Patents Assigned to Nitto-Denko
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Patent number: 12071761Abstract: A sound reducing system (500) includes at least one sound reducing speaker for radiating a sound wave for sound reduction. The at least one sound reducing speaker includes a piezoelectric speaker (10). The piezoelectric speaker (10) includes a piezoelectric film (35), a fixing face (17) in contact with a support supporting the piezoelectric speaker (35), and a film holding portion (55) disposed between the piezoelectric film (35) and the fixing face (17). (i) The film holding portion (55) includes a pressure-sensitive adhesive layer and the fixing face (17) is formed of a surface of the pressure-sensitive adhesive layer and/or (ii) the film holding portion (55) includes a porous body layer.Type: GrantFiled: November 20, 2018Date of Patent: August 27, 2024Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Komoto, Tomoaki Hishiki, Kohei Oto, Saori Yamamoto, Yuka Sekiguchi
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Patent number: 12071573Abstract: Provided is a PSA sheet having a PSA layer. The PSA layer includes a layer A forming at least one surface thereof. The PSA sheet has an adhesive strength N0 of 2.0 N/10 mm or greater, after one day at room temperature following application of the layer A side to a surface of an alkaline float glass plate as an adherend having a contact angle of 5°-10° with distilled water; has an N1 to N0 reduction rate of 30% or lower, wherein N1 is a water-resistant adhesive strength measured after stored at room temperature for one day, immersed in water for 30 minutes, taken out from the water and then residual water is wiped off, and has an N2 to NO reduction rate of 40% or higher, wherein N2 is a water-peel strength measured after stored at room temperature for one day, 20 ?L distilled water is dropped onto the adherend and is allowed to enter a PSA layer/adherend interfacial edge. N2 is measured at a tensile speed of 300 mm/min at a peel angle of 180°.Type: GrantFiled: January 28, 2019Date of Patent: August 27, 2024Assignee: NITTO DENKO CORPORATIONInventors: Naofumi Kosaka, Yosuke Shimizu, Satoshi Honda, Taiki Shimokuri, Shou Takarada, Masayuki Satake, Kenichi Okada, Atsushi Takashima, Ginji Mizuhara, Masayuki Okamoto, Ryoko Asai
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Patent number: 12070331Abstract: An aspect of the present disclosure generally relates to a wearable physiological device comprising: (a) a first housing assembly comprising: a first housing body; a first circuit assembly removably coupled to the first housing body; a user interface assembly communicatively connected to the first circuit assembly; and (b) a second housing assembly removably coupled to the first housing assembly, the second housing assembly comprising: a second housing body; a second circuit assembly removably coupled to the second housing body, the second circuit assembly comprising a set of physiological sensors; a removable battery disposed on the second circuit assembly; and a flexible connector communicatively connecting the second circuit assembly to the first circuit assembly, wherein the set of physiological sensors are configured for measuring physiological signals from a user wearing the wearable physiological device, the physiological signals communicable to the user interface assembly.Type: GrantFiled: February 28, 2019Date of Patent: August 27, 2024Assignee: Nitto Denko CorporationInventors: Alan Quinn, Colin Gehrig, Denis Greco, Marco Sebastiani
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Publication number: 20240284600Abstract: A method for producing a wiring circuit board includes a first step of setting a pattern forming region and an opening forming region in a supporting layer; a second step of forming a base insulating layer on the supporting layer at least in the pattern forming region; a third step of forming, by electrolytic plating, a conductive pattern on the base insulating layer in the pattern forming region and a dummy pattern in the opening forming region; and a fourth step of etching at least a portion of the supporting layer in the opening forming region.Type: ApplicationFiled: May 24, 2022Publication date: August 22, 2024Applicant: NITTO DENKO CORPORATIONInventors: Hayato TAKAKURA, Naoki SHIBATA, Rei FUKUI, Tomoaki TANAKA
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Publication number: 20240270623Abstract: A method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a brittle material removing step in which irradiation is performed from a brittle material layer side with a laser beam L1, which is oscillated from an ultrashort pulse laser light source 20, along a scheduled dividing line DL of the composite material to form a scribe groove 11; and a resin removing step in which the resin layer is irradiated with a laser beam L2, which is oscillated from a laser light source 30, along the scheduled dividing line to remove a resin forming the resin layer.Type: ApplicationFiled: March 29, 2022Publication date: August 15, 2024Applicant: NITTO DENKO CORPORATIONInventors: Satoshi Hirata, Toshihiro Kanno, Takanobu Yano
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Publication number: 20240272343Abstract: A lightguide component for illumination devices having first and second exit surfaces at opposite sides, the lightguide component including: a light-receiving portion to receive light emitted from a light source; a lightguide layer having a first principal face at the first exit surface side and a second principal face at the second exit surface side; and a light distribution controlling structure having a plurality of internal spaces. Each of the plurality of internal spaces includes a first slope to direct a portion of light propagating in the lightguide layer toward the first exit surface via total internal reflection, and a second slope at an opposite side from the first slope, and the lightguide component is configured to emit first light having a first intensity distribution through the first exit surface and to emit second light having a second intensity distribution through the second exit surface.Type: ApplicationFiled: June 8, 2022Publication date: August 15, 2024Applicant: NITTO DENKO CORPORATIONInventors: Koichi INOUE, Yufeng WENG, Kozo NAKAMURA
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Patent number: 12060263Abstract: A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×105 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.Type: GrantFiled: August 5, 2021Date of Patent: August 13, 2024Assignee: NITTO DENKO CORPORATIONInventors: Hiroki Kigami, Kenji Onishi
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Publication number: 20240263033Abstract: Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at ?30° C. of 2300 MPa or less.Type: ApplicationFiled: May 13, 2022Publication date: August 8, 2024Applicant: NITTO DENKO CORPORATIONInventors: Takeshi IGARASHI, Koki HASHIMOTO, Eiichi IMOTO, Chihiro YOSHIDA
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Publication number: 20240260177Abstract: Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.Type: ApplicationFiled: May 24, 2021Publication date: August 1, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Publication number: 20240260244Abstract: According to the present invention, a laminate has: a fiber aggregate including a plurality of nanofibers aggregated into a sheet; and a reflective substrate on which the fiber aggregate is placed and which has a reflectance of 0.1% or more. In this laminate, the fiber aggregate includes: a first orientation part formed in a part of a thickness direction of the fiber aggregate; and a second orientation part formed nearer to the reflective substrate than the first orientation part and having a lower degree of orientation than the first orientation part.Type: ApplicationFiled: July 28, 2021Publication date: August 1, 2024Applicants: Nitto Denko Corporation, OSAKA UNIVERSITYInventors: Yusuke Kamano, Shotaro Masuda, Masaya Nagai, Tadao Nagatsuma, Masayuki Fujita
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Publication number: 20240260173Abstract: A method for producing a wiring circuit board assembly sheet includes a marking step of forming a mark made of a recessed portion in a metal support board, and after the marking step, an insulating layer forming step of forming a base insulating layer on one surface in a thickness direction of the metal support board formed with the mark.Type: ApplicationFiled: January 21, 2022Publication date: August 1, 2024Applicant: NITTO DENKO CORPORATIONInventors: Yusaku TAMAKI, Rihito FUKUSHIMA, Teppei NIINO
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Patent number: 12050385Abstract: A method of manufacturing a light control element including an extraction electrode portion includes the steps of obtaining a light control film including a first base material with a transparent electrode layer and a second base material with a transparent electrode layer arranged so that transparent electrode layers are opposed to each other, a liquid crystal light control layer sandwiched between the base materials with transparent electrode layers, and an extending portion extending in a direction perpendicular to a thickness direction; inserting peeling means between the base materials with transparent electrode layers in the extending portion, to thereby peel off one base material with a transparent electrode layer from the light control film and bending a peeled portion of the one base material with a transparent electrode layer outward, to snap the peeled portion. The one base material has a breakage bending diameter of from 0.1 mm to 5 mm.Type: GrantFiled: August 29, 2019Date of Patent: July 30, 2024Assignee: NITTO DENKO CORPORATIONInventors: Masanori Otsuka, Mariko Hirai, Hiroyuki Takemoto, Tiago Ogawa
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Patent number: 12044880Abstract: A backlight unit includes: a light source; a light guide plate having an end surface that is arranged to face the light source, and that light from the light source enters, and an emitting surface from which the entered light is emitted; a casing having a front portion and a back portion, the casing being configured to store the light source and the light guide plate; and an optical pressure-sensitive adhesive film arranged between the front portion of the casing on a light source side and the light guide plate, the optical pressure-sensitive adhesive film being bonded to the light guide plate. The optical pressure-sensitive adhesive film includes a light-absorbing layer, a substrate, a low-refractive index layer, and a pressure-sensitive adhesive layer in the stated order from a front portion side of the casing.Type: GrantFiled: March 26, 2021Date of Patent: July 23, 2024Assignee: NITTO DENKO CORPORATIONInventors: Daisuke Hattori, Takahiro Yoshikawa, Ryota Morishima, Atsushi Kishi
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Publication number: 20240244742Abstract: A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.Type: ApplicationFiled: January 28, 2022Publication date: July 18, 2024Applicant: NITTO DENKO CORPORATIONInventors: Kenya TAKIMOTO, Naoki SHIBATA, Hayato TAKAKURA
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Publication number: 20240244756Abstract: An assembly sheet includes a supporting portion, a plurality of wiring circuit boards, and a joint portion. The supporting portion supports the plurality of wiring circuit boards. The supporting portion surrounds the plurality of wiring circuit boards while being separated from the plurality of wiring circuit boards by an interval. The joint portion joins the plurality of wiring circuit boards to the supporting portion. The plurality of wiring circuit boards includes a first wiring circuit board and a second wiring circuit board. The second wiring circuit board is arranged next to the first wiring circuit board while being separated from the first wiring circuit board by an interval. The second wiring circuit board is symmetrical to the first wiring circuit board with respect to a point centered therebetween. The supporting portion includes a first and second mark. The second mark is asymmetrical to the first with respect to the point.Type: ApplicationFiled: January 4, 2024Publication date: July 18, 2024Applicant: NITTO DENKO CORPORATIONInventors: Chihiro WATANABE, Kenya TAKIMOTO
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Publication number: 20240242778Abstract: A nucleoside phosphoramidite identifying system for improving a nucleoside phosphoramidite identification accuracy includes a memory unit configured to store spectra of solutions of a plurality of different nucleoside phosphoramidites, a detecting unit configured to detect a spectrum of a solution of a nucleoside phosphoramidite, and an identifying unit configured to identify the nucleoside phosphoramidite based on cosine similarity between the spectra stored in the memory unit and the spectrum detected by the detecting unit.Type: ApplicationFiled: April 10, 2023Publication date: July 18, 2024Applicant: Nitto Denko CorporationInventors: Kei YOSHIDA, Yoichi KIGAWA, Shinsuke SUGIURA, Eri MAETA, Jun MATSUNAMI
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Patent number: 12037522Abstract: An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The electrical debonding type adhesive sheet according to the first embodiment of the present invention includes a substrate for voltage application, a first adhesive layer, which is constituted of an electrically debondable adhesive and is formed on an electroconductive surface of the substrate for voltage application, and a second adhesive layer, which is formed on the opposite surface of the substrate for voltage application, the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other.Type: GrantFiled: March 6, 2019Date of Patent: July 16, 2024Assignee: NITTO DENKO CORPORATIONInventors: Kaori Akamatsu, Kaori Mizobata, Ryo Awane, Akira Hirao, Junji Yokoyama
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Publication number: 20240237200Abstract: An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.Type: ApplicationFiled: January 26, 2022Publication date: July 11, 2024Applicant: NITTO DENKO CORPORATIONInventor: Makoto TSUNEKAWA
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Publication number: 20240230978Abstract: A lightguide component for light emission devices has a first principal face and a second principal face at an opposite side from the first principal face. The lightguide component for light emission devices includes: a lightguide layer including a light-receiving portion to receive light emitted from a light source, a third principal face at the first principal face side, and a fourth principal face at the second principal face side; and a light distribution controlling structure having a plurality of internal spaces, the plurality of internal spaces creating interfaces to direct a portion of the light propagating in the lightguide layer toward the first principal face via total internal reflection. In a plan view a first region in which the light distribution controlling structure is present and a second region in which the light distribution controlling structure is not present are disposed so as to define a predetermined design.Type: ApplicationFiled: June 16, 2022Publication date: July 11, 2024Applicant: NITTO DENKO CORPORATIONInventors: Yufeng WENG, Kozo NAKAMURA, Takahiro YOSHIKAWA
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Patent number: 12030297Abstract: Provided is a glass film-resin composite, which prevents the breakage of a glass film and enables the production of an elongated glass film. The glass film-resin composite of the present invention includes: an elongated glass film; a resin tape, which is arranged on at least one surface of the elongated glass film and is linearly arranged at least near each of both ends in a widthwise direction of the elongated glass film in one surface of the elongated glass film; a protective layer, which is arranged near each of both the ends in the widthwise direction of the surface of the elongated glass film having arranged thereon the resin tape and on an outside of the resin tape in the widthwise direction; and a resin layer arranged on one surface of the elongated glass film.Type: GrantFiled: April 17, 2019Date of Patent: July 9, 2024Assignee: NITTO DENKO CORPORATIONInventors: Keisuke Sato, Takeshi Murashige, Junichi Inagaki, Atsushi Kishi