Abstract: Provided is an auxiliary bending robot capable of processing two workpieces simultaneously, including a linear base slide rail, a slider, a movable major arm, a movable minor arm, a front arm, a swing link, and an additional seventh axis. The slider is slidably connected to the linear base slide rail, and a first axis is formed between the slider and the linear base slide rail. A top portion of the slider is directly or indirectly hinged to a rear end of the movable major arm through a second axis, a front end of the movable major arm is hinged to a rear end of the movable minor arm through a third axis, a front end of the movable minor arm is hinged to a rear end of the front arm through a fourth axis, and a front end of the front arm is rotatably connected to a middle portion of the swing link through a fifth axis.

Abstract: Provided is an auxiliary bending robot capable of processing two workpieces simultaneously, including a linear base slide rail, a slider, a movable major arm, a movable minor arm, a front arm, a swing link, and an additional seventh axis. The slider is slidably connected to the linear base slide rail, and a first axis is formed between the slider and the linear base slide rail. A top portion of the slider is directly or indirectly hinged to a rear end of the movable major arm through a second axis, a front end of the movable major arm is hinged to a rear end of the movable minor arm through a third axis, a front end of the movable minor arm is hinged to a rear end of the front arm through a fourth axis, and a front end of the front arm is rotatably connected to a middle portion of the swing link through a fifth axis.

Abstract: An integrated device and a fabrication method thereof are provided. In the device, by using various anisotropic silicon etching techniques, the silicon substrate layer and the expitaxial buffer layer under the device structure are removed, an ultra-thin device monolithically integrated with a suspended LED, an optical waveguide and a photodetector is obtained by further using the nitride back thinning etching technique. In the device, the light source, the optical waveguide and the photodetector are integrated on the same chip. The light emitted by the LED is laterally coupled to the optical waveguide, transmitted over the optical waveguide, and detected by the photodetector at the other end of the optical waveguide, thereby achieving a planar photon monolithically integrated device which is applied in the fields of optical transmission and optical sensing.

Abstract: By using various anisotropic silicon etching techniques, a silicon substrate layer (1) and an epitaxial buffer layer (2) under the device structure are removed to obtain a monolithic photonic integration of silicon substrate suspended light-emitting diode (LED) with optical waveguide, and an ultra-thin device monolithically integrated with a suspended LED and an optical waveguide is obtained by further using the nitride back thinning etching technique. Therefore, internal loss of the LED is reduced and light emitting efficiency is improved. In the device according to the present disclosure, the light source and the optical waveguide are integrated on the same wafer, which solves the problem of monolithic integration of planar photons, enables the light emitted by the LED to be transmitted along the optical waveguide, addresses the problem of transmission of light in the optical waveguide, and implements the function of transmitting light within a plane.

Abstract: An integrated device and a fabrication method thereof are provided. In the device, by using various anisotropic silicon etching techniques, the silicon substrate layer and the expitaxial buffer layer under the device structure are removed, an ultra-thin device monolithically integrated with a suspended LED, an optical waveguide and a photodetector is obtained by further using the nitride back thinning etching technique. In the device, the light source, the optical waveguide and the photodetector are integrated on the same chip. The light emitted by the LED is laterally coupled to the optical waveguide, transmitted over the optical waveguide, and detected by the photodetector at the other end of the optical waveguide, thereby achieving a planar photon monolithically integrated device which is applied in the fields of optical transmission and optical sensing.

Abstract: By using various anisotropic silicon etching techniques, a silicon substrate layer (1) and an expitaxial buffer layer (2) under the device structure are removed to obtain a monolithic photonic integration of silicon substrate suspended light-emitting diode (LED) with optical waveguide, and an ultra-thin device monolithically integrated with a suspended LED and an optical waveguide is obtained by further using the nitride back thinning etching technique. Therefore, internal loss of the LED is reduced and light emitting efficiency is improved. In the device according to the present disclosure, the light source and the optical waveguide are integrated on the same wafer, which solves the problem of monolithic integration of planar photons, enables the light emitted by the LED to be transmitted along the optical waveguide, addresses the problem of transmission of light in the optical waveguide, and implements the function of transmitting light within a plane.