Abstract: A buck/boost regulator controller is provided. The buck-boost regulator controller controls four switches in an H-bridge configuration to control voltage regulation. The buck/boost regulator controller includes a digital error amplifier and buck-boost control logic. The digital error amplifier provides a multi-bit digital error voltage signal that is based on the difference between the output voltage and the desired output voltage. The buck-boost control logic controls the opening and closing of the four switches in the H-bridge based, in part, on the multi-bit digital error voltage signal.

Abstract: An insulated-gate field-effect transistor (100) provided along an upper surface of a semiconductor body contains a pair of source/drain zones (240 and 242) laterally separated by a channel zone (244). A gate electrode (262) overlies a gate dielectric layer (260) above the channel zone. Each source/drain zone includes a main portion (240M or 242M) and a more lightly doped lateral extension (240E or 242E) laterally continuous with the main portion and extending laterally under the gate electrode. The lateral extensions, which terminate the channel zone along the upper semiconductor surface, are respectively largely defined by a pair of semiconductor dopants of different atomic weights. With the transistor being an asymmetric device, the source/drain zones constitute a source and a drain. The lateral extension of the source is then more lightly doped than, and defined with dopant of higher atomic weight, than the lateral extension of the drain.

Abstract: A semiconductor structure contains a bipolar transistor (101) and a spacing structure (265-1 or 265-2). The transistor has an emitter (241), a base (243), and a collector (245). The base is formed with an intrinsic base portion (243I), a base link portion (243L), and a base contact portion (245C). The intrinsic base portion is situated below the emitter and above material of the collector. The base link portion extends between the intrinsic base portion and the base contact portions. The spacing structure includes an isolating dielectric layer (267-1 or 267-2) and a spacing component. The dielectric layer extends along the upper semiconductor surface. The spacing component includes a lateral spacing portion (269-1 or 269-2) of largely non-monocrystalline semiconductor material, preferably polycrystalline semiconductor material, situated on the dielectric layer above the base link portion.

Abstract: A two terminal ESD protection structure formed by an alternating arrangement of adjacent p-n-p-n-p semiconductor regions provides protection against both positive and negative ESD pulses. When an ESD pulse appears across the two terminals of the ESD protection structure, one of the inherent n-p-n-p thyristors is triggered into a snap-back mode thereby to form a low impedance path to discharge the ESD current. Some embodiments of the ESD protection structure of the present invention have an enhanced current handling capability and are formed by combining a number of standard cells. The standard cells include a corner cell, a center cell and an edge cell which are arranged adjacent each other to form an ESD protection structure which provides for current flow from across many locations therein. Some embodiments of the ESD protection structure of the present invention include a network consisting of a pair of current sources, e.g.

Abstract: A self-propelled robotic device moves through bodily and other passageways by inflating regions of an overlying bladder along the length of the robotic device in a sequence that imparts motion to the device. The regions of the overlying bladder are inflated by energizing a plurality of coils, which are surrounded by a ferrofluid, in a sequence. The ferrofluid responds to the magnetic field created by an energized coil by creating a bulge in the side wall of the overlying bladder.

Abstract: A semiconductor structure, which serves as the core of a semiconductor fabrication platform, has a combination of empty-well regions and filled-well regions variously used by electronic elements, particularly insulated-gate field-effect transistors (“IGFETs”), to achieve desired electronic characteristics. A relatively small amount of semiconductor well dopant is near the top of an empty well. A considerable amount of semiconductor well dopant is near the top of a filled well. Some IGFETs (100, 102, 112, 114, 124, and 126) utilize empty wells (180, 182, 192, 194, 204, and 206) in achieving desired transistor characteristics. Other IGFETs (108, 110, 116, 118, 120, and 122) utilize filled wells (188, 190, 196, 198, 200, and 202) in achieving desired transistor characteristics.

Abstract: In a snapback NMOS ESD protection structure, the output voltage presented to an internal circuit for ESD protection is limited by providing for a separate output terminal at a lower voltage than the input terminal. The voltage drop between the two terminals is achieved by connecting the input and output terminals to different parts of a ballast region of the structure and using the saturation resistance of the portion of the ballast region between the terminals to achieve the voltage drop.

Abstract: A leadframe suitable for use in the packaging of at least two integrated circuit dice into a single integrated circuit package is described. The leadframe includes a plurality of leads. Each of a first set of the plurality of leads has a first side and a second side substantially opposite the first side of the lead. Additionally, each of the first and second sides of the first set of leads each include at least two solder pads. Each solder pad on a lead of the first set of leads is isolated from other solder pads on the same side of the lead with at least one recessed region adjacent the solder pad. In various embodiments, I/O pads from at least two dice are physically and electrically connected to the opposing sides of the leads.

Abstract: In a SOI process, a high voltage BJT structure with BVCEO versus FT control is provided by including a bias shield over the laterally extending collector region and controlling the bias of the shield.

Abstract: An improved method for manufacturing bipolar transistors is disclosed. The method for forming a PNP transistor comprises the steps of forming a P type collector on a substrate, forming a PNP epitaxial base on the P type collector, forming a PNP extrinsic base in the PNP epitaxial base, and forming a PNP emitter in contact with the PNP extrinsic base. The method for forming an NPN transistor comprises the steps of forming an N type collector on a substrate, forming a NPN epitaxial base on the N type collector, forming an NPN extrinsic base in the NPN epitaxial base, and forming an NPN emitter in contact with the NPN extrinsic base. The PNP and NPN transistors may be manufactured in the same control flow process.

Abstract: A system and method is described for providing a continuous bath wetdeck process for use in the manufacture of semiconductor wafers. The invention provides a method for extending an effective working life of a chemical bath of the type that comprises a chemical bath liquid within a chemical bath container. An amount of fresh chemical is continuously added to the chemical bath liquid and an amount of chemical bath liquid is simultaneously purged from the chemical bath container. A balance is maintained between the amount of fresh chemical that is added to the chemical bath liquid and the amount of chemical bath liquid that is purged in order to maintain the effectiveness of the chemical bath liquid to clean semiconductor wafers within the chemical bath.

Abstract: A metal interconnect structure, which includes a bond pad, an overlying anti-reflective coating layer, an overlying passivation layer, and an opening that exposes a top surface of the bond pad, eliminates corrosion resulting from the anti-reflective layer being exposed to moisture during reliability testing by utilizing a side wall spacer in the opening that touches the side wall of the passivation layer, the side wall of the anti-reflective coating layer, and the top surface of the bond pad.

Abstract: An integrated circuit package configured to incorporate a lead frame and methods for its making are is described. The package comprising an IC with aluminum bond pads in communication with circuitry of the die with lead frame with silver bond pads. The package having gold bumps bonded between the aluminum bond pad of the die and the silver bond pad of the lead frame. The package including an encapsulant envelope and including various materials and bond pad structures and constructed in a manner formed by thermosonically or thermocompressionally bonding the gold balls to the bond pads. Also, disclosed are methods of making the package.

Abstract: A non-volatile memory (NVM) cell comprises an NMOS control transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to a storage node; a PMOS erase transistor having commonly-connected source, drain and bulk region electrodes and a gate electrode connected to the storage node; an NMOS data transistor having source, drain and bulk region electrodes and a gate electrode connected to the storage node, the bulk region electrode being connected to a common bulk node; the first NMOS pass gate transistor having a source electrode connected to the drain electrode of the NMOS data transistor, a drain electrode, a bulk region electrode connected to the common bulk node, and a gate electrode; and a second NMOS pass gate transistor having a drain electrode connected to the source electrode of the NMOS data transistor, a source electrode, a bulk region electrode connected to the common bulk node, and a gate electrode.

Abstract: A D/A converter having reference node for receiving a reference voltage and together network having a network reference bus connected to the reference node by way of a first electrical connection. The converter network produces a series of reference outputs derived from the reference voltage in response to a digital input applied to the converter, with the converter network sinking a network reference current at the network reference bus which varies with the converter digital input. A reference current compensator circuit is included which provides a compensation current at the network reference bus having a magnitude which varies in response to at least a portion of the digital input, with the compensation current operating to reduce variations in current through the first electrical connection caused by changes in the digital input.

Abstract: A converter circuit includes a primary side having a resonator and a first control circuit configured to control the resonator. The converter circuit also includes a secondary side having a resonant rectifier and a second control circuit configured to control the resonant rectifier. The converter circuit further includes a transformer configured to electrically isolate the primary side from the secondary side. The second control circuit is configured to turn the resonant rectifier on and off. The first control circuit may be configured to detect when the resonant rectifier is off and, in response, turn the resonator off without using a feedback signal from the secondary side. The first control circuit may be configured to detect when the resonant rectifier is off by detecting when input power to the primary side decreases. The resonant rectifier could be turned on and off by detuning the resonant rectifier.

Abstract: An adaptive impedance matching module having an adjustable impedance matching network with an input for receiving an RF power source and an output to be connected to an antenna, and first and second voltage measurement device configured to sense a voltage at respective first and second nodes on the impedance matching network. A network adjuster circuit is provided to switch the impedance matching network between a first state where first and second voltages are sensed on the respective first and second nodes and a second state where third and fourth voltages are sensed on the respective first and second nodes. Processing circuitry is provided which determines the matched load impedance based upon the first, second, third and fourth sensed voltages and including matching adjustment circuitry configured to adjust the matching impedance in the event the matched load impedance differs from a target load impedance by more that a predetermined amount.

Abstract: A gate driving circuit includes a driving stage configured to receive an input signal and generate a gate drive signal for a gate of a transistor switch. The gate driving circuit also includes an LC circuit having an inductor and a gate capacitance of the transistor switch. The LC circuit is configured so that a pulse in the gate drive signal generates a ringing in the LC circuit at a resonance frequency of the LC circuit to transfer energy into and out of the gate capacitance of the transistor switch. A switch could selectively couple the gate of the transistor switch to ground in order to discharge the gate capacitance. A control circuit could be used to provide the input signal, and the control circuit could be configured to regulate a duty cycle of the gate drive signal by adjusting an off-time between consecutive pulses in the input signal.

Abstract: A circuit for recovering charge at the gate of an output transistor arranged to drive the output of a switching circuit such as a switching regulator or controller. A substantial portion of the charge for each switching cycle is recovered under a wide range of load conditions for the switching circuit, e.g., no load, partial load, or full load. Also, charge recovery operates effectively with a switching circuit that is arranged to switch in a synchronous or asynchronous manner. Additionally, if the output voltage of a switching circuit is 12 or more volts, the amount of charge that can be saved can be relatively substantial.

Abstract: Bandgap voltage reference circuitry capable of operating at very low power supply voltages. The current source for driving the core bandgap voltage reference is implemented with insulated gate field effect transistors having low threshold voltages. Voltage clamp circuitry protects the transistors from power supply voltage variations rising above a predetermined clamp voltage. An output amplifier with output biasing circuitry having a circuit structure similar to that of the core bandgap voltage reference ensures that the bandgap reaches the intended steady state of operation.