Abstract: In a semiconductor wafer (W) having a periphery thereof chamfered, and having at least a main surface side thereof subjected to mirror finishing, an inclined surface (21) is formed on the periphery of the wafer, such that has an angle (?) of inclination of the inclined surface (21) with respect to a main surface (10) is not smaller than 5° and not larger than 25°, and at the same time a length (L) of the same in the radial direction of the wafer is 100 ?m or longer. Further, the inclined surface is configured to have a non-mirror-finished portion (21b) toward the periphery of the wafer.

Abstract: In a method for growing a GaN based compound semiconductor on a front surface of a substrate to obtain the GaN based compound semiconductor crystal in one body, because the gas for reducing and decomposing the substrate is supplied to the rear surface of the substrate and a heat treatment is carried out in a gas atmosphere in which the nitrogen partial pressure is not less than a predetermined value, in order to remove the substrate, it can be prevented that cracks are caused in the crystal, or fracture or warp is caused by causing strain of the GaN based compound semiconductor crystal in a cooling step.

Abstract: The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins. The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a following General Formula (1) and/or an organosilicic compound expressed by a General Formula (2) and an olefin-based silane coupling agent. The surface treatment agent of the present invention provides particularly excellent adhesion between an insulating resin and a low-profile copper foil used for a high-frequency-adaptable substrate. In Formulas (1) and (2), R1 is a hydroxyl group or a C1 to C5 alkyl group, and R2 is a C1 to C10 alkylene group that may contain oxygen.

Abstract: An adhesion accelerator for bonding rubber to metal contains a metal organic compound containing nickel and another metal organic compound containing zinc. Further, there is provided a rubber composition containing the above adhesion accelerator in an amount of 0.

Abstract: Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

Abstract: The product management system for sputtering targets is configured between a target manufacturer and target customers via a computer network. The customer and the manufacturer share the various information relating to the product management, such as hysteresis information of the backing plates, product information of the sputtering targets, use information of the sputtering targets, or the like with each other.

Abstract: The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, aluminum oxide or aluminum hydroxide, a method for producing this imidazole/organic monocarboxylic acid salt derivative reaction product, and a surface treatment agent, resin additive and resin composition that use this imidazole/organic monocarboxylic acid salt derivative reaction product. The above imidazole/organic monocarboxylic acid salt derivative reaction product is obtained by reacting an imidazole compound represented by undermentioned general formula (1) with a silane compound having a glycidoxy group represented by undermentioned general formula (2) at 80 to 200° C., and then reacting the product thus obtained with an organic monocarboxylic acid at 50 to 200° C.

Abstract: A metal surface treatment agent containing the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties, even with a thin film thickness, and has excellent plasticity and adhesion to paints. (A) at least one organosilicon compound having three carbonyl groups and at least one alkoxysilyl group, the organosilicon compound being present in a weight ratio of 5 to 15, based on the total of the components (A) to (D) being 100; (B) at least one epoxy resin modified with an alkanolamine, the modified epoxy resin being present in a weight ratio of 10 to 30 relative to the above total; (C) at least one blocked polyisocyanate present in a weight ratio of 50 to 70 relative to the above total; and (D) at least one amino resin present in a weight ratio of ratio 5 to 15 relative to the above total.

Abstract: A crystal growth apparatus comprising a heating furnace capable of controlling uniformly the temperature distribution in the same horizontal plane, and a method for producing a single crystal by using the crystal growth apparatus are provided. In the crystal growth apparatus comprising a cylindrical heating furnace (110) having plural heaters (101, 102, 103 and 104) laminated in multi-stage in an axial direction (Z), each heater is disposed for the terminal portions of the adjacent heaters not to be overlapped in the same position, but to be in a mutually separated position, seeing from the axial direction of the heating furnace. Concretely, in case of N (n is a positive integer of three or more) heaters, each heater (101, 102, 103 and 104) is disposed for the terminal portions (110a, 102a, 103a and 104a) of the heaters to be located at each apex of a regular n-gon (n is an integer satisfying 3≦n≦N), seeing from the axial direction Z of the heating furnace.