Abstract: The invention provides a light-emitting diode illuminating equipment, including N diode light-emitting apparatuses and N optical devices, wherein N is a natural number. Each of the optical devices includes a lens. Each of the optical devices corresponds to one of the diode light-emitting apparatus, for modulating a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, the lens of each of the optical devices is a cat's-eye-like lens. The lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

Abstract: The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto.

Abstract: The invention provides a light-emitting diode illuminating equipment, including N diode light-emitting apparatuses and N optical devices, wherein N is a natural number. Each of the optical devices includes a lens. Each of the optical devices corresponds to one of the diode light-emitting apparatus, for modulating a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, the lens of each of the optical devices is a cat's-eye-like lens. The lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.

Abstract: The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors.

Abstract: The invention relates to a light-emitting diode cluster lamp. The light-emitting diode cluster lamp includes a plurality of light-emitting diode lamp packages, a control circuit, and a casing. Each of the light-emitting diode lamp packages includes a heat-conducting/dissipating module and a light-emitting diode module. The control circuit module is used for controlling the light-emitting diode lamp packages. The casing is adapted to accommodate the light-emitting diode lamp packages and the control circuit module. When the light-emitting diode cluster lamp is connected to a power source, the control circuit module selectively makes the light-emitting diode modules emit light. The heat generated during the light emission of each of the light-emitting diode modules is conducted and dissipated by the corresponding heat-conducting/dissipating module of each of the light-emitting diode modules.

Abstract: The invention discloses a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a plurality of diode light-emitting devices, and a plurality of bar-shaped heat-conducting devices with high heat-conducting coefficient. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By mounting the heat-conducting devices onto the surface of the heat-dissipating plate device and disposing them among the heat-dissipating fins, a heat produced in operation by each diode light-emitting device is distributed uniformly on the heat-dissipating plate device and the heat-conducting devices due to the high heat-conducting efficiency of the heat-conducting devices, and then it is dissipated such that the diode light-emitting devices have a consistent junction temperature to make a consistency of luminous efficiency and lifetime of the diode light-emitting devices.

Abstract: The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type UP lighting devices.

Abstract: The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto.

Abstract: The invention relates to a light-emitting diode cluster lamp. The light-emitting diode cluster lamp includes a plurality of light-emitting diode lamp packages, a control circuit, and a casing. Each of the light-emitting diode lamp packages includes a heat-conducting-and-dissipating module and a light-emitting diode module. The control circuit module is used for controlling the light-emitting diode lamp packages. The casing is adapted to accommodate the light-emitting diode lamp packages and the control circuit module. When the light-emitting diode cluster lamp is connected to a power source, the control circuit module selectively makes the light-emitting diode modules emit light. The heat generated during the light emission of each of the light-emitting diode modules is conducted and dissipated by the corresponding heat-conducting-and-dissipating module of each of the light-emitting diode modules.

Abstract: The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.