Patents Assigned to NGK Insulators
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Patent number: 11168033Abstract: A method for drying at least one unfired columnar honeycomb formed body comprising a raw material composition containing at least one raw material of ceramics, water and at least one heat-gelling binder, and cells defined by partition walls comprising flow paths from a first end surface to a second end surface. The method comprising drying the honeycomb formed body by passing hot gas satisfying 0.8?T2/T1?3.3, where T1 represents a gelation temperature of the binder (° C.) and T2 represents a wet-bulb temperature of the hot gas (° C.) through the flow paths from the first end surface and out the second end surface, while surrounding the honeycomb formed body with a correction mold to correct the shape of the honeycomb formed body during drying.Type: GrantFiled: March 19, 2018Date of Patent: November 9, 2021Assignee: NGK Insulators, Ltd.Inventors: Shuhei Kuno, Hironori Takahashi
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Patent number: 11168034Abstract: A tray including a plate-shaped portion for arranging a plurality of prismatic honeycomb structures having an outer peripheral side surface and partition walls provided on an inner peripheral side of the outer peripheral side surface, the partition walls partitioning a plurality of cells forming flow paths from a first end surface to a second end surface, the plate-shaped portion including: a plurality of corrugated plate-shaped placing portions for placing the prismatic honeycomb structures with the outer peripheral side surface in contact with the placing portions; flat plate-shaped non-placing portions adjacent to each of the corrugated plate-shaped placing portions; and partition walls erected between adjacent corrugated plate-shaped placing portions to prevent the outer peripheral side surfaces of adjacent prismatic honeycomb structures from contacting each other.Type: GrantFiled: November 13, 2020Date of Patent: November 9, 2021Assignee: NGK Insulators, Ltd.Inventor: Michio Suzuki
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Patent number: 11169186Abstract: A heat-resistance element includes: a heat-resistant substrate including a ceramic material; one or more power wires embedded in the heat-resistant substrate; and a coil structure that is configured by a coil wire extending between start and end points and includes coil segments. The coil segment includes or corresponds to one winding of the coil wire. The coil segment includes: a first conductor extending along the power wire; a second conductor arranged farther from the one or more power wires than the first conductor, the second conductor extending along the power wire; a first connection wire coupling the first and second conductors in the same coil segment; and a second connection wire coupling first and second conductors of adjacent coil segments in the circumferential direction, all of which are embedded in the heat-resistant substrate, and at least the first conductor and the second conductor are not exposed from the heat-resistant substrate.Type: GrantFiled: May 29, 2019Date of Patent: November 9, 2021Assignee: NGK Insulators, Ltd.Inventor: Toshikatsu Kashiwaya
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Patent number: 11167279Abstract: A plugged honeycomb structure, including: a pillar-shaped honeycomb structure body including porous partition walls; and plugging portions disposed at open ends of cells at an inflow end face side or at an outflow end face side, wherein a pore diameter corresponding to the cumulative pore volume of 10% is D10, a pore diameter corresponding to the cumulative pore volume of 30% is D30, a pore diameter corresponding to the cumulative pore volume of 50% is D50, a pore diameter corresponding to the cumulative pore volume of 70% is D70, a pore diameter corresponding to the cumulative pore volume of 90% is D90, the pore diameter D10 is 6 ?m or more, the pore diameter D90 is 58 ?m or less, and the plugged honeycomb structure satisfies the relationship of Expression (1). 0.35?(D70?D30)/D50?1.Type: GrantFiled: February 27, 2018Date of Patent: November 9, 2021Assignee: NGK Insulators, Ltd.Inventor: Tatsuyuki Kuki
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Publication number: 20210341234Abstract: A heat dissipation member dissipates heat generated at a heat source. The heat dissipation member may include a substrate having a porosity ratio of 5 volume % or less; and an inorganic porous layer disposed on a surface of the substrate, wherein the inorganic porous layer may have a porosity ratio ranging from 25 volume % or more to 85 volume % or less and have lower thermal conductivity than the substrate. In this heat dissipation member, 15 mass % or more of constituents of the inorganic porous layer may be alumina.Type: ApplicationFiled: July 7, 2021Publication date: November 4, 2021Applicant: NGK Insulators, Ltd.Inventors: Megumi FUJISAKI, Takahiro TOMITA, Yusuke OSHITA
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Publication number: 20210336248Abstract: A lithium composite oxide sintered body plate includes a porous structure in which a plurality of primary particles of a lithium composite oxide having a layered rock-salt structure are bonded is included, in which a porosity is 15 to 50%, a ratio of the primary particles whose average inclination angle being an average value of angles between a (003) plane of the plurality of primary particles and a plate surface of the sintered body plate is more than 0° and 30° or less is 60% or more, one or more additive elements selected from Nb, Ti, W are contained, and an addition amount of the one or more additive elements to an entire of the sintered body plate is 0.01 wt % or more and 2.0 wt % or less.Type: ApplicationFiled: July 6, 2021Publication date: October 28, 2021Applicant: NGK Insulators, Ltd.Inventors: Nobuhiro MORISAKI, Yukinobu YURA, Naoto OHIRA, Eiji NAKASHIMA, Kengo OISHI
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Publication number: 20210331450Abstract: A composite member may include an inorganic porous layer on a surface of metal. The inorganic porous layer may include ceramic fibers. The inorganic porous layer may be constituted of 15 mass % or more of an alumina constituent and 45 mass % or more of a titania constituent.Type: ApplicationFiled: July 7, 2021Publication date: October 28, 2021Applicant: NGK Insulators, Ltd.Inventors: Megumi FUJISAKI, Takahiro TOMITA, Yusuke OSHITA
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Patent number: 11158906Abstract: Provided is a layered double hydroxide (LDH) separator comprising a porous substrate made of a polymeric material; and a LDH with which pores of the porous substrate are plugged. A central region along the thickness of the LDH separator has a lower mean porosity than peripheral regions along the thickness of the LDH separator.Type: GrantFiled: June 17, 2020Date of Patent: October 26, 2021Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Naohito Yamada, Sota Okochi, Shohei Yokoyama, Naoko Inukai
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Patent number: 11156400Abstract: A method for manufacturing a honeycomb structure, includes: a step of manufacturing a honeycomb formed body to manufacture a non-fired honeycomb formed body, the non-fired honeycomb formed body including a raw material composition containing a ceramic raw material, 0.5 to 5.0 mass % of pore former and water; an induction drying step of drying the manufactured non-fired honeycomb formed body by induction drying to obtain a honeycomb dried body; and a firing step of firing the obtained honeycomb dried body to obtain a honeycomb structure. The induction drying step is to remove 20 to 80% of the entire water that the non-fired honeycomb formed body contained before drying by induction drying to obtain a first dried honeycomb formed body, then turn the first dried honeycomb formed body upside down and remove the residual water by further induction drying to obtain the honeycomb dried body.Type: GrantFiled: March 15, 2018Date of Patent: October 26, 2021Assignee: NGK Insulators, Ltd.Inventor: Kensuke Okumura
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Patent number: 11158553Abstract: A package includes a base substrate, a frame, and a lead frame. The base substrate is made of metal, and includes a mounting area on which a semiconductor element is to be mounted and a frame area surrounding the mounting area. The frame is provided on the frame area of the base substrate, and includes a first surface facing the frame area and a second surface opposite to the first surface. The lead frame is joined to the second surface of the frame. The frame includes a plurality of dielectric layers having a layered structure and an element connector to be electrically connected to the semiconductor element. The plurality of dielectric layers include a first dielectric layer having first permittivity and a second dielectric layer having second permittivity different from the first permittivity.Type: GrantFiled: April 23, 2020Date of Patent: October 26, 2021Assignee: NGK Insulators, Ltd.Inventor: Yoshitsugu Wakazono
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Patent number: 11158858Abstract: Provided is a positive electrode structure including: a positive electrode current collector composed of a tabular nickel foam and having a tabular coated portion and an uncoated portion extending from an outer peripheral portion of the coated portion; a positive electrode active material containing nickel hydroxide and/or nickel oxyhydroxide incorporated into the coated portion of the positive electrode current collector; and a nonwoven fabric made of a polymer material and covering the coated portion of the positive electrode current collector from both sides. The positive electrode active material is not present in the uncoated portion of the positive electrode current collector. The nonwoven fabric covers an entirety of the coated portion and extends from the outer peripheral portion of the coated portion to form a surplus region, and the surplus region is sealed so as to close all around the outer peripheral portion of the coated portion.Type: GrantFiled: March 19, 2021Date of Patent: October 26, 2021Assignee: NGK Insulators, Ltd.Inventors: Junki Matsuya, Kenshin Kitoh, Takeshi Yagi
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Publication number: 20210323882Abstract: A honeycomb structure includes a pillar-shaped honeycomb structure body having a porous partition wall so as to surround a plurality of cells extending from a first end face to a second end face, and a circumferential coating layer composed of a circumferential coating material coated on at least a part of circumference of the honeycomb structure body, wherein the circumferential coating layer has a printing area for printing on the surface thereof, the printing area has a lightness (L*) in L*a*b* color space (CIE1976) defined by International Commission on Illumination (CIE) of 35 or more, and the printing area has a surface roughness Ra of 30 ?m or less.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Applicant: NGK Insulators, Ltd.Inventor: Hiroaki SUZUKI
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Patent number: 11148128Abstract: A honeycomb structure, including: a pillar-shaped honeycomb structure body having a first end face and a second end face and including a porous partition wall disposed so as to surround a plurality of cells, the plurality of cells extending from the first end face to the second end face and serving as a through channel of fluid, wherein the partition wall has a porosity of 45 to 65%, the partition wall has an average pore diameter of 15 to 25 ?m, and the partition wall has a cumulative pore volume, which is measured by mercury intrusion porosimetry, such that a pore volume ratio of pores having pore diameters of 10 ?m or less relative to the overall pore volume of the partition wall is 10% or less, and a pore volume ratio of pores having pore diameters of 40 ?m or more is 10% or less.Type: GrantFiled: February 21, 2019Date of Patent: October 19, 2021Assignee: NGK Insulators, Ltd.Inventor: Hirotaka Yamamoto
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Patent number: 11152195Abstract: A MgO-based ceramic film according to the present invention contains crystalline phases of MgO and MgAl2O4, and Al is dissolved in the MgO to form a solid-solution. The ceramic film exhibits a diffraction peak representing the (200) plane of MgO at an angle 2? of more than 42.92° in CuK? XRD measurement. A shoulder preferably appears on the higher angle side of the peak representing the (200) plane of MgO. The mass ratio MgO/Al2O3 of MgO to Al2O3 converted from Mg and Al in terms of oxides is preferably higher than 2.33.Type: GrantFiled: December 21, 2016Date of Patent: October 19, 2021Assignee: NGK Insulators, Ltd.Inventors: Yosuke Sato, Katsuhiro Inoue, Yuji Katsuda
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Patent number: 11152668Abstract: Provided is a layered-double-hydroxide-(LDH) containing composite material including a porous substrate and a high density LDH-containing functional layer on and/or in the porous substrate. The LDH-containing composite material of the present invention includes the porous substrate and the functional layer formed on and/or in the porous substrate. The functional layer contains a layered double hydroxide represented by the general formula M2+1?xM3+x(OH)2An?x/n.mH2O (where M2+ represents a divalent cation, M3+ represents a trivalent cation, An? represents an n-valent anion, n represents an integer not less than 1, x represents a value of 0.1 to 0.4, and m represents a value not less than 0) and has water impermeability.Type: GrantFiled: April 10, 2018Date of Patent: October 19, 2021Assignee: NGK Insulators, Ltd.Inventors: Megumi Fujisaki, Naomi Saito, Naohito Yamada, Sho Yamamoto
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Patent number: 11142485Abstract: A circumferential coating material to be applied to a circumferential surface of a honeycomb structure made of ceramics formed by extrusion, the circumferential coating material including a ceramic raw material that forms a circumferential coating layer, wherein the ceramic raw material contains: a ceramic mixture of first ceramic particles having particulate shapes, and second ceramic particles having particulate shapes and an average particle diameter different from an average particle diameter of the first ceramic particles; and a fiber material having an elongated strip-like shape, wherein the ceramic mixture has particle size distribution including at least two local maximum values, and the fiber material has an average fiber length ranging from 30 to 100 ?m in a longitudinal direction.Type: GrantFiled: February 27, 2018Date of Patent: October 12, 2021Assignee: NGK Insulators, Ltd.Inventors: Shingo Tokuda, Shuji Ueda
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Patent number: 11145935Abstract: Provided is a layered double hydroxide (LDH) separator including a porous substrate made of a polymeric material; and a LDH with which pores of the porous substrate are plugged. The LDH separator has a mean porosity of 0.03% to less than 1.0%.Type: GrantFiled: June 17, 2020Date of Patent: October 12, 2021Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Naohito Yamada, Sota Okochi, Shohei Yokoyama, Naoko Inukai
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Patent number: 11135553Abstract: A porous support includes a base body, a supporting layer, and a topmost layer. The supporting layer is disposed between the base body and the topmost layer, and makes contact with the topmost layer. A ratio of a porosity of the topmost layer to a porosity of the supporting layer is greater than or equal to 1.08. A ratio of a thickness of the topmost layer to a thickness of the supporting layer is less than or equal to 0.9.Type: GrantFiled: September 6, 2018Date of Patent: October 5, 2021Assignee: NGK Insulators, Ltd.Inventors: Makoto Miyahara, Kenji Yajima
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Patent number: 11136271Abstract: Aluminum nitride particles used as a material of an aluminum nitride sintered compact are disclosed. The aluminum nitride particles may have a same crystal orientation. The aluminum nitride particles each have an aspect ratio of 3 or more, a plate-like shape, a planar length of 0.6 ?m or more and 20 ?m or less, and a thickness length of 0.05 ?m or more and 2 ?m or less.Type: GrantFiled: September 19, 2019Date of Patent: October 5, 2021Assignee: NGK Insulators, Ltd.Inventors: Hiroharu Kobayashi, Kazuki Iida, Yoshimasa Kobayashi
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Patent number: 11135576Abstract: A honeycomb structure includes plugged honeycomb segments, circumferential bonding layers, central bonding layers and a circumferential wall. An angle ? between a first direction of extension of at least one of the circumferential bonding layers and a second direction of extension of a line segment that connects a centroid of the honeycomb structure and an intersection point at which the circumferential bonding layer in the first direction intersects with the circumferential wall is 25 to 45°, and the outermost segment bonded by the circumferential bonding layer in the first direction exists on a parallel line to a direction of extension of the central bonding layer passing through the centroid.Type: GrantFiled: February 26, 2019Date of Patent: October 5, 2021Assignee: NGK Insulators, Ltd.Inventor: Kazuya Yuki