Abstract: A coated rare earth-iron-nitrogen-based magnetic powder including: a core region; a first coating portion provided outside the core region; and a second coating portion, the core region containing R, Fe, and N, where R represents at least one selected from the group consisting of Y, Ce, Pr, Nd, Gd, Tb, Dy, Ho, Er, Tm, Lu, and Sm, and if Sm is present, Sm constitutes less than 50 atm % of the total R content, the powder including, in an order from the core region, the first coating portion containing P and R, an average atomic concentration of R in the first coating portion being higher than and not higher than twice an average atomic concentration of R in the core region, and the second coating portion having average atomic concentrations of P and R lower than those in the first coating portion, respectively, and containing Fe.

Abstract: The halophosphate phosphor includes a halophosphate including an alkaline earth metal including at least calcium; europium; and a halogen including at least chlorine. An elution amount of chlorine ions after the halophosphate phosphor is brought into contact with 10 times by mass of pure water at 85° C. for five hours is 7 ppm or less.

Abstract: A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.

Abstract: A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.

Abstract: A method for manufacturing a phosphor ceramic, the method including preparing a precursor including aluminum nitride, and forming the phosphor ceramic by bringing the precursor into contact with a gas containing manganese.

Abstract: A light-emitting device includes a base member having a recess inside which a light-emitting element is disposed; and a light-reflective member continuously disposed on an upper surface of the bottom portion and at least a portion of an inner lateral surface of a wall portion inside the recess of the base member, in a cross-sectional view, the inner lateral surface of the wall portion having a first surface, a second surface located above the first surface, and a third surface connecting the first surface and the second surface, a shortest distance between the second surface and the light-emitting element being larger than a shortest distance between the first surface and the light-emitting element, the third surface being located below an upper surface of the light-emitting element, and an upper end of the light-reflective member being located below an upper surface of the wall portion.

Abstract: A light-emitting module includes first and second light sources, first and second light guide parts, and a first light-modulating member. The first light guide part includes a first A-major surface, a first B-major surface, a first side surface positioned between the first A-major surface and the first B-major surface, and a first hole portion in which the first light source is disposed. The second light guide part includes a second A-major surface, a second B-major surface, a second side surface positioned between the second A-major surface and the second B-major surface, the second side surface facing the first side surface, and a second hole portion in which the second light source is disposed. The first light-modulating member is positioned at an upper side of the first A-major surface. The first light-modulating member overlaps the first A-major surface and the first side surface when viewed in top-view.

Abstract: A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least

Abstract: A light source device includes: a plurality of independently operable light emitting devices; a first lens facing the light emitting devices; and a second lens facing the first lens. A lower face of the first lens facing the light emitting devices includes: an entrance part located in a center where light from the light emitting devices enters, and a light guide part located outward of the entrance part and configured to guide light entering the entrance part. A lower face of the second lens facing the first lens includes a Fresnel lens face including a plurality of annular protruding portions.

Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.

Abstract: A light-emitting module includes a light source part, a light-transmitting member including a first light-transmitting part and a second light-transmitting part, the second light-transmitting part is positioned at an upper side of the light source part and the first light-transmitting part, and a light-adjusting member located at an upper side of the light source part, the first light-transmitting part, and the second light-transmitting part, wherein the first light-transmitting part contacts a lateral surface of the light source part, the light-adjusting member includes a through-hole positioned away from the light source part in a plan view, the light-transmitting member includes a recess communicating with the through-hole, and at least a portion of the recess is positioned lower than a lower surface of the light-adjusting member.

Abstract: An image display device includes a plurality of driving circuits disposed on a substrate, and a plurality of light emitting elements corresponding to a plurality of pixels respectively. Each of the plurality of driving circuits being configured to provide a driving current to each of the plurality of light emitting elements and to control the driving current by a pulse amplitude modulation and a pulse width modulation. The driving circuit being configured using TFTs.

Abstract: A method, including: preparing at least one magnetic powder having an average particle size that is at least 1 ?m but not more than 10 ?m, at least one thermosetting resin, and at least one curing agent, wherein at least one of the thermosetting resin and the curing agent includes at least one monomer having a melting point that is higher than 70° C. but not higher than 140° C., and wherein an amount of the monomer having the melting point that is higher than 70° C. but not higher than 140° C. is at least 33% by volume but not more than 100% by volume of a combined amount of the thermosetting resin and the curing agent; and obtaining a magnetic powder-containing resin composition by kneading the magnetic powder, the thermosetting resin, and the curing agent at a temperature of higher than 70° C. but not higher than 140° C. and then lowering the temperature.

Abstract: A method of manufacturing a nitride semiconductor light-emitting element configured to emit deep ultraviolet light includes: providing a semiconductor structure comprising: an n-side semiconductor layer comprising an n-side contact layer comprising aluminum, gallium, and nitrogen, a p-side semiconductor layer, and an active layer between the n-side semiconductor layer and the p-side semiconductor layer; forming an n-side electrode, which comprises forming, successively from an n-side contact layer side: a first layer located above the n-side contact layer and comprising a titanium layer, a second layer located above the first layer and comprising a silicon-containing aluminum alloy layer, and a third layer located above the second layer and comprising a tantalum layer and/or a tungsten layer; and heating the n-side electrode.

Abstract: A planar light source includes a light guide member having a through hole, a light source, a first light adjusting member, a second light adjusting member, and a light transmissive member. The first light adjusting member having reflectivity and transmissivity with respect to light from the light source is disposed on or above an upper face of the light source in the through hole. The second light adjusting member having reflectivity and transmissivity with respect to the light from the light source is disposed above and apart from the first light adjusting member. The first light transmissive member having a higher transmissivity with respect to the light from the light source than the transmissivities of the first and second light adjusting members is disposed between the first light adjusting member and the second light adjusting member, and between a lateral face of the light source and the light guide member.

Abstract: A light emitting device includes a light emitting element, and a fluorescent member including a phosphor. The light emitting device satisfies any of Condition (A): a correlated color temperature of light emission of the light emitting device is within a range of 4500 K or more and 7500 K or less, a content of a first phosphor is within a range of 29 mass % or more and 90 mass % or less, and a melanopic ratio is within a range of 1.0 or more and 1.4 or less; Condition (B): a correlated color temperature of light emission of the light emitting device is within a range of 2500 K or more and less than 4500 K, a content of a first phosphor is within a range of 25 mass % or more and 90 mass % or less, and a melanopic ratio is within a range of 0.7 or more and 1.

Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.

Abstract: An upper surface of a lateral wall portion of a substrate includes a first upper surface portion exposed from a light-transmissive member in a first region, a second upper surface portion exposed from the light-transmissive member in a second region, and a third upper surface portion located between the first upper surface portion and the second upper surface portion in a second direction, and an upper surface of an outer peripheral portion of the light-transmissive member includes a first outer peripheral surface portion located in the first region. An area of the first upper surface portion of the lateral wall portion is greater than an area of the first outer peripheral surface portion of the outer peripheral portion of the light-transmissive member. A bonding member is disposed between the third upper surface portion of the lateral wall portion and the first lower surface portion of the light-transmissive member.

Abstract: A light source includes a plurality of light emitting elements, a light blocking member and a plurality of light-transmissive members. The light blocking member collectively supports the plurality of light emitting elements with the light blocking member being disposed in regions between the plurality of light emitting elements and in an outer periphery region located outwardly of the plurality of light emitting elements in a plan view. An upper surface of each of the plurality of the light emitting elements is exposed from the light blocking member. The plurality of light-transmissive members include a plurality of first light-transmissive members respectively disposed on the plurality of light emitting elements, and a second light-transmissive member disposed on the light blocking member in the outer periphery region.

Abstract: A light emitting device includes: a substrate including a main surface; a first projection positioned on the main surface, the first projection including an upper surface and first and second lateral surfaces, wherein the first lateral surface of the first projection comprises a first reflective part, and the second lateral surface of the first projection comprises a second reflective part; a first laser element positioned on the main surface at a first reflective part side with respect to the first projection, the first laser element being configured to irradiate first laser light to the first reflective part; a second laser element positioned on the main surface at a second reflective part side with respect to the first projection, the second laser element being configured to irradiate second laser light to the second reflective part; and a first optical member bonded to the upper surface of the first projection.