Abstract: A pipe may include a pipe body having an axis, an axial bore and a pipe body outer diameter. A male end may be formed on the pipe body. The male end can have an outer diameter consistent with the pipe body outer diameter, and an axial end face. A female end may be formed as an integral bell on the pipe body opposite the male end. The female end may have an inner diameter that is larger than the outer diameter of the male end, a seal recess on an interior thereof, and an interior feature in the interior of the female end that is complementary to the axial end face of the male end. The female end of a first pipe may be configured to receive the male end of a second pipe, such that the interior feature of the first pipe engages and restrains the axial end face of the second pipe. A coupling may be used to join two of the pipes.

Abstract: A pipe coupling may include a body that is tubular and formed from a polymer. The body may include a main bore with a main axis and at least first and second female receptacles on each end of the main bore. Each receptacle may be configured to receive a male end of a pipe. A first brace may be coupled to and extend between, for example, a first female receptacle and a third female receptacle. A second brace may be coupled to extend between, for example, a second female receptacle and the third female receptacle. The pipe coupling can be a single, integral, injection molded monolithic structure.

Abstract: A polymeric riser cap member includes a central tubular section defining a generally cylindrical bore for receiving a sprinkler riser, the central tubular section having open top and bottom ends, and an annular skirt coaxial with the central tubular section and having an inner diameter larger than an inner diameter of the central tubular section. The annular skirt has an inner surface having internal threads threadably connectable with the externally threaded surface of a tubular riser adapter member of a tubular coupler. The bottom end of the central tubular section has an annular projection disposed opposite and spaced from a portion of the annular skirt. The riser cap member includes an annular recess adapted to receive a seal located in a wall extending laterally between the annular skirt and the annular projection.

Abstract: A pipe has a tubular body with a male end and a female end. The male end has an external surface with a first engagement groove. The female end has an internal surface with a second engagement groove, and an aperture extending from an outer surface of the tubular body to the second engagement groove. The female end receives the male end of another pipe such that the first engagement groove of the male end axially aligns with the second engagement groove of the female end to establish a spline engagement groove having a groove length, LG. A flexible spline is located in the spline engagement groove to lock the pipes together and establish a pipe assembly. The flexible spline has a spline length, LS, and LS?LG.

Abstract: A pipe has a tubular body with a male end and a female end. The male end has an external surface with a first engagement groove. The female end has an internal surface with a second engagement groove, and an aperture extending from an outer surface of the tubular body to the second engagement groove. The female end receives the male end of another pipe such that the first engagement groove of the male end axially aligns with the second engagement groove of the female end to establish a spline engagement groove having a groove length, LG. A flexible spline is located in the spline engagement groove to lock the pipes together and establish a pipe assembly. The flexible spline has a spline length, LS, and LS?LG.

Abstract: A polymeric riser cap member includes a central tubular section defining a generally cylindrical bore for receiving a sprinkler riser, the central tubular section having open top and bottom ends, and an annular skirt coaxial with the central tubular section and having an inner diameter larger than an inner diameter of the central tubular section. The annular skirt has an inner surface having internal threads threadably connectable with the externally threaded surface of a tubular riser adapter member of a tubular coupler. The bottom end of the central tubular section has an annular projection disposed opposite and spaced from a portion of the annular skirt. The riser cap member includes an annular recess adapted to receive a seal located in a wall extending laterally between the annular skirt and the annular projection.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: An electrical lead includes a substrate-receiving section which has a collapsible rear plate and a plurality of outwardly projecting prongs or arms. The prongs are spaced apart to define a gap having an opening slightly larger than the width of the substrate to be engaged. A substrate is inserted into the gap between the prongs so that the prongs are spaced on either side of the substrate. The rear plate of the lead is then compressed so that the prongs engage and tightly grip the substrate from opposite sides. Alternatively, the prongs may pivot upon the application of force to engage the substrate.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A circuit board connector (10), such as for a flex circuit (20), which provides a solid and reliable contact termination between a flex circuit (20) and a connector. The flex circuit connector (10) includes multiple contact points (24, 26) for contacting each lead or trace on the flex circuit (20). The multiple contact points (24, 26) are provided along a common member (28) which also includes a strain relief mechanism (30) in between the multiple contact points (24, 26). The strain relief mechanism (30) may be provided in the form of a V-shaped bend in the material of the common member (28) connecting the multiple contact points (24, 26) together. The contact points (24, 26) used to join the flex circuit (20) and the connector (10) may be achieved using any combination of staple-like contact points or solder contact points. The addition of the strain relief mechanism (30) in between the contact points (24, 26) greatly enhances the termination between the flex circuit (20) and the connector (10).

Abstract: A zero-insertion force connector having a frame which includes a selectively deformable base. Contacts are supported by the base and are selectively displaced from an insertion path when the base is deformed, allowing insert elements, such as wire from flat cable, or a printed circuit board, to be inserted between the contacts without substantial resistance. Releasing the force which is deforming the base allows the base to return to its rest shape under a natural resiliency of the material used to make the base, which causes the contacts to move against the inserted element and establish electrical communication.

Abstract: An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.

Abstract: A solder-bearing metallic lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a substrate or other conductive pad.

Abstract: A connector for substrates such as smart cards has a housing containing two parallel rows of spring contacts, each of which is held in a respective channel of the housing. Integral with each of the spring contacts and extending outside of one end of the housing is a terminal lead for connection to a substrate. The lead has a solder mass adjacent its end. The two parallel rows of solder-bearing leads will straddle and resiliently hold a substrate between them to improve accuracy in soldering during solder re-flow. The other end of the housing is provided with entry apertures for pins of a multi-pin connector, so that each pin will enter a respective housing channel to contact the spring contact therein. The entry apertures may accommodate a substrate with contact pads.

Abstract: A solder-bearing lead, and methods of fabricating and using it, where the lead is formed with a solder-retaining portion having a cross-sectional profile with undercuts and a tip, preferably in a V-shape, where solder surrounds said solder-retaining portion and undercuts, and extends outwardly substantially no farther than said tip.

Abstract: A method of making an array of electrical components having pre-attached leads ready for automated surface-mounting on a substrate. The method involves aligning an array of leads with electrical components and attaching each lead to a conductive terminal on a respective component. A series or coil of leads joined integrally together and carried by a carrier strip is thus provided with a series of electrical components pre-attached thereto. The electrical components along with their leads may thus be quickly and easily surface-connected to the conductive pads on a substrate in a simple, automated manner.

Abstract: A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.