Patents Assigned to Nitto Denko Corporation
  • Patent number: 12044880
    Abstract: A backlight unit includes: a light source; a light guide plate having an end surface that is arranged to face the light source, and that light from the light source enters, and an emitting surface from which the entered light is emitted; a casing having a front portion and a back portion, the casing being configured to store the light source and the light guide plate; and an optical pressure-sensitive adhesive film arranged between the front portion of the casing on a light source side and the light guide plate, the optical pressure-sensitive adhesive film being bonded to the light guide plate. The optical pressure-sensitive adhesive film includes a light-absorbing layer, a substrate, a low-refractive index layer, and a pressure-sensitive adhesive layer in the stated order from a front portion side of the casing.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: July 23, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Takahiro Yoshikawa, Ryota Morishima, Atsushi Kishi
  • Publication number: 20240242778
    Abstract: A nucleoside phosphoramidite identifying system for improving a nucleoside phosphoramidite identification accuracy includes a memory unit configured to store spectra of solutions of a plurality of different nucleoside phosphoramidites, a detecting unit configured to detect a spectrum of a solution of a nucleoside phosphoramidite, and an identifying unit configured to identify the nucleoside phosphoramidite based on cosine similarity between the spectra stored in the memory unit and the spectrum detected by the detecting unit.
    Type: Application
    Filed: April 10, 2023
    Publication date: July 18, 2024
    Applicant: Nitto Denko Corporation
    Inventors: Kei YOSHIDA, Yoichi KIGAWA, Shinsuke SUGIURA, Eri MAETA, Jun MATSUNAMI
  • Publication number: 20240244742
    Abstract: A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.
    Type: Application
    Filed: January 28, 2022
    Publication date: July 18, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
  • Publication number: 20240244756
    Abstract: An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.
    Type: Application
    Filed: January 4, 2024
    Publication date: July 18, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Chihiro WATANABE, Kenya TAKIMOTO
  • Patent number: 12037522
    Abstract: An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The electrical debonding type adhesive sheet according to the first embodiment of the present invention includes a substrate for voltage application, a first adhesive layer, which is constituted of an electrically debondable adhesive and is formed on an electroconductive surface of the substrate for voltage application, and a second adhesive layer, which is formed on the opposite surface of the substrate for voltage application, the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: July 16, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kaori Akamatsu, Kaori Mizobata, Ryo Awane, Akira Hirao, Junji Yokoyama
  • Publication number: 20240230978
    Abstract: A lightguide component for light emission devices has a first principal face and a second principal face at an opposite side from the first principal face. The lightguide component for light emission devices includes: a lightguide layer including a light-receiving portion to receive light emitted from a light source, a third principal face at the first principal face side, and a fourth principal face at the second principal face side; and a light distribution controlling structure having a plurality of internal spaces, the plurality of internal spaces creating interfaces to direct a portion of the light propagating in the lightguide layer toward the first principal face via total internal reflection. In a plan view a first region in which the light distribution controlling structure is present and a second region in which the light distribution controlling structure is not present are disposed so as to define a predetermined design.
    Type: Application
    Filed: June 16, 2022
    Publication date: July 11, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yufeng WENG, Kozo NAKAMURA, Takahiro YOSHIKAWA
  • Publication number: 20240237200
    Abstract: An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.
    Type: Application
    Filed: January 26, 2022
    Publication date: July 11, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventor: Makoto TSUNEKAWA
  • Patent number: 12030297
    Abstract: Provided is a glass film-resin composite, which prevents the breakage of a glass film and enables the production of an elongated glass film. The glass film-resin composite of the present invention includes: an elongated glass film; a resin tape, which is arranged on at least one surface of the elongated glass film and is linearly arranged at least near each of both ends in a widthwise direction of the elongated glass film in one surface of the elongated glass film; a protective layer, which is arranged near each of both the ends in the widthwise direction of the surface of the elongated glass film having arranged thereon the resin tape and on an outside of the resin tape in the widthwise direction; and a resin layer arranged on one surface of the elongated glass film.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: July 9, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keisuke Sato, Takeshi Murashige, Junichi Inagaki, Atsushi Kishi
  • Patent number: 12035484
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: July 9, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenya Takimoto, Naoki Shibata, Hayato Takakura
  • Patent number: 12030281
    Abstract: A method of manufacturing a glass resin laminated body includes a step of sticking a glass film on a resin film via an adhesive layer while holding the glass film and the resin film between a first roller that presses against the resin film and a second roller that is disposed opposite to the first roller and that presses against the glass film. A ratio of an elastic modulus P1 of a surface layer of the first roller to an elastic modulus P2 of the resin film P1/P2 satisfies a relation of 3×10?3?P1/P2?1.0.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: July 9, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keisuke Sato, Takeshi Murashige, Junichi Inagaki, Atsushi Kishi
  • Publication number: 20240224435
    Abstract: A method for producing a wiring circuit board includes a step of forming an insulating layer on one surface in a thickness direction of a substrate, a step of forming a plurality of wirings on one surface in the thickness direction of the insulating layer, a step of forming an opening portion including the plurality of wirings when projected in the thickness direction in the substrate, a step of forming a resist pattern having an opening portion having a pattern shape along the plurality of wirings on the other surface in the thickness direction of the insulating layer, a step of forming a metal support portion by depositing a metal material on the insulating layer inside the opening portion, and a step of removing the resist pattern.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 4, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hayato TAKAKURA, Naoki SHIBATA, Makoto TSUNEKAWA
  • Publication number: 20240219764
    Abstract: A polymer dispersed liquid crystal (PDLC) film achieves a haze (light diffusibility) capable of exhibiting a shielding function, and improved backscattering ratio. The PDLC film according to an embodiment of the present invention includes a first transparent conductive film, a polymer dispersed liquid crystal layer, and a second transparent conductive film in the stated order. The polymer dispersed liquid crystal layer contains a polymer matrix and droplets of a liquid crystal compound dispersed in the polymer matrix. An average particle diameter of the droplets when viewed from a direction perpendicular to a main surface of the PDLC film is from 0.3 ?m to 0.9 ?m. A volume ratio of the droplets in the polymer dispersed liquid crystal layer is from 20% to 70%. The liquid crystal compound has a birefringence of from 0.20 to 0.50. The polymer dispersed liquid crystal layer has a thickness of from 5 ?m to 40 ?m.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 4, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroyuki TAKEMOTO, Masanori OTSUKA, Keita KANEKO, Akihiro SHIBUYA, Mariko HIRAI
  • Publication number: 20240218213
    Abstract: Provided is a masking tape to be used at the time of formation of an electromagnetic wave shield, which is excellent in followability to irregularities, and which is capable of being peeled off from an irregular surface without any adhesive residue. The masking tape for forming an electromagnetic wave shield includes a pressure-sensitive adhesive layer that is increased in modulus of elasticity through active energy ray irradiation to 20 times or more as high as that before the active energy ray irradiation, wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less.
    Type: Application
    Filed: March 15, 2024
    Publication date: July 4, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventor: Yuji OKAWA
  • Publication number: 20240219620
    Abstract: A lightguide component for illumination devices having an exit surface includes: a lightguide layer having a light-receiving portion to receive light emitted from a light source, a first principal face at the exit surface side, and a second principal face at an opposite side from the first principal face; a light distribution controlling structure having a plurality of internal spaces, each of the plurality of internal spaces including a first slope to direct a portion of light propagating in the lightguide layer toward the exit surface via total internal reflection, and a second slope at an opposite side from the first slope, wherein, when viewed from a normal direction of the first principal face of the lightguide layer, the first slope presents a curved surface that is convex toward the light source; and an anti-reflection layer and/or anti-glare layer disposed at the first principal face side of the lightguide layer.
    Type: Application
    Filed: June 10, 2022
    Publication date: July 4, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shimpei MUKADEYAMA, Takahiro YOSHIKAWA, Kozo NAKAMURA
  • Patent number: 12025529
    Abstract: The present disclosure relates to a plastic optical fiber (POF) core diameter measuring method and a POF core diameter measuring apparatus, and a POF defect detecting method, and a POF defect detecting apparatus used therefor. Light irradiation mechanisms are provided for irradiating a side of a POF with light, with imaging mechanisms provided on the opposite side of the POF from the light irradiation mechanisms; and a data processing mechanism for processing image data on the POF acquired from the imaging mechanisms to calculate the core diameter of the POF. The ratio (D/W) of the shortest distance D to a light emission width W is in the range of 0.9 to 1.3 where W is the light emission width of the light irradiation mechanisms and D is the shortest distance between a light emission position of the light irradiation mechanisms and the side of the POF.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: July 2, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masaru Sakamoto, Ichiro Suehiro
  • Publication number: 20240214076
    Abstract: An optical transmitter includes a TOSA and an LC parallel circuit. The TOSA is configured to convert a first electrical signal into an optical signal. The LC parallel circuit includes an inductor and a capacitor. The inductor and the capacitor are connected in parallel to each other. The LC parallel circuit is connected to the TOSA.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 27, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeshi TANAKA, Yuichi TSUJITA
  • Publication number: 20240210615
    Abstract: A plastic optical fiber includes a core and a clad disposed on an outer circumference of the core. The core includes a first resin, and the clad includes a second resin. The first resin has a first glass transition temperature Tg1 of 120° C. or higher. The second resin has a second glass transition temperature Tg2 of 120° C. or higher. When the plastic optical fiber bent once 180 degrees at 25° C. has a curvature radius R and a minimum of the curvature radius R is defined as a curvature radius at which a crack does not occur in a bent portion of the plastic optical fiber, the minimum is 5 mm or less.
    Type: Application
    Filed: March 29, 2022
    Publication date: June 27, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi SHIMIZU, Hiroshi OHMURA, Takeshi SAITO
  • Publication number: 20240215155
    Abstract: An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.
    Type: Application
    Filed: January 26, 2022
    Publication date: June 27, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventor: Makoto TSUNEKAWA
  • Patent number: 12017950
    Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting alteration and erosion of Low-E layers. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a tin component. Here, the Low-E layer comprises a tin component. The protective sheet has a PSA layer. The PSA layer comprises a phosphorus compound having a P—OR group. Here, R is a hydrogen atom or an organic group.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: June 25, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuta Shimazaki, Kosuke Yonezaki, Hakaru Horiguchi, Kunimasa Mishima
  • Publication number: 20240200182
    Abstract: The present invention provides an optical laminate including a void-containing layer in which a pressure-sensitive adhesive, an adhesive, and the like barely permeate a void. In order to achieve the object, an optical laminate (10a) or (10b) of the present invention includes a void-containing layer (12) and a low moisture permeable layer (13) formed on the void-containing layer (12), wherein the low moisture permeable layer (13) includes at least one element selected from the group consisting of metal, metal oxide, silicon, silicon oxide and an organic-inorganic hybrid material, and a moisture vapor transmission rate of the low moisture permeable layer (13) measured by a dish method defined in JIS Z 0208-1976 is 35 g/m2·day or less.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 20, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryota Morishima, Daisuke Hattori, Takahiro Yoshikawa