Patents Assigned to Nitto Denko Corporation
  • Patent number: 11834288
    Abstract: A method of conveying a glass film composite uses a roll-to-roll process for winding a glass film composite wound on a feed roller by a winding roller through a plurality of conveyance rollers. The glass film composite includes an elongated glass film, and linear resin tapes disposed on one side of the glass film along a longitudinal direction of the glass film at both ends in a width direction of the glass film. The method includes a step of conveying the glass film composite from the feed roller to the winding roller through the plurality of conveyance rollers without passing a state in which the glass film composite is bent so that the resin tapes are directed to the inside.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: December 5, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takeshi Murashige, Junichi Inagaki, Keisuke Sato, Atsushi Kishi
  • Patent number: 11834761
    Abstract: An adhesive tape substrate production method disclosed in the present description includes the steps of decreasing the amount of a sizing agent contained in a glass cloth by heat; impregnating the glass cloth for which the amount of the sizing agent has been decreased with a dispersion of a fluorine resin; and heating the impregnated glass cloth to a temperature equal to or higher than a melting point of the fluorine resin. Thus, an adhesive tape substrate including the glass cloth impregnated with the fluorine resin is obtained. This method are more productive of adhesive tape substrates and adhesive tapes than conventional methods. In addition, adhesive tape substrates and adhesive tapes for which the occurrence of defects in appearance are reduced can be produced.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: December 5, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshinori Watanabe, Hiroki Kigami, Yuta Kuroki
  • Patent number: 11837377
    Abstract: The electrically conductive composition includes an electrical conductive polymer, a binder resin, and at least one of a cross-linking agent and a plasticizer.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: December 5, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Eiji Toyoda, Naoya Sugimoto, Ryoma Yoshioka
  • Publication number: 20230383146
    Abstract: A method of producing a double-sided pressure-sensitive adhesive sheet includes a step of applying a water-dispersed pressure-sensitive adhesive composition onto a release liner to form a coating film, a step of drying the coating film by heating to form a pressure-sensitive adhesive layer, a step of bonding a first surface of a substrate film to an exposed surface of the pressure-sensitive adhesive layer, a step of applying a water-dispersed pressure-sensitive adhesive composition onto a second surface of the substrate film to form a coating film, and a step of drying the coating film by heating to form a pressure-sensitive adhesive layer.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shuhei YAMAMOTO, Amane SAWAMURA
  • Publication number: 20230383145
    Abstract: The double-sided pressure-sensitive adhesive sheet of the present invention includes a substrate film, a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer, and a release liner. The substrate film has a first surface and a second surface opposite the first surface. The first pressure-sensitive adhesive layer is disposed on the first surface, and has a first adhesive surface opposite the substrate film. The second pressure-sensitive adhesive layer is formed from a coating film of the pressure-sensitive adhesive composition applied on the second surface, and has a second adhesive surface opposite the substrate film. The release liner is in releasable contact with the first adhesive surface. The emission amount of toluene and ethyl acetate from the first pressure-sensitive adhesive layer on heating at 80° C. for 30 minutes is 10 ?g/g or less.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shuhei YAMAMOTO, Amane SAWAMURA
  • Publication number: 20230389179
    Abstract: Provided is a method for producing a wiring circuit board having excellent transportability. The method for producing a wiring circuit board includes a first step to a third step. In the first step, an assembly sheet is overlapped with a supporting sheet in a thickness direction. The assembly sheet includes a plurality of wiring circuit boards and a supporting portion supporting the plurality of wiring circuit boards. The supporting portion supports the assembly sheet. In the second step, the plurality of wiring circuit boards are separated from the supporting portion by cutting. In the third step, the assembly sheet including the plurality of wiring circuit boards separated from the supporting portion is conveyed, while being supported by the supporting sheet.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazutoshi KINOSHITA, Hayato TAKAKURA, Ryosuke SASAOKA
  • Patent number: 11829015
    Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: November 28, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masayuki Hodono, Akihito Matsutomi, Tomohiro Taruno, Yoshinori Kouno, Hidenori Onishi, Shunsuke Shuto
  • Publication number: 20230372858
    Abstract: An air filter medium includes a collection layer, an air-permeable adhesive layer, and a porous fluorine resin membrane in this order from upstream to downstream of the filter medium. An initial pressure drop of the filter medium at a permeate flow rate of 5.3 cm/sec is 250 Pa or less. When a test is performed in which polydisperse polyalphaolefin particles having a peak in number in a particle size range of 0.1 to 0.2 ?m are allowed to pass through the filter medium at a concentration of 0.2 to 0.5 g/m3 and a linear velocity of 5.3 cm/sec, the holding amount is 43.0 g/m2 or more from a moment when the holding amount reaches 20 g/m2 to when a moment the pressure drop reaches PD1+120 Pa, where PD1 is the pressure drop of the filter medium at the moment when the holding amount reaches 20 g/m2.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 23, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke IKEMURA, Masaaki MORI, Shunsuke MASAKI, Go SATO
  • Publication number: 20230380058
    Abstract: Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 23, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hideki MATSUI, Naoki SHIBATA, Ryosuke SASAOKA
  • Patent number: 11820114
    Abstract: The present invention provides a method for producing a porous silicone sheet comprising a freezing step of freezing a wet gel of a porous silicone body having communicating pores and a three-dimensional network silicone skeleton which forms the pores and which is formed by a copolymerization of a bifunctional alkoxysilane and a trifunctional alkoxysilane, to obtain a frozen body, a sheet forming step of forming the frozen body into a sheet to obtain a porous silicone sheet, and a cleaning step of cleaning the porous silicone sheet. According to the method of the present invention, a porous silicone body from which impurities have been sufficiently removed can be produced. In the course of the production, occurrence of fracture of a wet gel can be effectively prevented.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: November 21, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventor: Naoyuki Matsuo
  • Patent number: 11825598
    Abstract: A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: November 21, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryosuke Sasaoka, Yasunari Oyabu, Hiroaki Machitani, Hayato Takakura
  • Publication number: 20230364843
    Abstract: A resin fiber formation nozzle 20 of the present invention is a nozzle configured to discharge a molten resin material into a fiber shape. The nozzle 20 includes: the internal flow path 21; an inlet 22 that allows the resin material to flow into the internal flow path 21; and an outlet 23 that allows the resin material to be discharged from the internal flow path 21 to an outside of the nozzle 20. The internal flow path 21 is shaped such that a diameter of the internal flow path 21 decreases continuously, in a section from a position A 5 mm upstream in the internal flow path 21 from the outlet 23 to a position B of the outlet 23, from the position A toward the position B.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 16, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hajime Michihira, Teppei Okumura, Takashi Kumano, Yuto Nagaya
  • Publication number: 20230364547
    Abstract: A provided air filter medium is an air filter medium including a porous fluorine resin membrane, the air filter medium further including: a glass filter medium layer. The glass filter medium layer and the porous fluorine resin membrane are placed in this order from upstream to downstream of the air filter medium configured to allow an air flow to pass through the air filter medium. At a surface of the glass filter medium layer on an upstream side in a direction of the air flow, a carbon-to-silicon ratio (C/Si) evaluated by X-ray fluorescent analysis is 0.020 or more. This air filter medium is suitable for reducing a pressure drop increase even in an environment including liquid particles such as oil mist.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 16, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Go SATO, Masaaki MORI, Shunsuke MASAKI, Yusuke IKEMURA
  • Patent number: 11817415
    Abstract: Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sheet. A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating, and the precursor layer includes sinterable metallic particles and an organic component, the precursor layer has a phase separation structure that is a sea-island structure or a co-continuous structure, and in a SEM surface observation image on at least one surface of the precursor layer, a maximum value among each diameter of the largest inscribed circle for a region occupied by each phase of the phase separation structure is 1 ?m or more and 50 ?m or less.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: November 14, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Honda, Yuki Sugo, Nao Kamakura
  • Publication number: 20230356152
    Abstract: An air filter medium includes a porous fluorine resin membrane, and further includes, a collection layer, an air-permeable adhesive layer, and an air-permeable supporting layer. The collection layer, the air-permeable adhesive layer, the air-permeable supporting layer, and the porous fluorine resin membrane are placed in this order from upstream to downstream of the air filter medium configured to allow an air flow to pass through the air filter medium. The collection layer is formed of a fibrous material having an average fiber diameter of 5 µm or less. The air-permeable adhesive layer has a grammage of 5.5 g/m2 or more. The air-permeable supporting layer is formed of a fibrous material having an average fiber diameter of more than 5 µm. This air filter medium is suitable for reducing a pressure drop increase even in an environment including liquid particles such as oil mist.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 9, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masaaki MORI, Go SATO, Shunsuke MASAKI, Yusuke IKEMURA
  • Publication number: 20230358942
    Abstract: A lighting device that can ensure task productivity while reducing the glare is provided herein. The lighting device has a light source; and a light guiding part including a light guiding panel and configured to guide light that is emitted from the light source. The light guiding panel includes: a light incident end surface that is situated facing the light source, the light incident end surface being a surface on which the light emitted from the light source is incident; a first light emitting part that is included in an opposite end from the light incident end surface, and that emits the light guided inside the light guiding panel; and a second light emitting part that is included in a predetermined main surface of the light guiding panel that intersects with the light incident end surface, and that emits the light guided inside the light guiding panel.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 9, 2023
    Applicant: Nitto Denko Corporation
    Inventors: Kozo NAKAMURA, Yufeng WENG, Takahiro YOSHIKAWA
  • Publication number: 20230356500
    Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600 ?/?. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100 ?/?.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Eri Ueda, Hiroichi Ukei, Takehiro Ui
  • Patent number: 11806980
    Abstract: An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600?/?. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100?/?.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: November 7, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kazuto Yamagata, Hironobu Machinaga, Eri Ueda, Hiroichi Ukei, Takehiro Ui
  • Patent number: 11811081
    Abstract: A ventilation unit with: a ventilation body that allows gas to circulate between the outside and inside of a housing; a support member that supports the body attached to an opening portion formed in the housing; and a sealing member between the support member and the outer surface around the housing opening portion and seals a gap between the support member and the housing, wherein the unit performs ventilation between the outside and inside of the housing through the body while attached to the opening portion of the housing. The support member includes: an attachment portion to which the sealing member is attached; and a wall portion around the attachment portion, wherein, in a state where the support member is attached between the support member and the housing, a distance between the support member and an external surface in the support member wall portion is 5.0 mm or more.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: November 7, 2023
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yusuke Nakayama, Youzou Yano, Kou Uemura
  • Publication number: 20230347605
    Abstract: The present invention provides a fiber manufacturing method suitable for reducing the variation in outer diameter. The fiber manufacturing method of an embodiment of the present invention includes: discharging a softened linear body 1 through a nozzle 10; and winding the linear body 1 so that the linear body 1 passes through a cooling portion 20 supplied with a cooling fluid 50, thereby obtaining a fiber 5. The cooling portion 20 has a filter 40 configured to rectify the cooling fluid 50. The cooling fluid 50 in the cooling portion 20 has a temperature that is substantially constant in a moving direction of the linear body 1. According to the fiber manufacturing method of the embodiment, an index M determined by the following equation (I) is 1.52 or less.
    Type: Application
    Filed: June 4, 2021
    Publication date: November 2, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hajime Michihira, Takashi Kumano, Tetsuya Takagi, Yuto Nagaya