Patents Assigned to Neuralink Corp.
  • Publication number: 20230157779
    Abstract: Disclosed is a brain implant placement apparatus, which includes a base member contoured to rest against a cranium of a patient. The brain implant apparatus including a pivot arm hingedly coupled to the base member and configured to rotate from a first configuration to a second configuration. The brain implant placement apparatus including an implant attachment member coupled to the pivot arm via a rotating attachment mechanism and further comprising a receiving portion configured to removably couple with a brain implant and rotate the brain implant. In the first configuration, the pivot arm is positioned such that the receiving portion of the implant attachment member is facing upward. In the second configuration, the pivot arm is positioned such that the receiving portion of the implant attachment member is facing substantially downwards.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 25, 2023
    Applicant: Neuralink Corp.
    Inventors: Russell N. Ohnemus, Robin E. Young
  • Publication number: 20230154809
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending out of the enclosure. The implantable device includes a PCTFE first portion of an enclosure and a PCTFE second portion of the enclosure. The first and second portions are configured to mate with each other to form the enclosure. A plurality of insulated wires extend between the first and second portions of the enclosure. Each of the insulated wires are parallel to each other and separated by less than 150 micrometers (?m) from a neighboring wire. A thermal weld seam of PCTFE is disposed between the first portion of the enclosure and the second portion of the enclosure and conformally adheres around insulation of each wire such that the enclosure is sealed.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: John W.F. To, Ik Soo Kwon, Donjin Seo, Yu Niu ("Peter") Huang, Jiahao Guo, Robin E. Young, Joshua Scott Hess, Zachary M. Tedoff, Russell N. Ohnemus, Dominic A. Herincx
  • Publication number: 20230148968
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending through a slit in the enclosure. A method for manufacturing the implantable device includes cutting a slit in a piece of polymer and extending a plurality of insulated wires through the slit. Each of the insulated wires are parallel to a neighboring wire of the insulated wires. The piece of polymer is thermally bonded around each wire of the plurality of insulated wires such that the piece of polymer is sealed around insulation of each wire with a portion of each wire extending through the piece of polymer.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: Ik Soo Kwon, Dongjin Seo, John W.F. To
  • Publication number: 20230147266
    Abstract: Accelerated testing apparatuses for implants are described, as well as methods for accelerated testing implants. The accelerated testing apparatus includes a cabinet having multiple bays and a vessel insertable and removable from any of the multiple bays. The vessel includes a watertight basin, a radio-frequency (RF) transparent lid configured to mate with the basin, and a plurality of fixtures within the vessel. Each fixture is adapted to anchor a device-under-test while submersed within the vessel. The accelerated testing apparatus also includes a reservoir disposed within the cabinet, a heater connected with the reservoir, a pump configured to circulate liquid between the reservoir and the vessel, an antenna within the cabinet for communication with the device-under-test, and at least one computer server operatively connected with the antenna.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 11, 2023
    Applicant: Neuralink Corp.
    Inventors: Amir Mazaheripour, Joshua S. Hess, Andrew D. Wong, Amir M. Foudeh, Ava S.K. Greenwood, Alan R. Mardinly, Alejandro J. Tenorio, Ian C.C. Switzer
  • Publication number: 20230137530
    Abstract: A coil formed from a flexible polymer substrate that is printed with metal traces is disclosed in which the flexible substrate has notches that align each loop as the substrate is wound into a ring. The notches are precisely spaced so that the diameter of each loop is well controlled. As the substrate is wound, adhesive is applied along its length to fill gaps between each loop's layer. Ideally, the adhesive has a similar dielectric constant as the polymer substrate. The resulting coil has loops of metal traces separated by precise a thickness of dielectric. The precision in spacing between metal layers and dielectric allows the coil to be designed for self-resonance.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 4, 2023
    Applicant: Neuralink Corp.
    Inventors: Lucia Fauth, Joshua S. Hess
  • Patent number: 11630516
    Abstract: Methods involving interpreting signals from a brain-machine interface (BMI) are described, as well as methods involving adjusting an implanted or wearable BMI device. The method includes receiving neural signals from a brain of a subject into a BMI decoder. The method includes determining an activity change of the subject based on a sensor. The method includes routing the neural signals from a first model to a second model in the BMI decoder based on the determined activity change. The method includes translating, using the second model in the BMI decoder, the neural signals into a command. The method includes sending the command to a controller.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: April 18, 2023
    Assignee: NEURALINK CORP.
    Inventors: Nir Even Chen, Paul A. Merolla, Joseph E. O'Doherty
  • Publication number: 20230077899
    Abstract: The disclosure provides a biological brain-computer interface comprising genetically modified cells engrafted onto an adult mammal (e.g., mouse) above cortical layer 1, forming an artificial cortical layer termed layer zero (L0). Following engraftment, L0 goes through a developmental process characterized by synchronous waves of activity that gradually recede to resemble spontaneous cortical activity. Axons and dendrites from L0 nondestructively infiltrated the host cortex and formed synaptic connections necessary for bidirectional communication with the brain.
    Type: Application
    Filed: December 8, 2021
    Publication date: March 16, 2023
    Applicant: Neuralink Corp.
    Inventors: Alan R. Mardinly, Madison D. Taylor, Alexandra Borog, Kevin S. Smith, Viktor Kharazia, Thomas K. Roseberry, Jean-Charles Neel, Emilienne M. Repak, Timothy J. Gardner, Max J. Hodak, Sunny Y. Weber
  • Publication number: 20230069855
    Abstract: Methods and systems of using a laser beam to weld an object with a non-flat surface, including curved surfaces, are described, where at least one piece of the object is transparent. An optical guide with a flat surface and an interface surface is placed on a piece of an object to welded. The interface surface is fabricated to form-fit the non-flat surface of the object to be welded, and is opposite the flat surface. A liquid optical medium is applied between the non-flat surface and the interface surface, filling any gaps or surface defects. The laser beam is then transmitted through the optical guide, liquid optical medium, and into the object to be welded, to a location to be welded. The laser beam then welds the object to be welded at pre-determined points.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Neuralink Corp
    Inventors: Joshua S. Hess, Emilienne M. Repak
  • Publication number: 20230063165
    Abstract: A space-saving configuration for electronics is disclosed in which at least four circuit boards are arranged to form sides of a five-or-greater sided geometric prism that are perpendicular to a common plane. That is, they are stood up on their sides and connected with flex cable to approximate a cylinder. Each circuit board can include one or more sides with electrical components. The circuit boards make up at least half of the five-or-greater sided geometric prism such that the circuit boards wrap at least halfway around. A common connector on one of the circuit boards can be configured to receive power from an underlying motherboard, and flex cables connecting adjacent circuit boards in series distribute power received from the connector to each of the circuit boards in series.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 2, 2023
    Applicant: Neuralink Corp.
    Inventors: Joshua S. Hess, Mark J. Smith
  • Patent number: 11582072
    Abstract: A three-level encoding transmitter is disclosed in which a transmitter circuit is configured to receive an input data signal including binary data and transmit an encoded data signal. The transmitter circuit can include an inverter circuit configured transmit first and second voltages for each logical level of the binary data. A transmission control circuit can cause the inverter circuit to transmit the voltages or deactivate the inverter circuit based on a first control signal. The transmitter circuit can further include an idle circuit configured to transmit an idle voltage between the first and second voltages when there is no data transmission. The idle circuit may transmit the idle voltage based on a second control signal. The first and second control signals may be configured to only be active when the other is inactive.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: February 14, 2023
    Assignee: NEURALINK CORP.
    Inventors: SungWon Chung, Dongjin Seo
  • Patent number: 11446084
    Abstract: The disclosure provides an apparatus and methods for performing a piotomy on a mammal comprising: performing a craniotomy to remove the skull and expose dura mater; removing the dura mater and arachnoid mater to expose subarachnoid space; and performing a piotomy using a laser to create a hole and expose the cerebral cortex.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: September 20, 2022
    Assignee: Neuralink Corp.
    Inventors: Dalton James Colen, Shivani Shah
  • Patent number: 11444056
    Abstract: Disclosed is a sandwich assembly containing a thin film electrode array for use with high density electrodes. To minimize the volume required by the associated electronics, the electrode array and integrated circuits are sandwiched over a Printed Circuit Board (PCB), which may have other integrated circuits on an opposite side. Among other things, the disclosed apparatus, system, and method improve over previous systems by providing holes and vias that facilitate communication between a custom chip above the PCB and a field-programmable gate array (FPGA) below. The thin film electrode array can be fastened by bucking a pillar of stacked gold or other metal balls to rivet the thin film flex circuit. The system can include a thin film array having embedded wire traces and holes, a PCB having vias aligned with the holes, chips including an analog-to-digital converter (ADC) sandwiching the thin film, and solder connections from the chips through the holes to the vias.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: September 13, 2022
    Assignee: Neuralink Corp.
    Inventors: Supin Chen, Camilo A. Diaz-Botia, Dongjin Seo, Vanessa M. Tolosa
  • Patent number: 11291508
    Abstract: Systems and methods that use computer vision techniques in connection with robotic surgery are discussed. A robotic surgery system may include an implantable device engagement sub-system, a targeting sub-system, and/or an insertion verification sub-system. The system may use computer vision techniques to facilitate implanting a micro-manufactured bio-compatible electrode device in biological tissue (e.g., neurological tissue such as the brain) using robotic assemblies. The system can attach, via robotic manipulation, the electrode to an engagement element of an insertion needle.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: April 5, 2022
    Assignee: NEURALINK, CORP.
    Inventors: Ian M. O'Hara, Vikash Gilja, Kenny Sharma, Timothy L. Hanson, Timothy J. Gardner
  • Publication number: 20220100688
    Abstract: The embodiments disclosed herein relate to chips used to receive and process neurological events in brain matter as captured by electrodes. Such chips may include an array of amplifiers and electrodes to receive neurological voltage signals, the chip including a config circuitry in communication with the array of amplifiers and a controller, the config circuitry configured to receive program instructions and instruct the amplifiers of a voltage threshold and instruct the controller to pass on signals from only specific rows and columns of amplifiers, the controller in communication with the array of amplifiers, the controller configured to packetize the neurological voltage signals into data packets.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Neuralink Corp.
    Inventors: Dongjin Seo, Paul A. Merolla, Manuel Alejandro Monge Osorio
  • Patent number: 11216400
    Abstract: The embodiments disclosed herein relate to chips used to receive and process neurological events in brain matter as captured by electrodes. Such chips may include an array of amplifiers and electrodes to receive neurological voltage signals, the chip including a config circuitry in communication with the array of amplifiers and a controller, the config circuitry configured to receive program instructions and instruct the amplifiers of a voltage threshold and instruct the controller to pass on signals from only specific rows and columns of amplifiers, the controller in communication with the array of amplifiers, the controller configured to packetize the neurological voltage signals into data packets.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: January 4, 2022
    Assignee: NEURALINK CORP.
    Inventors: Dongjin Seo, Paul A. Merolla, Manuel Alejandro Monge Osorio
  • Publication number: 20210346687
    Abstract: A system and method for implanting devices into biological tissue (e.g., brain tissue). The system may include a biocompatible probe, an integrated circuit (IC) chip tethered to the probe, a cartridge comprising a temporary attachment surface by which the probe is removably coupled to the cartridge, a needle to reversibly engage with the probe, a robotic arm to hold the needle, and a microprocessor controller. The microprocessor controller may control the robotic arm and the needle to remove the probe from the temporary attachment surface using the needle, pierce the biological tissue with the needle and the probe, withdraw the needle while leaving the probe within the biological tissue, and detach the IC chip from the cartridge, leaving the IC chip with the biological tissue.
    Type: Application
    Filed: June 28, 2021
    Publication date: November 11, 2021
    Applicant: Neuralink Corp.
    Inventors: Robin E. Young, Philip N. Sabes
  • Patent number: 11103695
    Abstract: A system and method for implanting devices into biological tissue (e.g., brain tissue). The system may include a biocompatible probe, an integrated circuit (IC) chip tethered to the probe, a cartridge comprising a temporary attachment surface by which the probe is removably coupled to the cartridge and a fastener for removably coupling the IC chip to the cartridge, a needle to reversibly engage with the probe, a robotic arm to hold the needle, a camera, and a microprocessor controller. The microprocessor controller may control the robotic arm and the needle using the to remove the probe from the temporary attachment surface using the needle, pierce the biological tissue with the needle and the probe, withdraw the needle while leaving the probe within the biological tissue; and detach the IC chip from the cartridge, leaving the IC chip with the biological tissue, the IC chip still tethered to the probe.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: August 31, 2021
    Assignee: NEURALINK CORP.
    Inventors: Robin E. Young, Philip N. Sabes
  • Patent number: 11107703
    Abstract: Methods of manufacturing a biocompatible, hermetic feedthrough monolithically integrated with a biocompatible ribbon cable are described, as well as the resulting devices themselves. The hermetic feedthrough is created by placing glass over a mold of doped silicon or other material with a higher melting temperature than the glass and heating it to reflow the glass into the mold. The glass is then ground or otherwise removed to reveal a flat surface, and tiny pillars that were in the mold are isolated in the glass to form electrically conductive vias. The flat surface is used to cast a polymer and build up a ribbon cable, photolithographically or otherwise, that is monolithically attached to the vias.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: August 31, 2021
    Assignee: Neuralink Corp.
    Inventors: Vanessa M. Tolosa, Camilo A. Diaz-Botia, Supin Chen, Felix Deku, Yu Niu Huang, Mark J. Hettick, Zachary M. Tedoff
  • Publication number: 20210012909
    Abstract: A method is described for real-time detecting and classifying of a characteristic signal, such as a neural spike, and forwarding information for further processing if it meets certain criteria. A system (e.g., an on-chip system implanted in a subject's cranium with limited processing power) receives an electrical biological signal. The system filters the signal to generate a filtered signal and fits the filtered signal to a model. The system identifies a set of fit values based on the model, the set of fit values comprising a plurality of sample amplitude values and a respective plurality of time values. Based on the fit values, the system computes a set of characteristic values. The system compares the characteristic values to a corresponding set of threshold values. Based on the comparison, the system determines whether the received biological signal corresponds to a neural spike and, if a spike is detected, forwards on information.
    Type: Application
    Filed: July 9, 2020
    Publication date: January 14, 2021
    Applicant: Neuralink Corp.
    Inventors: Thong-Wei Koh, Paul A. MEROLLA, Sonal PINTO, Dongjin SEO
  • Publication number: 20210011870
    Abstract: The embodiments disclosed herein relate to chips used to receive and process neurological events in brain matter as captured by electrodes. Such chips may include an array of amplifiers and electrodes to receive neurological voltage signals, the chip including a config circuitry in communication with the array of amplifiers and a controller, the config circuitry configured to receive program instructions and instruct the amplifiers of a voltage threshold and instruct the controller to pass on signals from only specific rows and columns of amplifiers, the controller in communication with the array of amplifiers, the controller configured to packetize the neurological voltage signals into data packets.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: Neuralink Corp.
    Inventors: Dongjin Seo, Paul A. Merolla, Manuel Alejandro Monge Osorio