Abstract: Provided is an austenitic stainless steel foil that demonstrates a high degree of stretch formability and little deformation anisotropy with respect to stretch forming despite having a sheet thickness of 60 ?m or less. The austenitic stainless steel foil of the present invention has a sheet thickness of 5 ?m to 60 ?m, a recrystallization rate of 90% to 100%, and a texture in which the total of the area ratio of a crystal orientation in which the difference in orientation from the {112}<111> orientation is within 10°, the area ratio of a crystal orientation in which the difference in orientation from the {110}<112> orientation is within 10°, and the area ratio of a crystal orientation in which the difference in orientation from the {110}<001> orientation is within 10°, in a measuring field thereof, is 20% or less.

Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

Abstract: The present invention addresses the problem of providing: spherical eucryptite particles which have higher circularity than in the prior art, have a large negative thermal expansion and a high thermal conductivity, have high flowability, dispersibility, and filling capability, and are also applicable in the field of semiconductors; and a method for producing the spherical eucryptite particles. As a means for solving the problem, the present invention provides: the method for producing the spherical eucryptite particles characterized by heat treating, at 600 to 1100° C., spherical particles which have been thermally sprayed with a feedstock powder that includes 45 to 55 mol % of SiO2, 20 to 30 mol % of Al2O3, and 20 to 30 mol % of Li2O, and obtaining spherical particles that include 89% or more of a eucryptite crystalline phase; and the spherical eucryptite particles obtained by this method.

Abstract: Spherical crystalline silica particles having a higher productivity, lower production cost, higher coefficient of thermal expansion, higher heat transmission rate, higher fluidity, higher dispersability, higher fill factor, low abrasiveness, and higher purity compared with the past and able to be applied in the semiconductor field and a process of production of the same are provided. Spherical crystalline silica particles containing 400 to 5000 ppm of aluminum and containing 80% or more of crystal phases are provided.

Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

Abstract: A honeycomb core for carrying a catalyst includes a flat metal foil and a corrugated metal foil, which are layered. The corrugated foil is configured by repeating a concavo-convex shaped part including a first top surface that is in contact with one of the flat foils, a second top surface that is in contact with another flat foil and is disposed at a position where the second top surface avoids the first top surface, and an inclined leg surface that has one end connected to the first top surface through a first bent part and another end connected to the second top surface through a second bent part, and extends in a direction inclined with respect to the first top surface and the second top surface, and has an offset part having different wave phases between front and rear in an axial direction of the honeycomb core.

Abstract: A steel foil according to an aspect of the present invention includes a rolled steel foil; and a Ni having <111>//RD texture plated on an outermost layer of the rolled steel foil. Regarding the steel foil, a <111> pole density in an inverse pole figure of a rolling direction may be 3.0 or more and 6.0 or less.

Abstract: A steel foil for a power storage device container includes a rolled steel foil, a nickel layer formed on a surface of the rolled steel foil, and a chromium-based surface treatment layer formed on a surface of the nickel layer. The nickel layer includes an upper layer portion which is in contact with the chromium-based surface treatment layer and contains Ni of 90 mass % or more among metal elements, and a lower layer portion which is in contact with the rolled steel foil and contains Ni of less than 90 mass % among the metal elements and Fe. <111> polar density in a reverse pole figure of the nickel layer in a rolling direction is 3.0 to 6.0. The nickel layer has a sub-boundary which is a boundary between two crystals having a relative orientation difference of 2° to 5°, and a large angle boundary which is a boundary between two crystals having the relative orientation difference of equal to or more than 15°.

Abstract: Provided is a flat fiber-reinforced plastic strand which is produced by curing a twisted resin-impregnated strand and has no disturbed fiber orientation, and a flat fiber-reinforced plastic strand sheet which is produced by using said flat fiber-reinforced plastic strands. According to a method of manufacturing the flat fiber-reinforced plastic strand 2, (a) a twisted resin-impregnated strand f2 in an uncured state, the strand including a plurality of reinforcing fibers f, is fed in a state of tension between a pair of heated steel belts 41A and 41B facing each other and making rotation movements; and (b) the resin-impregnated strand f2 is sandwiched and heated by the steel belts 41A and 41B, and pressurized from both sides of the strand f2 to form a cross section of the strand into a flat shape, and, with the shape being kept, a resin is cured and cooled.

Abstract: A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 ?m or more and 1.3 ?m or less.

Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer on a surface of the Cu alloy core material, and contains Ga and Ge of 0.011 to 1.2% by mass in total, which is able to increase bonding longevity of the ball bonded part in the high-temperature, high-humidity environment, and thus to improve the bonding reliability. The thickness of the Pd coating layer is preferably 0.015 to 0.150 ?m. When the bonding wire further contains one or more elements of Ni, Ir, and Pt in an amount, for each element, of 0.011 to 1.2% by mass, it is able to improve the reliability of the ball bonded part in a high-temperature environment at 175° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

Abstract: The present invention provides a ball forming method for forming a ball portion at a tip of a bonding wire which includes a core material mainly composed of Cu, and a coating layer mainly composed of Pd and formed over a surface of the core material, wherein the ball portion is formed in non-oxidizing atmosphere gas including hydrocarbon which is gas at room temperature and atmospheric pressure, the method being capable of improving Pd coverage on a ball surface in forming a ball at a tip of the Pd-coated Cu bonding wire.

Abstract: The present invention provide a ferritic stainless steel foil high in stretch-expand formability and further small in anisotropy of deformation with respect to stretch-expand forming even with ultrathin steel foil with a thickness of 60 ?m or less. The present invention is a ferritic stainless steel foil having a thickness of 5 ?m to 60 ?m, wherein a recrystallization rate of said stainless steel foil is 90% to 100%, and in an orientation distribution function obtained by analysis of a crystalline texture of said stainless steel foil, when a Euler angle ?2 is 45°±10°, at the plane expressed by a Euler angle ? of 53.4°±10°, the maximum peak strength ratio in the peak strength ratios shown by orientations corresponding to the Euler angle ?1 is 25 or less, where the Euler angle ?1 is 0 to 90°.

Abstract: A metal substrate for catalytic converter is characterized by: a flat foil and a corrugated metal foil arranged on a gas inlet side end section being joined to each other; the flat foil and the corrugated metal foil arranged in an outer circumferential joining section being joined to each other, said outer circumferential joining section being connected to an end section of the gas inlet side end section in the axial direction; an outer jacket and the honeycomb core being joined by interposing a bonding layer in the gas outlet side end section area P fulfilling formula (A), when P is the length of the bonding layer in the axial direction; a corrugated metal foil having an impact mitigating section; the impact mitigating section being formed in an area corresponding to at least the gas inlet side end section and the outer circumferential joining section.

Abstract: The present invention provides a method of manufacturing by the sublimation-recrystallization method more accurately detecting a thermal state of a starting material in a crucible and enabling control of the growth conditions while manufacturing an SiC single crystal.

Abstract: A honeycomb core for carrying a catalyst includes a flat metal foil and a corrugated metal foil, which are layered. The corrugated foil is configured by repeating a concavo-convex shaped part including a first top surface that is in contact with one of the flat foils, a second top surface that is in contact with another flat foil and is disposed at a position where the second top surface avoids the first top surface, and an inclined leg surface that has one end connected to the first top surface through a first bent part and another end connected to the second top surface through a second bent part, and extends in a direction inclined with respect to the first top surface and the second top surface, and has an offset part having different wave phases between front and rear in an axial direction of the honeycomb core.

Abstract: Provided is an austenitic stainless steel foil that demonstrates a high degree of stretch formability and little deformation anisotropy with respect to stretch forming despite having a sheet thickness of 60 ?m or less. The austenitic stainless steel foil of the present invention has a sheet thickness of 5 ?m to 60 ?m, a recrystallization rate of 90% to 100%, and a texture in which the total of the area ratio of a crystal orientation in which the difference in orientation from the {112}<111> orientation is within 10°, the area ratio of a crystal orientation in which the difference in orientation from the {110}<112> orientation is within 10°, and the area ratio of a crystal orientation in which the difference in orientation from the {110}<001> orientation is within 10°, in a measuring field thereof, is 20% or less.

Abstract: The present invention provide a ferritic stainless steel foil having a high thickness precision even with a thickness 60 ?m or less ultrathin stainless steel foil and simultaneously having a plastic deformation ability and good elongation at break, that is, having a good press-formability (deep drawing ability). The present invention is a stainless steel foil having a thickness of 5 ?m to 60 ?m, wherein a recrystallization ratio of said stainless steel foil is 90% to 100%, a surface layer of said stainless steel foil has a nitrogen concentration of 1.0 mass % or less, three or more crystal grains are contained in the thickness direction of said stainless steel foil, an average crystal grain diameter “d” of said crystal grains is 1 ?m to 10 ?m, and, when said thickness is “t” (?m), an area ratio of crystal grains having a crystal grain diameter of t/3 (?m) or more is 20% or less.

Abstract: There is provided a Cu bonding wire having a Pd coating layer on a surface thereof, that improves bonding reliability of a ball bonded part in a high-temperature and high-humidity environment and is suitable for on-vehicle devices. The bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, and the bonding wire contains In of 0.011 to 1.2% by mass and has the Pd coating layer of a thickness of 0.015 to 0.150 ?m. With this configuration, it is able to increase the bonding longevity of a ball bonded part in a high-temperature and high-humidity environment, and thus to improve the bonding reliability. When the Cu alloy core material contains one or more elements of Pt, Pd, Rh and Ni in an amount, for each element, of 0.05 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 175° C. or more.

Abstract: A steel foil according to an aspect of the present invention includes, by mass %, C: 0.0001 to 0.02%; Si: 0.001 to 0.01%; Mn: 0.01 to 0.3%; P: 0.001 to 0.02%; S: 0.0001 to 0.01%; Al: 0.0005 to 0.1%; N: 0.0001 to 0.004%; and a balance consisting of Fe and impurities, wherein a thickness is 5 to 15 ?m, and a tensile strength is more than 900 MPa and 1.200 MPa or less.