Patents Assigned to Nikko Materials Co., Ltd.
  • Patent number: 11485124
    Abstract: A laminating apparatus that prevents partial protrusion of a film during pressing and ensures the uniformity of the thickness of a resulting laminate is provided. The laminating apparatus includes a pressing device for pressing a substrate and a film (a workpiece). The pressing device includes a press block movable back and forth, a pressing plate mountable to the press block, a plurality of heat sources (cartridge heaters) capable of heating the pressing plate, and a control system set up to perform heating control on the heat sources. The heat sources are arranged so as to be able to separately heat a central portion of the pressing plate and a peripheral portion thereof annularly surrounding the central portion.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: November 1, 2022
    Assignee: NIKKO-MATERIALS CO., LTD.
    Inventors: Kazutoshi Iwata, Yoshiaki Honma, Takeshi Yamaguchi, Taihei Matsumoto
  • Patent number: 11446913
    Abstract: Provided is a laminating apparatus configured to improve the uniformity of the thickness of a laminate to be obtained to improve the yield of a product, such as a laminate. The laminating apparatus includes a pressing device including a first press block that is advanceable and retreatable, a second press block arranged to face the first press block, a first pressing rubber mounted inside the first press block, and a second pressing rubber mounted inside the second press block, the first pressing rubber and the second pressing rubber facing each other, the first pressing rubber having formed on a surface thereof facing the second pressing rubber a convex frame configured to surround a peripheral edge portion thereof.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: September 20, 2022
    Assignee: NIKKO-MATERIALS CO., LTD.
    Inventors: Kazutoshi Iwata, Yoshiaki Honma, Takeshi Yamaguchi, Taihei Matsumoto
  • Patent number: 11331892
    Abstract: A laminating apparatus for improving the uniformity of the thickness of a resulting laminate to improve the yield of products such as laminates is provided. A pressing device includes: a first press block movable back and forth; a second press block disposed in opposed relation to the first press block; a first pressing plate mounted to the inside of the first press block; and a second pressing plate mounted to the inside of the second press block. The first pressing plate and the second pressing plate are opposed to each other. A surface of the first pressing plate which is opposed to the second pressing plate has a peripheral portion formed into a tapered surface in such a manner that the distance from the second pressing plate increases in an outward direction.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: May 17, 2022
    Assignee: NIKKO-MATERIALS CO., LTD.
    Inventors: Kazutoshi Iwata, Yoshiaki Honma, Takeshi Yamaguchi, Taihei Matsumoto
  • Patent number: 11325365
    Abstract: A laminating apparatus is provided, which is capable of producing a laminate having a highly planarized surface. The laminating apparatus is arranged to laminate a film on an irregular surface of a substrate having irregularities, and includes a vacuum laminating device which brings the film into close conformal contact with the substrate under reduced pressure to form a first temporary laminate, a first flat press device which presses the first temporary laminate to form a second temporary laminate having a substantially planarized irregular surface, and a second flat press device which presses the second temporary laminate under different conditions from the first flat press device to form a product laminate having a planar surface.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: May 10, 2022
    Assignee: NIKKO-MATERIALS CO., LTD.
    Inventors: Kazutoshi Iwata, Yoshiaki Honma, Takeshi Yamaguchi
  • Publication number: 20210370656
    Abstract: A laminating apparatus for improving the uniformity of the thickness of a resulting laminate to improve the yield of products such as laminates is provided. A pressing device includes: a first press block movable back and forth; a second press block disposed in opposed relation to the first press block; a first pressing plate mounted to the inside of the first press block; and a second pressing plate mounted to the inside of the second press block. The first pressing plate and the second pressing plate are opposed to each other. A surface of the first pressing plate which is opposed to the second pressing plate has a peripheral portion formed into a tapered surface in such a manner that the distance from the second pressing plate increases in an outward direction.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Applicant: Nikko-Materials Co., Ltd.
    Inventors: Kazutoshi IWATA, Yoshiaki HONMA, Takeshi YAMAGUCHI, Taihei MATSUMOTO
  • Publication number: 20210362480
    Abstract: Provided is a laminating apparatus configured to improve the uniformity of the thickness of a laminate to be obtained to improve the yield of a product, such as a laminate. The laminating apparatus includes a pressing device including a first press block that is advanceable and retreatable, a second press block arranged to face the first press block, a first pressing rubber mounted inside the first press block, and a second pressing rubber mounted inside the second press block, the first pressing rubber and the second pressing rubber facing each other, the first pressing rubber having formed on a surface thereof facing the second pressing rubber a convex frame configured to surround a peripheral edge portion thereof.
    Type: Application
    Filed: May 17, 2021
    Publication date: November 25, 2021
    Applicant: Nikko-Materials Co., Ltd.
    Inventors: Kazutoshi IWATA, Yoshiaki HONMA, Takeshi YAMAGUCHI, Taihei MATSUMOTO
  • Patent number: 10239299
    Abstract: A laminating apparatus includes workpiece transport units, a vacuum laminating device and a flat press device. The flat press device includes a ball screw having a screw shaft and supporting a first one of a pair of pressing elements, a servomotor connected to the screw shaft of the ball screw, a gap measuring device (linear scale) for measuring a distance between the first pressing element and the second pressing element, and a pressing gap control system for moving the first pressing element to a position in which a predetermined gap is defined between the first pressing element and the second pressing element to stop the first pressing element at that position. The pressing gap control system changes the RPM of the servomotor, based on information on the distance between the first and second pressing elements which is provided from the gap measuring device.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: March 26, 2019
    Assignee: NIKKO-MATERIALS CO., LTD.
    Inventors: Kazutoshi Iwata, Yoshiaki Honma
  • Patent number: 10081170
    Abstract: A laminating apparatus for a provisionally laminated body is provided and is configured to form an end laminated body including one of a first resin film and a second resin film conforming to protruding and recessed portions of a substrate. The laminating apparatus may include first and second laminating mechanisms. The first laminating mechanism may include a first enclosed space forming receiver, a depressurizer, a heater, and a first pressure laminator to form an intermediate laminated body from the provisionally laminated body. The second laminating mechanism may include a second enclosed space forming receiver, and a second pressure laminator to form the end laminated body from the intermediate laminated body.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: September 25, 2018
    Assignees: NIKKO-MATERIALS CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Ryoichi Yasumoto, Kazutoshi Iwata, Kinya Kodama, Grigoriy Basin
  • Publication number: 20180162111
    Abstract: A laminating apparatus includes workpiece transport units, a vacuum laminating device and a flat press device. The flat press device includes a ball screw having a screw shaft and supporting a first one of a pair of pressing elements, a servomotor connected to the screw shaft of the ball screw, a gap measuring device (linear scale) for measuring a distance between the first pressing element and the second pressing element, and a pressing gap control system for moving the first pressing element to a position in which a predetermined gap is defined between the first pressing element and the second pressing element to stop the first pressing element at that position. The pressing gap control system changes the RPM of the servomotor, based on information on the distance between the first and second pressing elements which is provided from the gap measuring device.
    Type: Application
    Filed: June 3, 2016
    Publication date: June 14, 2018
    Applicant: Nikko-Materials Co., Ltd.
    Inventors: Kazutoshi IWATA, Yoshiaki HONMA
  • Patent number: 7777078
    Abstract: The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: August 17, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7678257
    Abstract: There is obtained a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly an electrolytic copper foil which allows fine patterning, and is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. The present invention provides a copper electrolytic solution, containing as additives an organo-sulfur compound and a quaternary amine compound polymer obtained by homopolymerizing a compound in which the nitrogen of an acrylic type compound having a dialkylamino group is quaternized, or copolymerizing the compound with another compound having an unsaturated bond, and an electrolytic copper foil manufactured using this electrolytic solution.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: March 16, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7651783
    Abstract: A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided on the S side and/or the M side thereof. The copper foil has an adequate adhesive strength, even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: January 26, 2010
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Masashi Kumagai, Fumiaki Akase
  • Patent number: 7432335
    Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: October 7, 2008
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
  • Patent number: 7419536
    Abstract: There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-soluble gold compound and a pyrosulfurous acid compound. The plating liquid may further contain a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid or an alkali metal, alkaline earth metal, ammonium, or another such salt thereof can be used as the pyrosulfurous acid compound.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: September 2, 2008
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Akihiro Aiba, Yoshiyuki Hisumi, Kazumi Kawamura
  • Patent number: 7390354
    Abstract: A cyanide-free immersion type electroless gold plating solution that is less toxic can be used at near neutrality and gives an excellent and improved solder adhesion and plated film adhesion is provided. The electroless gold plating solution contains a cyanide-free water-soluble gold compound, a pyrosulfurous acid compound and a thiosulfuric acid compound. This plating solution preferably further contains a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid and alkali metal salts, alkaline-earth metal salts, ammonium salts and other salts thereof can be used as the pyrosulfurous acid compound.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: June 24, 2008
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Akihiro Aiba, Kazumi Kawamura
  • Patent number: 7378160
    Abstract: The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: May 27, 2008
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Masashi Kumagai, Mikio Hanafusa
  • Patent number: 7300501
    Abstract: The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold salt, an alkali metal salt or an ammonium salt of sulfurous acid and thiosulfuric acid as a metal complexing agent, a hydroxyalkylsulfonic acid or a salt thereof represented by the following general formula as a reducing agent, and an amine compound, wherein R represents hydrogen, a carboxyl group, or any of a phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group and a furyl group which may have a substitutional group, X represents any of hydrogen, Na, K, and NH4, and n is an integer between 0 and 4.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: November 27, 2007
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Eiji Hino, Masashi Kumagai
  • Patent number: 7288242
    Abstract: A lithium-containing complex oxide exhibits a high performance as a cathode active material of a lithium secondary cell or the like and having a high tap density. A granular lithium-containing complex oxide, such as lithium manganese complex oxide, is made up of “complex oxide grains produced by integrating lithium-rich material grains abnormally grown during a firing reaction with the surfaces of the base grains by sintering.” The number of complex oxide grains is not more than 50 per gram of the complex grains. A metal oxide such as manganese oxide and lithium carbonate not more than 5 ?m in average grain size are mixed by means of a mixer which grinds and mixes particles by using a shearing force and heated and fired at a warming rate of not more than 50° C./h., thus producing the lithium-containing complex oxide.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: October 30, 2007
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Hiroshi Tasaki, Yoshio Kajiya
  • Publication number: 20070131545
    Abstract: Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.
    Type: Application
    Filed: September 14, 2004
    Publication date: June 14, 2007
    Applicant: Nikko Materials Co., Ltd.
    Inventors: Takeo Okabe, Masaru Nagasawa
  • Publication number: 20070123681
    Abstract: As a resin composition that solves the problems such as unpleasant odor encountered when a tertiary amine compound is used as a catalyst in a reaction of a polyol and a polyisocyanate, and that promotes the curing of these resins and improves adhesion to metals, inorganic materials, and organic materials, the present invention provides a resin composition containing the following components as essential components, (A) a polyol (B) a polyisocyanate (C) a silane coupling agent containing an imidazole group (here, the ratio NCO/OH of the number of isocyanate groups in the polyisocyanate (B) to the number of hydroxyl groups in the polyol (A) in the above composition is from 0.6 to 4.0, and the weight ratio of {(A)+(B)}:(C) is from 100:0.01 to 100:10).
    Type: Application
    Filed: September 30, 2004
    Publication date: May 31, 2007
    Applicant: NIKKO MATERIALS CO., LTD.
    Inventors: Hironori Kobayashi, Katsuyuki Tsuchida, Masashi Kumagai