Abstract: The invention relates to a light-emitting display including a front plate, N heat-conducting/dissipating apparatuses, and N light-emitting apparatuses, wherein N is a natural number. The front plate has N formed-through apertures thereon. Each of the N heat-conducting/dissipating apparatuses, corresponding to one of the N formed-through apertures and one of the N light-emitting apparatuses, is inserted into the corresponding aperture via a neck portion thereof. Each of the N light-emitting apparatuses is mounted on the flat portion of the corresponding heat-conducting/dissipating apparatus. Thereby, the heat generated during the operation of each of the N light-emitting apparatuses is conducted by the corresponding heat-conducting/dissipating apparatus to the back side of the front plate, and then it is dissipated by the corresponding heat-conducting/dissipating apparatus.

Abstract: The invention provides a LED illuminating equipment with high power and high heat-dissipating efficiency. The LED illuminating equipment of the invention includes a plurality of diode light-emitting apparatuses. Particularly, the heat generated by the diode light-emitting apparatuses in operation is conducted to a heat-dissipating plate device and the heat-dissipating fins. Besides, the heat is uniformly distributed over the heat-dissipating plate device and further dissipated by the heat-dissipating plate device and the heat-dissipating fins extending thereon.

Abstract: The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors.

Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

Abstract: The invention provides a LED illuminating equipment with high power and high heat-dissipating efficiency. The LED illuminating equipment of the invention includes a plurality of diode light-emitting apparatuses. Particularly, the heat generated by the diode light-emitting apparatuses in operation is conducted to a heat-dissipating plate device and the heat-dissipating fins. Besides, the heat is uniformly distributed over the heat-dissipating plate device and further dissipated by the heat-dissipating plate device and the heat-dissipating fins extending thereon.

Abstract: The invention discloses an illumination device. A form factor of the illumination device comprises a shell and a plurality of LED platforms. The shell comprises a plurality of optical reflection components for reflecting light, each of the optical reflection components comprises a bottom surface. Each of the LED platforms, fixed on the bottom surface of one of the optical reflection components, comprises an energy converter, a heat-pipe and a heat-dissipating component. The energy converter, penetrating the bottom surface, comprises a plurality of first LEDs or second LEDs. The heat-pipe comprises a flat portion, an extension portion and a contact portion, wherein the flat portion contacts the energy converter, the extension portion has a bend and extends along a first direction, and the contact portion connects the bend and extends along a second direction. The heat-dissipating component has a plurality of fins, each of the fins contacts the contact portion.

Abstract: The invention relates to a light-emitting apparatus. The light-emitting apparatus includes a heat-conducting/dissipating module and at least one semiconductor light-emitting module. The heat-conducting/dissipating module includes a substantially cylindrical heat-conducting device having at least one flat portion and at least one heat-dissipating fin mounted on the circumference of the heat-conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat portion of the heat-conducting device. The plurality of exterior electrodes is disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and respectively connected to the plurality of exterior electrodes.

Abstract: A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.

Abstract: The invention discloses a chip lead frame and a photoelectric energy transducing module. The chip lead frame includes an insulator and a plurality of conductors. The insulator includes a first surface, a second surface, a first recess structure formed on the first surface, a through hole passing through the second surface and the first recess structure, and a venting structure. The first recess structure forms an accommodating space. The venting structure communicates with the accommodating space so that when a substrate is being bound to the first recess structure, the air in the accommodating space pressed by the substrate could flow through the venting structure out of the insulator without remaining between the substrate and the first recess structure. A photoelectric energy transducing semiconductor structure could be disposed on the substrate and electrically connected to the conductors, so as to form the photoelectric energy transducing module of the invention.

Abstract: The invention discloses a photoelectric energy transducing apparatus, which includes a photoelectric energy transducing module and a semiconductor switch. The photoelectric energy transducing module includes a photoelectric energy transducing semiconductor structure, a first positive electrode, and a negative electrode. The semiconductor switch includes a second positive electrode and a second negative electrode. The second positive electrode is electrically connected to the first negative electrode. The second negative electrode is electrically connected to the first positive electrode. When light radiates onto the photoelectric energy transducing semiconductor structure, an electromotive force is induced between the first positive electrode and the first negative electrode, and the electromotive force provides a reverse bias on the semiconductor switch so that the semiconductor switch is cut off.

Abstract: The invention provides light-emitting diode illuminating equipment with high power and high heat-dissipation efficiency. The light-emitting diode illuminating equipment comprises a casing and N first packaged systems. Each of the first packaged systems comprises a first heat pipe, at least one first heat-dissipating fin, and a first diode light-emitting apparatus. Wherein a heat generated during the operation of the first diode light-emitting apparatus is conducted by the first heat pipe from the flat portion of the first heat pipe to the at least one first heat-dissipating fin, and then is dissipated by the at least one first heat-dissipating fin. In particular, the light-emitting diode illuminating equipment, according to the invention, is very suitable to be used as a street lamp.

Abstract: The invention provides a system-in-package, high power, and highly efficient light-emitting diode lamp. The light-emitting diode lamp, according to the invention, includes a light-guiding device. At least one end of two ends of the light-guiding device, the light, converted by a diode light-emitting device from an electric energy, is emitted into, and then is guided by the light-guiding device outside. The heat generated during light-emitting of the diode light-emitting is conducted by a heat-conducting device from a flat portion thereof to at least one heat-dissipating fin and further dissipated by the at least one heat-dissipating fin.

Abstract: The invention is to provide a method for planishing a sealed end of a pipe body for making a heat pipe. According to a preferred embodiment of the method of the invention, the sealed end of the pipe body is fixed within a female mold. Then, a male mold is inserted into the pipe body. By use of the male mold, the sealed end of the pipe body with respect to the female mold is stamped to form a planished surface at the sealed end of the pipe body. Whereby after the heat pipe is finished, an electronic device is capable of being mounted on the planished surface at the sealed end of the heat pipe.

Abstract: The invention discloses a light-emitting diode illuminating equipment including an illuminating apparatus and a replaceable shell. The replaceable shell is detachable to be engaged to the illuminating apparatus. The illuminating apparatus includes a heat-dissipating plate device, a plurality of diode light-emitting devices, a plurality of heat-conducting devices, and a hollow barrel. The hollow barrel is engaged to the heat-dissipating plate device to form a space for accommodating the diode light-emitting devices and the heat-conducting devices. Depending on different product designs, the replaceable shell is variously detachable to be engaged to the heat-dissipating plate device or the hollow barrel. Therefore, the appearance of the light-emitting diode illuminating equipment of the invention is beautified by the appearance design of the replaceable shell.

Abstract: A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.

Abstract: The invention discloses a light-emitting diode illuminating equipment, including a heat-dissipating plate device, a plurality of heat-conducting devices, a plurality of diode light-emitting apparatuses, a plurality of optical devices, and a hollow barrel. The hollow barrel is engaged to the heat-dissipating plate device to form a space for accommodating the heat-conducting devices, the diode light-emitting apparatuses, and the optical devices. Each of the diode light-emitting apparatuses corresponds to one of the heat-conducting devices. Each of the optical devices corresponds to at least one of the diode light-emitting apparatuses and modulates a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, each of the optical devices includes a cat's-eye-like lens. The cat's-eye-like lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.

Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.