Patents Assigned to Nitto-Denko
  • Patent number: 12159998
    Abstract: A carbon electrode includes a substrate, and a conductive carbon layer disposed at an upper side of the substrate and having an sp2 bond and an sp3 bond. On an upper surface of the conductive carbon layer, the concentration ratio of oxygen to carbon is 0.07 or more. The ratio of a number of sp3 bonded carbon atoms to the sum of a number of sp2 bonded carbon atoms and the number of sp3 bonded carbon atoms is 0.35 or more.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: December 3, 2024
    Assignees: NITTO DENKO CORPORATION, NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Motoki Haishi, Mitsunobu Takemoto, Tatsuya Kitahara, Kentaro Takeda, Dai Kato, Tomoyuki Kamata
  • Patent number: 12158608
    Abstract: A cutting jig includes a fixing member for inserting a distal end portion of an optical fiber, and an inclination cutting unit movable with respect to the fixing member for cutting the distal end portion. The distal end portion is defined into a proximal end portion and a free end portion. The inclination cutting unit includes a one end edge of a closing plate and a blade portion incapable of relative movement to each other. The inclination cutting unit can perform a first movement and a second movement that is a greater movement amount than the first movement. The one end edge is brought into contact with the free end portion based on the first movement, and the free end portion moves to be inclined with respect to an extension line EL. A blade edge is brought into contact with the free end portion based on the second movement.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: December 3, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kazumasa Okada, Keita Kiyoshima, Yuichi Tsujita
  • Publication number: 20240397609
    Abstract: A wiring circuit board includes a first insulating layer, a wiring pattern disposed at one side of the first insulating layer in a thickness direction and including a terminal and a wire connected with the terminal, and a shield pattern disposed at the one side of the first insulating layer in the thickness direction and spaced apart from and adjacent to a part of the wire. The wire is made of a first conductive layer, and the shield pattern is made of a second conductive layer.
    Type: Application
    Filed: May 8, 2024
    Publication date: November 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomoaki TANAKA, Hayato TAKAKURA, Ryosuke SASAOKA
  • Publication number: 20240392051
    Abstract: Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The polymer (A) has an SP value of 9.8 (cal/cm3)1/2 or greater and a glass transition temperature of 0° C. or lower, calculated based on the composition of the monomers forming the polymer (A).
    Type: Application
    Filed: May 13, 2022
    Publication date: November 28, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takeshi IGARASHI, Koki HASHIMOTO, Eiichi IMOTO, Chihiro YOSHIDA
  • Patent number: 12153250
    Abstract: A method for manufacturing a light distribution structure in the form of an optically functional layer includes at least one three-dimensional feature pattern established in a light-transmitting carrier by a plurality of three-dimensional optical features. The method also includes manufacturing a patterned master tool for the at least one three-dimensional feature pattern by a piezoelectric cutting method selected from a fast tool servo method and a stylus engraving method, or by a laser engraving method, and transferring the at least one three-dimensional feature pattern onto the light-transmitting carrier.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: November 26, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventor: Kari Rinko
  • Patent number: 12156474
    Abstract: For a piezoelectric device, an optical characteristic and/or a piezoelectric characteristic is improved. A piezoelectric device has a first electrode layer, a second electrode layer, and a piezoelectric layer provided between the first electrode layer and the second electrode layer, wherein the piezoelectric layer is formed of a wurtzite crystal material as a main component, to which one or more elements is/are added, said one or more elements being transparent when turned into an oxide, and wherein a haze value is 3% or less, and transmittance with respect to light having a wavelength of 380 nm is 50% or more.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: November 26, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Nakamura, Naoki Nagaoka, Manami Kurose, Hironobu Machinaga
  • Patent number: 12156330
    Abstract: A light-transmitting electroconductive film (20) according to the present invention includes a region containing krypton at a content ratio of less than 0.1 atomic % at least partially in a thickness direction (D) of the light-transmitting electroconductive film (20). A transparent electroconductive film (X) according to the present invention includes a transparent substrate (10); and the light-transmitting electroconductive film (20) disposed on one surface side in the thickness direction (D) of the transparent substrate.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: November 26, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Nozomi Fujino, Taisuke Karasuda
  • Publication number: 20240384139
    Abstract: Provided are a pressure-sensitive adhesive tape in which anchoring failure is suppressed and a method of producing the pressure-sensitive adhesive tape. The pressure-sensitive adhesive tape includes a base material including an olefin-based resin, a first pressure-sensitive adhesive layer including an olefin-based resin, and a second pressure-sensitive adhesive layer including a styrene-based elastomer in the stated order.
    Type: Application
    Filed: September 28, 2022
    Publication date: November 21, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Sho UCHIDA, Kohei TAKEDA, Kentaro UCHIDA, Shinsuke IKISHIMA
  • Patent number: 12146799
    Abstract: Provided is a temperature sensor film comprising a metal-thin film patterned on a resin film substrate, and having high temperature measurement accuracy. A conductive film (102) that is used for producing a temperature sensor film has a nickel thin film (10) on one principal surface of a resin film substrate (50). It is preferable that the interplanar spacing of nickel (111) plane in the nickel thin-film is less than 0.2040 nm. The temperature sensor film is obtained by patterning the nickel thin film to form a temperature-measuring resistance part and a lead part connected to the temperature-measuring resistance part.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 19, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Yasui, Kodai Miyamoto, Katsunori Shibuya
  • Patent number: 12147068
    Abstract: A lightguide component for illumination devices having first and second exit surfaces at opposite sides, the lightguide component including: a light-receiving portion to receive light emitted from a light source; a lightguide layer having a first principal face at the first exit surface side and a second principal face at the second exit surface side; and a light distribution controlling structure having a plurality of internal spaces. Each of the plurality of internal spaces includes a first slope to direct a portion of light propagating in the lightguide layer toward the first exit surface via total internal reflection, and a second slope at an opposite side from the first slope, and the lightguide component is configured to emit first light having a first intensity distribution through the first exit surface and to emit second light having a second intensity distribution through the second exit surface.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: November 19, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Koichi Inoue, Yufeng Weng, Kozo Nakamura
  • Publication number: 20240375336
    Abstract: A method is disclosed for manufacturing a plastic optical fiber composed of a plurality of layers including a core and a cladding, which includes forming at least one layer formed of the plurality of layers by melt extrusion molding of a material resin using a melt extrusion unit including an extrusion screw, wherein a pellet of the material resin is fed to the melt extrusion unit, and a relation expressed by the following inequality (I) is satisfied by a flight height Hf (mm) of the extrusion screw in a feed zone Lf of the melt extrusion unit and a maximum dimension Lmax (mm) of the pellet to be fed: 0?Hf?Lmax?3 (I); and a volume V (mm3) of the pellet satisfies the following inequality (II): 4<V<25. The manufacturing method is suitable for further improvement of the quality of plastic optical fibers.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya Araki, Kenichiro Nishiwaki, Sho Irie, Yasuharu Imamura
  • Publication number: 20240376351
    Abstract: Provided is a pressure-sensitive adhesive sheet to be subjected to temporary fixing of an electronic part to a support, the pressure-sensitive adhesive sheet being capable of exhibiting peelability from the support through irradiation with laser light, and reducing a residue on the support after its peeling. A pressure-sensitive adhesive sheet for temporarily fixing an electronic part of the present invention includes: a photothermal conversion layer; and a thermal decomposition layer directly arranged on the photothermal conversion layer. A 5% weight loss temperature of the thermal decomposition layer after UV irradiation is lower than a 5% weight loss temperature of the photothermal conversion layer after UV irradiation.
    Type: Application
    Filed: March 30, 2022
    Publication date: November 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shusaku UENO, Kazumichi KATO, Takamasa HIRAYAMA
  • Publication number: 20240377576
    Abstract: A plastic optical fiber suitable for reducing interfacial delamination between a clad and a coating layer. The plastic optical fiber includes: a core; a clad disposed on an outer circumference of the core and including a fluorine-containing resin; and a coating layer disposed on an outer circumference of the clad, the coating layer consisting of a material. The material has an elongation, as measured by a given test, of 0.05% or less.
    Type: Application
    Filed: March 16, 2022
    Publication date: November 14, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroshi OHMURA, Takashi SHIMIZU
  • Patent number: 12144130
    Abstract: A ventilation component 1 includes a ventilation path 10 for allowing ventilation between an inner space 2u and an outer space 2s of a housing 2. The ventilation path 10 is a path for allowing ventilation between the internal space 2u and the outer space 2s when the ventilation component 1 is attached to an edge 2f. The ventilation component 1 includes a supporting portion 12, a gas-permeable membrane 11, a protruding portion 13, and a sealing member 14. The supporting portion 12 surrounds the ventilation path 10. The gas-permeable membrane 11 is bonded to the supporting portion 12 and closes the ventilation path 10 in a ventilatable manner. The protruding portion 13 is a part having a tubular shape, the part being arranged to protrude from the supporting portion 12 and surround one end of the ventilation path 10, the part being configured to be in contact with the edge 2f when the ventilation component 1 is attached to the edge 2f. The ventilation component 1 satisfies requirements 2.5?Gs/Gt?5.0 and 1.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: November 12, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Youzou Yano, Tomoyuki Kasagi
  • Patent number: 12144125
    Abstract: A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: November 12, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takahiro Takano, Takahiro Minatoya
  • Publication number: 20240373564
    Abstract: An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The frame has a through hole. The reinforcement portion is disposed on the edge of the through hole. The reinforcement portion reinforces the edge of the through hole.
    Type: Application
    Filed: January 26, 2022
    Publication date: November 7, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventor: Makoto TSUNEKAWA
  • Patent number: 12137522
    Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 5, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Rihito Fukushima, Shusaku Shibata, Teppei Niino
  • Patent number: 12135247
    Abstract: An electroconductive film (101) comprises a metal thin-film (10) on a first main surface of a flexible substrate (40) that includes a resin film (5). The thickness of the flexible substrate is 1 mm or less. The absolute value |H2?H1| of the difference between the heating dimensional change rate H1 of the electroconductive film and the heating dimensional change rate H2 of a film obtained by removing the metal thin-film from the electroconductive film is preferably 0.10% or less. There is a tendency that undulation of a temperature sensor film after patterning of the metal thin-film is further suppressed as the value of |H2?H1| decreases.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 5, 2024
    Assignee: NITTO DENKO CORPORATION
    Inventors: Satoshi Yasui, Kazuhiro Nakajima, Kodai Miyamoto
  • Publication number: 20240361539
    Abstract: The optical communication cable includes an optical cord, a connector, a first housing, a second housing, and a resin for fixing the optical cord. An end portion of the optical cord for connection to the connector has a first end region and a second end region. A tip portion of the plastic optical fibers in the first end region is connected to the connector. The resin is disposed so as to be in contact with the end portion of the optical cord and the second housing. Expression is satisfied: t ? 1 ? t ? 2 + 5 ( 1 ) where t1 is the coefficient of linear expansion of the resin and t2 is the coefficient of linear expansion of the plastic optical fibers.
    Type: Application
    Filed: April 8, 2024
    Publication date: October 31, 2024
    Applicant: NITTO DENKO CORPORATION
    Inventors: Ryuji KISHI, Naoto KONEGAWA, Ryoya UMEYAMA, Seiki TERAJI
  • Patent number: D1051967
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: November 19, 2024
    Assignee: Nitto Denko Corporation
    Inventor: Mai Ozawa