Patents Assigned to Nitto Denko Corporation
  • Patent number: 11945984
    Abstract: A reinforcing film comprises a pressure sensitive adhesive layer laminated and fixed on a principal surface of a film substrate. The pressure sensitive adhesive layer is formed of a photocurable composition containing a photocurable agent and a base polymer having a crosslinked structure. The gel fraction of the photocurable composition is preferably 60% or more. The shear storage elastic modulus at 25° C. of the pressure sensitive adhesive layer is preferably 1×104 to 1.2×105 Pa. The shear storage elastic modulus at 25° C. of the pressure sensitive adhesive layer after photocuring is preferably 1.5×105 to 2×106 Pa.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: April 2, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takeshi Nakano, Keiji Hayashi, Souya Jo, Shogo Sasaki, Kenichi Kataoka
  • Patent number: 11948720
    Abstract: An inductor includes a wire having a generally circular shape in cross section, and the magnetic layer covering the wire, wherein the wire includes a conductive wire and an insulating layer covering the conductive wire, the magnetic layer contains anisotropic magnetic particles and a binder, and includes in a surrounding region of the wire within 1.5 times the radius of the wire, a first region in which the anisotropic magnetic particles are oriented along the circumferential direction of the wire, and a second region in which the anisotropic magnetic particles are oriented along the crossing direction that crosses the circumferential direction, or in which the anisotropic magnetic particles are not oriented.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: April 2, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshihiro Furukawa, Keisuke Okumura
  • Patent number: 11950051
    Abstract: A piezoelectric speaker (10) includes: a piezoelectric film (35); a fixing face (17) for fixing the piezoelectric film (35) to a support; and an interposed layer (40) disposed between the piezoelectric film (35) and the fixing face (17). The interposed layer (40) has a holding degree of 5×108 N/m3 or less.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: April 2, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yusuke Komoto, Tomoaki Hishiki, Kohei Oto, Saori Yamamoto, Yuka Sekiguchi
  • Patent number: 11948907
    Abstract: The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 2, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Ryota Mita, Tomoaki Ichikawa
  • Publication number: 20240101870
    Abstract: The present invention provides a void-containing layer in which a pressure-sensitive adhesive or an adhesive is less liable to penetrate into voids. A void-containing layer of the present invention, includes: particles chemically bonding to each other, wherein the void-containing layer has a void fraction of 35 vol % or more, the particle is an inorganic-organic composite particle in which an organic group is bonded to an inorganic compound, the organic group includes a R1 group which is a linear or branched alkyl group and a R2 group which is a group containing a carbon-carbon unsaturated bond, and a molar ratio of the R2 group relative to a sum of the R1 group and the R2 group is from 1 to 30 mol %.
    Type: Application
    Filed: January 25, 2022
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Ryota Morishima, Atsushi Kishi
  • Publication number: 20240107679
    Abstract: An assembly sheet includes a plurality of wiring circuit boards, a support portion, a connecting portion, and an opening portion. The wiring circuit board includes a first and a second wiring circuit board. The connecting portion includes a first and a second connecting portion connected to the first and the second wiring circuit board, respectively. The support portion and the connecting portion are not disposed between the first and the second wiring circuit board. The first wiring circuit board includes a first main body portion and a first protrusion portion. The second wiring circuit board includes a second main body portion. A first line passing a center of the first main body portion and a second line passing the center of the second main body portion are deviated so that a protrusion amount of the first protrusion portion with respect to the second main body portion is small.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenya TAKIMOTO, Hiroaki MACHITANI
  • Publication number: 20240107683
    Abstract: A wiring circuit board includes a first insulating layer; a conductive pattern disposed on one side of the first insulating layer in a thickness direction; and a metal support layer disposed on the other side of the first insulating layer in the thickness direction. The metal support layer has a terminal support portion supporting three terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern. A thickness of each of the wiring support portions is thinner than a thickness of the terminal support portion.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
  • Publication number: 20240107667
    Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a metal layer on one side of the substrate in a thickness direction; a step of forming a first insulating layer on one side of the metal layer in the thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of removing the substrate and exposing the metal layer; and a step of depositing a metal on the other side of the metal layer in the thickness direction and forming a first metal support layer. The first metal support layer has a terminal support portion supporting two terminals of a conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
  • Publication number: 20240101868
    Abstract: A moisture barrier material including a carrier, an adhesive layer formed on at least one surface of the carrier, and a release treated liner, wherein the moisture barrier material has a nonplanar shape, and a method for manufacturing the same.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Applicants: NITTO, INC., NITTO DENKO CORPORATION
    Inventors: Derek Jorgensen, Chad Joldersma
  • Publication number: 20240107664
    Abstract: A method for producing a wiring circuit board includes a step of preparing a substrate; a step of forming a first insulating layer on one side of the substrate in a thickness direction; a step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; a step of etching the substrate to form a first metal support layer on the other side of the first insulating layer in the thickness direction; and a step of depositing a metal on the other side of the first metal support layer in the thickness direction to form a second metal support layer. The second metal support layer has a terminal support portion supporting two terminals of the conductive pattern, a wiring support portion supporting a wiring of the conductive pattern, and a second wiring support portion supporting a second wiring of the conductive pattern.
    Type: Application
    Filed: September 20, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenta FUKUSHIMA, Hayato TAKAKURA, Naoki SHIBATA, Ryosuke SASAOKA
  • Publication number: 20240103307
    Abstract: A peeking prevention system includes: a display device having a display plane from which to emit linearly polarized light; a partition to delimit from the surroundings a space in which displaying is to be provided by the display device, the partition having a light-transmitting portion through which the inside of the space is viewable; and an optical stack placeable in opposing relationship with the display plane of the display device. The light-transmitting portion includes a transparent substrate and a first polarizing layer, the first polarizing layer having a first absorption axis that is parallel to a first direction. The optical stack includes a second polarizing layer having a second absorption axis that is parallel to a second direction, the second direction being orthogonal to the first direction, and a ½ wave plate at a side of the second polarizing layer facing the display plane.
    Type: Application
    Filed: July 25, 2023
    Publication date: March 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuji Toyota, Masahiro Yaegashi, Masanori Otsuka
  • Patent number: 11940120
    Abstract: A desktop illumination device includes a light source; and a light guide including a light guide plate. The light guide plate has a light incident surface and first and second main surfaces. An angle at which an intensity becomes maximum in a light distribution of light emitted from the first main surface is in a range of ?90° or more to less than 0°, in a case where an axis passing through a center of the first main surface and perpendicular to an installation surface is defined as a vertical axis, and in a plane including the vertical axis and perpendicular to the installation surface, a direction parallel to the installation surface is defined as vertical 0°, an upward angle with respect to the vertical 0° is defined as a positive angle, and a downward angle with respect to the vertical 0° is defined as a negative angle.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takahiro Yoshikawa, Kozo Nakamura, Yufeng Weng
  • Patent number: 11937940
    Abstract: The present disclosure generally relates to a measurement device (110) and a method (200/300) for stress assessment of a user. The measurement device (110) comprises: a sensor module for measuring a number of sets of physiological data, each set of measured during a time period; a database (112) for storing the data; a display module (116) for displaying visual information (400/420/440).
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 26, 2024
    Assignee: Nitto Denko Corporation
    Inventors: Visit Thaveeprungsriporn, Shoko Trepetch, Amornsri Khitwongwattana, Anyamanee Pornpanvattana, Ananya Chaithanaboon
  • Publication number: 20240094453
    Abstract: According to the present invention, a technology by which the design property of a section can be improved while a desired portion in the section is shielded can be achieved. The present invention provides a polarized partition set, including: a first polarized partition, which includes a polarizer A1 and a retardation layer having an in-plane retardation Re(550) of 100 nm or more, and in which an angle formed by an absorption axis direction of the polarizer A1 and a slow axis direction of the retardation layer is more than 10° and less than 80°, or more than 100° and less than 170° clockwise or counterclockwise with respect to the absorption axis direction of the polarizer A1; and a second polarized partition, which includes a polarizer B and is arranged at a predetermined interval from the first polarized partition.
    Type: Application
    Filed: December 21, 2021
    Publication date: March 21, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuji Toyota, Yufeng Weng
  • Publication number: 20240093060
    Abstract: Provided is a hot-melt PSA composition having a low viscosity when melted with heat and capable of suitably forming a PSA layer. A hot-melt PSA composition comprising a base polymer is provided. The base polymer comprises acrylic polymers A and B. The acrylic polymer A is a polymer of monomers comprising, as the primary component, a (meth)acrylic monomer A having an alkyl group with 4 to 8 carbon atoms. The acrylic polymer B is a polymer of monomers comprising, as a primary component, a (meth)acrylic monomer B having an alkyl group with 9 to 12 carbon atoms. In the base polymer, with the total amount of the acrylic polymers A and B being 100% by weight, the acrylic polymer B content is 10% by weight or more and 90% by weight or less.
    Type: Application
    Filed: January 26, 2022
    Publication date: March 21, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori TAMURA, Itsuhiro HATANAKA, Nobukazu NEGISHI
  • Patent number: 11933979
    Abstract: A head-up display apparatus that is excellent in viewability. A head-up display apparatus according to an embodiment of the present invention includes: a display unit configured to emit projection light, the display unit including a display cell, and a first polarizing plate with a retardation layer, which is arranged on an emission side of the display cell, and which includes a polarizer and a first retardation layer in the stated order from a display cell side; at least one reflector configured to reflect the projection light; and a second polarizing plate with a retardation layer, which is arranged on a reflection surface of the reflector, and which includes a polarizer and a second retardation layer in the stated order from a reflector side. The first retardation layer and the second retardation layer each have an in-plane retardation Re(550) of from 100 nm to 200 nm.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 19, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshiaki Asanoi, Takehito Fuchida, Katsunori Takada
  • Patent number: 11933997
    Abstract: A heat-ray-transmission-controllable, light-transmissive base material is provided that includes a light-transmissive insolation-cutting unit configured to control transmission of light in at least a part of wavelength regions among wavelength regions of visible light and near-infrared light; and a transparent conductive oxide layer disposed over the light-transmissive insolation-cutting unit, containing a transparent conductive oxide.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: March 19, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yosuke Nakanishi, Eri Ueda, Hironobu Machinaga, Yutaka Ohmori
  • Publication number: 20240087794
    Abstract: An inductor including a magnetic layer, and a plurality of wires embedded in the magnetic layer and extending in a longitudinal direction. The plurality of wires are spaced in parallel at predetermined intervals in a direction perpendicular to the longitudinal direction. The magnetic layer includes a plurality of wire disposed portions in which the wires are regularly disposed in parallel to each other, and a margin portion that is disposed between the wire disposed portions adjacent to each other in a parallel direction of the wires and in which the wires are omitted.
    Type: Application
    Filed: February 3, 2022
    Publication date: March 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshihiro FURUKAWA, Keisuke OKUMURA
  • Publication number: 20240090128
    Abstract: A wiring circuit board includes a metal supporting substrate, an insulating layer, and a conductive layer in this order in a thickness direction. The conductive layer includes at least one terminal portion and a wiring portion extending from the terminal portion. The metal supporting substrate has an opening portion. The opening portion penetrates the metal supporting substrate in the thickness direction and faces the terminal portion through the insulating layer. The opening portion has a first opening peripheral edge on one side in the thickness direction and a second opening peripheral edge on the other side in the thickness direction. In a projected view in the thickness direction, the second opening peripheral edge is disposed outside the first opening peripheral edge and extends along the first opening peripheral edge.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusaku TAMAKI, Shusaku SHIBATA, Teppei NIINO
  • Publication number: 20240085251
    Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Applicants: Nitto Bend Technologies, Inc., Nitto Denko Corporation
    Inventors: Colton A. Ottley, Jared K. Jonas, Colin D. Eichinger, Nathan Grimes, Nathan C. Briggs