Patents Assigned to Nitto Denko Corporation
  • Patent number: 11914176
    Abstract: This optical filter 10 has an L* of at least 20 as measured by the SCE method, wherein the linear transmittance is at least 60% with respect to light the wavelength of which falls at least partially within the wavelength range of 760 nm-2,000 nm, and the temperature, at which the optical filter contracts by being heated, is at least 85° C.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yudai Numata, Masato Katsuda, Shoichi Matsuda
  • Patent number: 11911725
    Abstract: The present invention provides a separation membrane that is suitable for separating an acid gas from a gas mixture containing the acid gas and has a high acid gas permeability. A separation membrane (10) of the present invention includes: a separation functional layer (1); a porous support member (3) supporting the separation functional layer (1); and an intermediate layer (2) disposed between the separation functional layer (1) and the porous support member (3), and including a matrix (4) and nanoparticles (5) dispersed in the matrix (4).
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kazuya Yoshimura, Daiki Iwasaki, Naomichi Kimura, Shinya Nishiyama
  • Patent number: 11912908
    Abstract: An air-permeable adhesive sheet has air permeability in a thickness direction thereof and including an adhesive agent layer having first through holes extending in the thickness direction, wherein at least one surface of the adhesive agent layer forms an adhesive surface, the through holes have an average opening diameter of 1.0 to 50 ?m and an average interval of 5 to 400 ?m, and a variation in air permeability in the thickness direction is 22% or less as represented by a coefficient of variation of an air permeability measured according to Method B for air permeability measurement (Gurley method) specified in JIS L 1096: 2010, with an effective measurement area as a predetermined value selected from 0.5 to 2.0 mm2. The air-permeable adhesive sheet is a sheet capable of obtaining good characteristics such as air permeability even when being made into a sheet having a small area.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hajime Yamamoto, Hiroki Kigami, Marie Aizuka
  • Patent number: 11914177
    Abstract: Disclosed is an optical filter with L* measured by the SCE method being 20 or greater, wherein: the linear transmittance with respect to light with wavelengths being at least a portion of a wavelength range from 760 nm to 2000 nm is 60% or greater; and, before and after a light resistance test wherein light of a xenon arc lamp (average integrated illuminance of light with wavelengths from 300 nm to 400 nm:120 W/m2) is shone for 300 hours, the absolute value of a change in C* measured by the SCE method using a spectroscopic colorimeter is 6 or less.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masato Katsuda, Yudai Numata, Shoichi Matsuda
  • Patent number: 11914180
    Abstract: An optical filter has a back-scattering property. The linear transmittance thereof to light of at least some avelengths in the wavelength range of 760-2000 nm is 60% or higher. The azimuth is 20° from an incidence plane when the polar angle of the direction of incidence of incident light is 0°. The value of a bidirectional reflectance distribution function in the direction ‘here the polar angle is ?60’ is BRDF (0°; 20°, ?60°). The azimuth is 20° from an incidence plane when the polar angle of the direction of incidence of incident light is 30°. The value of a bidirectional reflectance distribution function in the direction where the polar angle is ?60° is BRDF (30°; 20°, ?60°). The azimuth is 20° from an incidence plane when the polar angle of the direction of incidence of incident light is 60°.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 27, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yudai Numata, Masato Katsuda, Shoichi Matsuda
  • Publication number: 20240061157
    Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. Each of the plurality of dents satisfies 0.10?(C?A)/C 1.00 and 0.75?(C?A)/(C?B), where A is a maximum height value of the adhesive layer existing in that dent; B is a minimum height value of the adhesive layer existing in that dent; and C is a depth of that dent.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 22, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiko TANAKA, Mizuho MIZUNO, Kozo NAKAMURA, Yufeng WENG
  • Publication number: 20240059960
    Abstract: Provided are a photon up-conversion film, which is capable of high-efficiency up-conversion even in air and even when low-intensity light is used, and a simple method of producing the film. The photon up-conversion film according to one embodiment of the present invention includes: a matrix including a resin; and a pore portion, wherein the photon up-conversion film includes at least a sensitizing component capable of absorbing light in a first wavelength region ?1, and a light-emitting component capable of radiating light in a second wavelength region ?2 including wavelengths shorter than those of the first wavelength region ?1, and wherein the sensitizing component and the light-emitting component are present at an interface between the matrix and the pore portion.
    Type: Application
    Filed: June 15, 2022
    Publication date: February 22, 2024
    Applicants: WAKAYAMA PREFECTURE, NITTO DENKO CORPORATION
    Inventors: Takeshi Mori, Tomohiro Mori, Akane Saito, Tsuyoshi Masuda, Hitoshi Saomoto, Mami Kawaguchi, Minoru Miyatake, Shoichi Matsuda, Masato Katsuda
  • Patent number: 11904411
    Abstract: Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (?m) of the pressure-sensitive adhesive layer and a creep characteristic (?m/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (?m))2×creep characteristic (?m/Hr)?50×103 (?m2·?m/Hr).
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 20, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Atsushi Kishi, Takeshi Murashige, Satoshi Hirata
  • Patent number: 11910526
    Abstract: A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 ?m or more.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: February 20, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Daigo Tsubai, Hiroaki Machitani
  • Patent number: 11908596
    Abstract: A transparent conductive layer 3 includes a first main surface 5 exposed to the outside, and a second main surface 6 opposite to the first main surface 5 in a thickness direction. The transparent conductive layer 3 is single layer extending in a plane direction. The transparent conductive layer 3 has a first grain boundary 7 in which two end edges 23 in a cross-sectional view are open to the first main surface 5, and an intermediate region 25 between both end edges 23 is not in contact with the second main surface 6, and has a first crystal grain 31 partitioned by the first grain boundary 7 and facing only the first main surface 5.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 20, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventor: Nozomi Fujino
  • Publication number: 20240052207
    Abstract: An optical stack includes: a first optical sheet having a first principal face with a concavo-convex structure and a second principal face at an opposite side from the first principal face; and an adhesive layer that is disposed on the first principal face of the first optical sheet. The concavo-convex structure includes a plurality of dents and flat portions between adjacent ones of the plurality of dents. The adhesive layer is in contact with the flat portions. A surface of the adhesive layer and the first principal face of the first optical sheet together define an internal space within each of the plurality of dents. In a plan view from a normal direction of the first principal face of the first optical sheet, an area ratio of air voids existing at interfaces between the flat portions and the adhesive layer to an area of the first optical sheet is 3% or less.
    Type: Application
    Filed: February 4, 2022
    Publication date: February 15, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shunya WAKAYAMA, Shigeyoshi KIRIBE, Naoyuki MATSUO
  • Patent number: 11897233
    Abstract: A method of manufacturing a glass resin laminated body includes a step of sticking a glass film on a resin film via an adhesive layer while holding the glass film and the resin film between a first roller that presses against the resin film and a second roller that is disposed opposite to the first roller and that presses against the glass film. A ratio of an elastic modulus P1 of a surface layer of the first roller to an elastic modulus P2 of the resin film P1/P2 satisfies a relation of 3×10?3?P1/P2?1.0.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: February 13, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keisuke Sato, Takeshi Murashige, Junichi Inagaki, Atsushi Kishi
  • Patent number: 11898071
    Abstract: Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G?1RT, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G?180, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G?2RT, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G?280, of from 10 kPa to 1,000 kPa. G?1RT/G?2RT is 1 or more.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: February 13, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Mariko Teshiba, Hiroki Kono
  • Patent number: 11891549
    Abstract: There is provided an optical laminate with pressure-sensitive adhesive layers on both surfaces, which is suppressed damage from occurring to a low-refractive index layer in vacuum lamination while maintaining excellent characteristics of the low-refractive index layer. An optical laminate with pressure-sensitive adhesive layers on both surfaces according to an embodiment of the present invention comprises: a substrate; a low-retractive index layer formed on the substrate; a first pressure-sensitive adhesive layer arranged so as to be adjacent to the low-refractive index layer; and a second pressure-sensitive adhesive layer serving as one outermost layer. The low-refractive index layer has a porosity of 50% or more, the first pressure-sensitive adhesive layer has a storage modulus of elasticity of from 1.3×105 (Pa) to 1.0×107 (Pa), and the second pressure-sensitive adhesive layer has a storage modulus of elasticity of 1.0×105 (Pa) or less.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: February 6, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Atsushi Kishi, Ryota Morishima
  • Patent number: 11891551
    Abstract: A double-sided pressure-sensitive adhesive tape having excellent impact resistance, excellent reworkability, and excellent alcohol resistance. The double-sided pressure-sensitive adhesive tape includes: a base material layer; and pressure-sensitive adhesive layers arranged on both surface sides of the base material layer, wherein the pressure-sensitive adhesive layers are each formed from a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains at least one kind selected from the group consisting of a monomer component (m) and a polymer component (P) obtained by polymerizing the monomer component (m), wherein the monomer component (m) contains 50 wt % or more of butyl (meth)acrylate, wherein a ratio of a thickness of the base material layer to a total thickness of the double-sided pressure-sensitive adhesive tape is less than 35%, and wherein the double-sided pressure-sensitive adhesive tape has a force, which is generated at 100% strain at 23° C.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: February 6, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takuya Fujita, Hiromichi Sumida, Masahito Niwa, Masataka Nishiwaki, Yasushi Buzojima
  • Patent number: 11891506
    Abstract: Provided is a sealant sheet formed as a sheet. The sealant sheet comprises an epoxy group-containing polysulfide. The epoxy group-containing polysulfide has a disulfide structure and an epoxy group in its molecule.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: February 6, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kosuke Morita, Kazuhiro Kitayama
  • Publication number: 20240040705
    Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 1, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Rihito FUKUSHIMA, Takahiro IKEDA, Shun SHIGA
  • Patent number: 11884796
    Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: January 30, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shimpei Yakuwa, Kou Uemura, Shunji Imamura, Tomoyuki Kasagi, Tao Gu
  • Publication number: 20240032268
    Abstract: A radio wave absorber 1a includes a resistive layer 10, a reflector 30, and a dielectric layer 20. The resistive layer 10 includes multilayer carbon nanotubes 11. Moreover, the resistive layer 10 has a specific resistance of 1.5 ?·cm or less. The reflector 30 reflects a radio wave. The dielectric layer 20 is disposed between the resistive layer and the reflector in a thickness direction of the resistive layer 10.
    Type: Application
    Filed: November 24, 2021
    Publication date: January 25, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yosuke Nakanishi, Eri Ueda, Hironobu Machinaga
  • Patent number: 11881187
    Abstract: A polymer dispersion type liquid crystal device includes a pair of transparent substrates; a pair of transparent electrodes provided between the pair of transparent substrates; a liquid crystal layer formed by filling a polymer dispersion type liquid crystal between the pair of transparent electrodes; and a driving circuit that applies a voltage between the pair of transparent electrodes to set the liquid crystal layer to a non-scattering state or a scattering state. The driving circuit applies a direct current voltage that periodically inverts a polarity between the pair of transparent electrodes.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: January 23, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shigeyasu Mori, Yoshihiro Onishi