurrent neural network (RNN) model, predicts the number of vehicles departing from each of the stations and the number of vehicles arriving at each of the stations during a target time interval. A second vehicle determination unit sets the number of location vehicles to be located at each of the stations in the target time interval.Type: ApplicationFiled: November 22, 2023Publication date: May 8, 2025Inventors: Misung CHO, Byungkwan JUNG, Sunwoo JIN, Youngjin Han, Ahyoung SHIN
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Publication number: 20250148943Abstract: A golf cart mountable flag assembly for advertising and promotional purposes includes a clamp, a staff, and a flag. The clamp comprises a pair of jaws that can be opened to receive a rod of a canopy of a golf cart and to be closed to secure the clamp to the rod. A socket having an opening is attached to the clamp so that the opening faces upwardly upon the clamp being secured to the rod. The staff has upper and lower ends, with the lower end being selectively insertable into the socket to attach the staff to the socket and with the staff extending substantially vertically relative to a ground surface. The flag comprises a panel, which has a vertical edge, and a sleeve, which is attached to the panel and which extends along the vertical edge. The staff is insertable into the sleeve.Type: ApplicationFiled: November 8, 2023Publication date: May 8, 2025Inventors: Jonathan Flores, Jose Avilez
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Publication number: 20250148958Abstract: A display device includes a pixel array including a plurality of pixels connected to a plurality of source lines, a voltage generator configured to generate a reference voltage, and a source driver configured to output a first source signal corresponding to a first source line among the plurality of source lines, receive a first return signal corresponding to the first source signal through a second source line positioned adjacent to the first source line, and generate a first count value based on a first comparison result of the first return signal and the reference voltage.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Inventors: Minsung Kim, Seung-Hoon Baek, Choonghoon Lee, Jeong Cho
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Publication number: 20250149343Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed over a substrate. A film is formed over the underlying structure. Surface topography of the film is measured and the surface topography is stored as topography data. A local etching is performed by using directional etching and scanning the substrate so that an entire surface of the film is subjected to the directional etching. A plasma beam intensity of the directional etching is adjusted according to the topography data.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ya-Wen YEH, Yu-Tien SHEN, Shih-Chun HUANG, Po-Chin CHANG, Wei-Liang LIN, Yung-Sung YEN, Wei-Hao WU, Li-Te LIN, Pinyen LIN, Ru-Gun LIU
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Publication number: 20250149612Abstract: A system for consolidating tabs of a battery cell includes a tab guide configured to receive a plurality of tabs extending from electrode layers of a cell stack, the cell stack configured to be disposed in a housing to form the battery cell, the tab guide including opposing guide components configured to be positioned between the cell stack and a weld plate, the tab guide configured to receive the plurality of tabs between the opposing guide components. The system also includes an actuator configured to be operated to move one or more of the opposing guide components to deform a length of one or more tabs between the cell stack and the weld plate.Type: ApplicationFiled: November 6, 2023Publication date: May 8, 2025Inventors: Kevin Dongjun Kim, James Chung, Young Nam Kim, Virendra Kumar Dewangan, Varsha Tadwalkar, Christopher Schlaupitz
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Publication number: 20250150079Abstract: A transmission and reception system includes a transmission circuit and a reception circuit. The transmission circuit is configured to generate a transmission signal based on an input signal. The reception circuit is configured to generate an output signal based on the transmission signal. The transmission circuit is configured to provide a duty cycle offset which is complementary with a duty cycle offset of the reception circuit.Type: ApplicationFiled: April 5, 2024Publication date: May 8, 2025Applicant: SK hynix Inc.Inventor: Hyun Bae LEE
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Publication number: 20250151209Abstract: A remote control device is disclosed. A single-piece casing has a front surface, rear surface, and pair of opposing side surfaces disposed between the front and rear surfaces. An inner cavity is formed within the casing between the top, bottom and side surfaces and extends along at least part of a length of the casing. A front opening is formed in the front surface and extends into the inner cavity. The front opening is configured to receive a display. At least one key opening is formed in the front surface and extends into the inner cavity. A keypad is configured to be disposed within the inner cavity and includes at least one key positioned on the keypad to extend through the at least one key opening. A chassis has a body configured to be disposed within the inner cavity at least beneath the keypad and the front opening.Type: ApplicationFiled: January 13, 2025Publication date: May 8, 2025Applicant: Crestron Electronics, Inc.Inventors: Gautham Basti, Daniel Previti
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Publication number: 20250151213Abstract: A rolling-up screen includes a roller holder, a roller, a screen, a driving assembly, and multiple groups of supporting protection pieces. The roller holder is connected to a ceiling by a frame, or supported by a frame. The roller is rotatably connected between two plates of the roller holder. The screen includes display units in multiple rows and connected with the roller by hanging steel wire. The screen can be wound around the roller after retracting, and suspended below the roller by the hanging steel wire after unfolding. The driving assembly is arranged on the roller holder and connected with the roller to drive the roller to rotate, so as to enable the screen to be retracted and wound on the roller or unfolded and hung below the roller. The supporting protection pieces are arranged on the back surfaces of the display units in each row.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Inventors: Ning WANG, Yanping Liu
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Publication number: 20250151240Abstract: A server and a server system are provided. The server system includes a server and a cooling medium distributing device. The server includes a first electronic node, a second electronic node, and a cooling connection device. The first electronic node and the second electronic node are connected with the cooling medium distributing device through the cooling connection device. The cooling medium distributing device conveys a liquid cooling medium of the same working medium to the first electronic node and the second electronic node, so that the first electronic component of the first electronic node can dissipate heat in a two-phase heat dissipation mode, and the second electronic component of the second electronic node can dissipate heat in a single-phase liquid cooling manner.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Inventors: Hui Jia, Guangjing Wang
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Publication number: 20250151244Abstract: A power supply with a cooling fan includes a first housing, a fan body, a plurality of connecting members, and a second housing. The first housing includes a first bottom wall and two first side walls, and the two first side walls have two first extension parts. Each connecting member includes a strip of connecting part and two fixing parts connected to the connecting part. The fan body is disposed in the first housing, and fixed to the first extension part by each fixing part. The connecting part is supported between the two fixing parts along the side of the fan body. The second housing uses a second bottom wall and two second side walls to cover the first extension parts and the connecting members, and is fixed with the first housing, so that the fixing elements of the fan body are not exposed on the power supply.Type: ApplicationFiled: December 25, 2023Publication date: May 8, 2025Inventors: YEN-CHENG PAN, BO-LUN LIN, CHIA-YING LIN
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Publication number: 20250151280Abstract: A semiconductor device including a peripheral circuit structure, a cell structure including gate electrodes and stacked on the peripheral circuit structure, the cell structure including a cell region, a connection region, and a peripheral circuit connection region, the cell structure, a plurality of channel structures extending in a vertical direction through the gate electrodes in the cell region, each of the plurality of channel structures including a first end portion close to the peripheral circuit structure and a second end portion opposite to the first end portion, and a common source layer connected to the second end portion of each of the channel structures in the cell region may be provided.Type: ApplicationFiled: October 17, 2024Publication date: May 8, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Suseong NOH, Kwangsoo KIM, Taeyoung KIM, Ilho MYEONG, Sanghyun PARK, Suhwan LIM
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Publication number: 20250151287Abstract: A memory device includes a memory array comprising a plurality of memory cells arranged over a plurality of rows, the rows including a plurality of word lines, respectively, a first group of the memory cells coupled to an even-numbered one of the word lines and a second group of the memory cells coupled to an odd-numbered one of the word lines. The even-numbered word line is disposed in a first one of a plurality of metallization layers formed vertically above a substrate, wherein the even-numbered word line extends along a first lateral direction and includes a first stitch portion extending in a second lateral direction perpendicular to the first lateral direction. The odd-numbered word line is disposed in a second one of the plurality of metallization layers, wherein the odd-numbered word line extends along the first lateral direction and includes a second stitch portion extending in the second lateral direction.Type: ApplicationFiled: March 14, 2024Publication date: May 8, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ku-Feng Lin, Ji-Kuan Lee, Wen-Chun You, Perng-Fei Yuh, Yi-Chun Shih, Yih Wang
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Publication number: 20250151376Abstract: A method of making a semiconductor device, includes: providing a first dielectric layer; sequentially forming a first metal layer, a dummy capacitor dielectric layer, and a second metal layer over the first dielectric layer; and using a single mask layer with two patterns to simultaneously recess two portions of the second metal layer so as to define a metal thin film of a resistor and a top metal plate of a capacitor.Type: ApplicationFiled: December 16, 2024Publication date: May 8, 2025Inventors: Chen-Hsiang HUNG, Li-Hsin CHU, Chia-Ping LAI, Chung-Chuan TSENG
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Publication number: 20250151380Abstract: Devices and methods for layout-dependent voltage handling improvement in switch stacks. In some embodiments, a switching device can include a first terminal and a second terminal, a radio-frequency signal path implemented between the first terminal and the second terminal, and a plurality of switching elements connected in series to form a stack between the second terminal and ground. The stack can have an orientation relative to the radio-frequency signal path, and the switching elements can have a non-uniform distribution of a first parameter based in part on the orientation of the stack.Type: ApplicationFiled: January 12, 2025Publication date: May 8, 2025Inventors: Guillaume Alexandre BLIN, Ambarish ROY, Seungwoo JUNG
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Publication number: 20250151384Abstract: A manufacturing method of a semiconductor device includes the following steps. A III-V compound semiconductor layer is formed on a first device region and a second device region of a substrate. A III-V compound barrier layer is formed on the III-V compound semiconductor layer. A lamination structure is formed on the III-V compound barrier layer. The lamination structure includes a p-type doped III-V compound layer and a first mask layer disposed thereon. A patterning process is performed to the lamination structure. A first portion of the lamination structure located above the first device region is patterned by the patterning process. A second portion of the lamination structure located above the second device region is removed by the patterning process. A thickness of the second portion of the lamination structure is greater than a thickness of the first portion of the lamination structure before the patterning process.Type: ApplicationFiled: December 14, 2023Publication date: May 8, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Shuo-Lin Hsu, Hung-Chang Chang, Ta-Kang Lo, Tsai-Fu Chen
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Publication number: 20250151419Abstract: An assembly including at least one photovoltaic cell including a face on which a collecting grid is arranged, at least one interconnection strip attached to the face, and intended to electrically and mechanically connect the photovoltaic cell to another photovoltaic cell, and at least one line of adhesive, made of an electrically conductive material, disposed between the collecting grid and the interconnection strip, the line of adhesive being adapted to mechanically and electrically connect the interconnection strip to the photovoltaic cell, the line of adhesive extending substantially along a main longitudinal axis (X) and having a substantially constant width. The line of adhesive is disposed according to a zigzag pattern formed from a plurality of segments each forming an angle (?) less than or equal to 30° with the main longitudinal axis (X).Type: ApplicationFiled: November 1, 2024Publication date: May 8, 2025Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, 3SUN S.R.LInventors: Romain SOULAS, Vincent BARTH, Corentin LUCAS, Antonino RAGONESI, Lorenzo CARBONE
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Publication number: 20250151421Abstract: A semiconductor device has a photonic semiconductor die and a lens mounted onto the photonic semiconductor die. The photonic semiconductor die and lens are singulated prior to mounting the lens onto the photonic semiconductor die. An adhesive bead is formed on the photonic semiconductor die to seal a cavity between the lens and photonic semiconductor die. The photonic semiconductor die and lens are disposed into a storage media for transporting the photonic semiconductor die to a semiconductor packaging facility. The photonic semiconductor and lens are disposed on a substrate after mounting the lens onto the photonic semiconductor die. An encapsulant is deposited over the substrate, lens, and photonic semiconductor die.Type: ApplicationFiled: October 25, 2024Publication date: May 8, 2025Applicant: UTAC Headquarters Pte. Ltd.Inventors: Jeffrey Punzalan, Catherine Chang, Il Kwon Shim
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Publication number: 20250151538Abstract: A semiconductor device including a miniaturized transistor is provided. The semiconductor device includes a semiconductor layer, a first conductive layer, a second conductive layer, a third conductive layer, a first insulating layer, and a second insulating layer. The first insulating layer is provided over the first conductive layer. The first insulating layer has a first opening reaching the first conductive layer. The semiconductor layer is in contact with a top surface and a side surface of the first insulating layer and a top surface of the first conductive layer. The second conductive layer is provided over the semiconductor layer. The second conductive layer includes a second opening in a region overlapping with the first opening. The second insulating layer is provided over the semiconductor layer and the second conductive layer. The third conductive layer is provided over the second insulating layer.Type: ApplicationFiled: February 6, 2023Publication date: May 8, 2025Inventors: Yasuharu HOSAKA, Yukinori SHIMA, Masami JINTYOU, Masataka NAKADA, Junichi KOEZUKA, Kenichi OKAZAKI
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Publication number: 20250151542Abstract: A display apparatus includes a substrate including a display area and a peripheral area around the display area, a light-emitting element arranged in the display area and a pixel circuit configured to drive the light-emitting element, fan-out wires electrically connected to the pixel circuit and arranged in the peripheral area, a power input wire and a power transfer wire apart from each other in the peripheral area, and a connection member connected to the power input wire through first contact holes and connected to the power transfer wire through second contact holes. The connection member at least partially overlaps the fan-out wires, and a center distance between the first contact holes and a center distance between the second contact holes are not constant.Type: ApplicationFiled: April 8, 2024Publication date: May 8, 2025Inventors: Minhee Choi, Minkyung Park, Seungwoo Sung, Youngsoo Yoon, Bongwon Lee, Wonse Lee, Donghyeon Jang, Sukyo Jung, Seunghan Jo, Sunbaek Hong