Patents Assigned to Nitto Denko Corporation
  • Patent number: 11460610
    Abstract: The present invention is intended to provide an optical laminate that achieves a superior film strength and a property that a void-provided layer and a pressure-sensitive adhesive/adhesive layer are not easily peeled from each other. The optical laminate of the present invention includes: a void-provided layer; an intermediate layer; and a pressure-sensitive adhesive/adhesive layer, wherein the void-provided layer, the intermediate layer, and the pressure-sensitive adhesive/adhesive layer are stacked in this order, and the intermediate layer is formed by forming the pressure-sensitive adhesive/adhesive layer on the void-provided layer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 4, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Hiromoto Haruta, Kozo Nakamura, Hiroyuki Takemoto
  • Patent number: 11460747
    Abstract: An electrochromic light adjusting member sequentially includes a transparent substrate, a light transmitting electrically conductive layer, and an electrochromic light adjusting layer. The light transmitting electrically conductive layer sequentially includes a first indium-based electrically conductive oxide layer, a metal layer, and a second indium-based electrically conductive oxide layer.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: October 4, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hideyuki Yonezawa, Nozomi Fujino, Kenta Watanabe, Tomotake Nashiki
  • Publication number: 20220312597
    Abstract: A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.
    Type: Application
    Filed: August 12, 2020
    Publication date: September 29, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akihito MATSUTOMI, Masayuki HODONO
  • Publication number: 20220312091
    Abstract: The conversion element member of the present disclosure includes: a conversion element having an opening capable of functioning as a ventilation port and/or a sound-transmitting port; and a waterproof membrane. The conversion element has an outer surface provided with the opening. The waterproof membrane is joined, at a joining portion thereof, to the outer surface of the element so as to cover the opening, the joining portion having a shape surrounding the opening when viewed in a direction perpendicular to the outer surface. The waterproof membrane has a non-joining portion defined as a portion surrounded by the joining portion when viewed in the direction, the non-joining portion having a region overlapping the outer surface when viewed in the direction. A spacing distance D1 between the membrane and the outer surface in the region is 0.01 mm to X mm, where X represents, in an indentation test on the waterproof membrane.
    Type: Application
    Filed: April 24, 2020
    Publication date: September 29, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yu KAMAMOTO, Takeo INOUE, Tamao FUKUSHIMA, Hisae KITAGAWA
  • Patent number: 11453199
    Abstract: Provided is a laminate that is excellent in flexibility and has a high bending strength. Also provided is a reinforcing sheet including such laminate. The laminate of the present invention is a laminate including an adhesive layer and a constraining layer, wherein the constraining layer includes an impregnated layer obtained by impregnating a multilayer base material, which is obtained by laminating a plurality of reinforcing fiber sheet-shaped products in each of which reinforcing fiber yarns are arranged in parallel and knitting the products with a stitching thread to integrate the products, with a thermosetting resin composition. The reinforcing sheet of the present invention includes the laminate of the present invention.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: September 27, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takahiro Fujii, Toru Tagami
  • Patent number: 11453762
    Abstract: Provided is a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board. Specifically, a plate-like composite material including polytetrafluoroethylene and a predetermined filler, and satisfying a predetermined condition serves as a composite material that shows a low specific dielectric constant, and that hardly causes an appearance failure or changes in characteristics even when exposed to, for example, a treatment liquid to be used in the production of an electronic circuit board.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: September 27, 2022
    Assignees: NITTO DENKO CORPORATION
    Inventors: Shimpei Yakuwa, Kou Uemura, Shunji Imamura, Tomoyuki Kasagi, Tao Gu
  • Patent number: 11456215
    Abstract: A manufacturing method includes the step of laminating a sheet assembly onto chips arranged on a processing tape, where the sheet assembly has a multilayer structure including a base and a sinter-bonding sheet and is laminated so that the sinter-bonding sheet faces the chips, and subsequently removing the base B from the sinter-bonding sheet. The chips on the processing tape are picked up each with a portion of the sinter-bonding sheet adhering to the chip, to give sinter-bonding material layer-associated chips. The sinter-bonding material layer-associated chips are temporarily secured through the sinter-bonding material layer to a substrate. The sinter-bonding material layers lying between the temporarily secured chips and the substrate are converted through a heating process into sintered layers, to bond the chips to the substrate.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 27, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryota Mita, Tomoaki Ichikawa
  • Publication number: 20220298386
    Abstract: A pressure-sensitive adhesive tape of the present invention includes thermally expandable microspheres, wherein the thermally expandable microspheres are each formed of a shell and a volatile substance contained in the shell, and wherein the shell is formed of a resin having a glass transition temperature (Tg) of 120° C. or more. In one embodiment, the resin for forming the shell contains a constituent unit having a carboxyl group.
    Type: Application
    Filed: July 28, 2020
    Publication date: September 22, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kota NAKAO, Kazuki SOEJIMA
  • Publication number: 20220298400
    Abstract: A fluororesin sheet of the present invention is a sheet mainly including a fluororesin, having a blackness of 30 or less as expressed in terms of L* value in an L*a*b* color system, and having a surface resistivity of 1×1010 ?/sq or more. The fluororesin sheet of the present invention may be a sheet mainly including a fluororesin and including a composite oxide black filler. An adhesive tape of the present invention includes a substrate sheet and an adhesive layer provided on one of surfaces of the substrate sheet, and the substrate sheet is one of the above fluororesin sheets. The fluororesin sheet and the adhesive tape of the present invention unprecedentedly have a high degree of freedom in application development.
    Type: Application
    Filed: September 24, 2020
    Publication date: September 22, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuichi TAKAMURA, Kurato AKIBA
  • Patent number: 11452215
    Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: September 20, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryosuke Sasaoka, Naoki Shibata, Yasunari Oyabu
  • Patent number: 11448917
    Abstract: The liquid crystal display apparatus includes: a liquid crystal panel; a light control layer; and a surface light source device, wherein the liquid crystal panel includes: a liquid crystal cell; a viewer-side polarizing plate; and a back surface-side polarizing plate, wherein the light control layer includes a first transparent substrate; a first transparent electrode layer; a composite layer of a polymer matrix and a liquid crystal compound; a second transparent electrode layer; and a second transparent substrate, wherein the first transparent substrate and the second transparent substrate each independently have a thickness of 70 ?m or less, wherein the first transparent substrate and the second transparent substrate each independently have a front retardation at a wavelength of 590 nm of 100 nm or less, wherein the surface light source device is configured to emit light which has directivity in an approximately normal direction of the light emitting surface.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: September 20, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Jin Yoshikawa, Hiroyuki Takemoto, Mariko Hirai, Masanori Otsuka
  • Publication number: 20220291463
    Abstract: An opto-electric composite transmission module includes a printed wiring board, an electrical connector provided on the printed wiring board, and an opto-electric hybrid board which is electrically connected to the printed wiring board via the electrical connector. The opto-electric hybrid board has a long shape. The opto-electric hybrid board includes an opto-electric conversion portion including a flexible wiring board, a metal support layer, and an optical waveguide film in order in a thickness direction, and an electrical connection portion disposed in one end portion in a longitudinal direction of the opto-electric hybrid board and including the flexible wiring board, and the metal support layer and/or the optical waveguide film. The electrical connection portion is inserted into the electrical connector.
    Type: Application
    Filed: August 7, 2020
    Publication date: September 15, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoyuki TANAKA, Koya OSUKA, Seiki TERAJI
  • Publication number: 20220289616
    Abstract: A method of manufacturing a glass film using a roll-to-roll process in which a long glass film from a feed roll is wound on a winding roll through a plurality of steps, the plurality of steps comprising: a step of cutting the glass film along a feed direction at a predetermined position in a width direction; and a step of polishing cutting surfaces of glass films into which the glass film is cut.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 15, 2022
    Applicant: Nitto Denko Corporation
    Inventors: Takeshi Murashige, Satoru Koshio
  • Publication number: 20220295626
    Abstract: A wireless power supply wiring circuit board includes a first insulating layer, a conductive layer that is on one surface in the thickness direction of the first insulating layer and includes a wiring portion, a transceiver circuit portion that is electrically connected to the wiring portion, a component mounting portion which is on the other surface in the thickness direction of the first insulating layer and on which an electronic component electrically connected to the wiring portion is mounted, and a metal dam portion provided around at least part of the component mounting portion.
    Type: Application
    Filed: February 23, 2022
    Publication date: September 15, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hisashi TSUDA, Kazushi ICHIKAWA, Takashi SASAKI, Masafumi SUZUKI
  • Publication number: 20220294266
    Abstract: A wireless power supply wiring circuit board includes an insulating layer, a first wiring portion which is provided on one surface side in the thickness direction of the insulating layer, a first region including a second wiring portion which is provided on the other side in the thickness direction of the insulating layer, a second region in which the first wiring portion and the second wiring portion are provided on the same flat plane, a transceiver circuit portion, and a component mounting circuit portion which is electrically connected to the transceiver circuit portion.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 15, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hisashi TSUDA, Kazushi ICHIKAWA, Takashi SASAKI, Masafumi SUZUKI
  • Patent number: 11442214
    Abstract: With a simple configuration, an optical device having an in-coupling function to a lightguide is provided. The optical device includes a light guiding layer; and in-coupling optics provided integrally with the light guiding layer to couple light from a light source to an incident edge of the light guiding layer. The in-coupling optics include an optical element that is convex toward the incident edge and an air cavity provided between the optical element and the incident edge.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: September 13, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventor: Kari Rinko
  • Patent number: 11439958
    Abstract: A porous polytetrafluoroethylene (PTFE) membrane of the present disclosure has a water vapor permeability, as measured according to Japanese Industrial Standard (JIS) L 1099 (method B-1), of 150000 g/(m2·day) or more in a thickness direction of the membrane. The porous PTFE membrane of the present disclosure, when attached as a waterproof air-permeable membrane to a housing of an electrical component or electrical device, allows water vapor residing inside the housing to be quickly discharged out of the housing.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 13, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Teppei Tezuka, Youzou Yano, Kazuhiro Omura, Tomoyuki Kasagi
  • Publication number: 20220280986
    Abstract: A method for releasing an adherend of the present invention includes a first step and a second step. In the first step, a bonded product (100) including a pressure-sensitive adhesive layer (10), and an adherend (20) bonded thereto is prepared. The pressure-sensitive adhesive layer (10) includes a pressure-sensitive adhesive component and a gas generating agent. In the second step, a laser light (L) is irradiated to the pressure-sensitive adhesive layer (10)-side of the bonded product (100) to heat a part of the pressure-sensitive adhesive layer (10). A pressure-sensitive adhesive composition of the present invention is a composition used for forming the pressure-sensitive adhesive layer (10) in the method.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA |, Keisuke HIRANO, Kiichiro MATSUSHITA
  • Publication number: 20220282129
    Abstract: Provided is an optical pressure-sensitive adhesive composition that gives a pressure-sensitive adhesive layer having such heating reworkability as to be easily removed from a component such as cover glass at a temperature higher than the service temperature of an image display device. The optical pressure-sensitive adhesive composition of the present invention gives a release force X of 4.0 N/20 mm or less, where the release force X is a release force determined by applying a film to a glass plate through a pressure-sensitive adhesive layer made from the optical pressure-sensitive adhesive composition, and puling the film at a temperature of 100° C., a peel angle of 180 degrees, and a tensile speed of 50 mm/min.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 8, 2022
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinya YAMAMOTO, Sho TAKARADA, Naofumi KOSAKA, Takahiro NONAKA
  • Patent number: RE49229
    Abstract: This invention provides methods and compositions for preventing, treating or ameliorating one or more symptoms of a malignant tumor associated with KRAS mutation in a mammal in need thereof, by identifying a tumor cell in the mammal, the tumor cell comprising at least one of: (i) a mutation of the KRAS gene, and (ii) an aberrant expression level of KRAS protein; and administering to the mammal a therapeutically effective amount of a composition comprising one or more RNAi molecules that are active in reducing expression of GST-?.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 4, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenjirou Minomi, Jihua Liu, Li Wang, Bharat Majeti, Roger Adami, Wenbin Ying