Abstract: A solder-bearing terminal is formed from a blank having a main body portion and side tabs extending laterally from it, which are bent perpendicularly to the main body. The tabs may be formed in pairs to retain a solder mass therebetween, or may be in the form of single fingers partially encircling or staked to a solder mass. The solder mass is positioned to facilitate soldering of a terminal of a device to a substrate, as for surface mounted devices. The tabs may be on one or both edges of the main terminal body.

Abstract: A terminal strip comprises a plurality of edge clips for attachment to contact pads on a circuit bearing board, in which each clip is crimped onto a non-conductive carrier bar or strip for supporting the clips. The clips are formed in a stamping process and are crimped to the non-conductive carrier strip during the stamping process.

Abstract: An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.

Abstract: The present invention relates to a solder-bearing lead for attachment to a contact pad on a printed circuit board or like substrate, or for mounting a circuit component on a substrate, suitable for being continuously stamped from a thick strip of metal at high speed, with an improved arrangement for holding the solder mass to provide the necessary solder for a soldered joint, without weakening the lead. Instead of retaining the solder mass by means of a finger struck from the elongated body of the lead (which for narrow leads might only weakly retain the solder and also weaken the lead by unduly reducing its already small cross-section), the solder mass is retained by one or more pairs of integral tabs or ears initially extending laterally from the elongated blank body, and then bent to form a solder-retaining channel in which the tabs may stake the solder.

Abstract: A heat sink is formed of an interlocked stack of strip elements each having a heat-conducting base portion and a thinner heat-radiating fin portion, the base portions being configured for interlocking engagement to form a unitary heat-conductive mass and the fin portions having relative large surface areas for efficient heat disposition into surrounding air.

Abstract: A solder-bearing lead useful as a terminal or contact which may be fabricated by rapid progressive stamping techniques is disclosed in which side ears are formed on the contact blank, and then bent upwardly out of their initial plane. These ears are formed to hold a solder mass in a position where the solder can confront the conductive area to which the lead is to be soldered, permitting convenient surface mounting of components having such leads, on a substrate, and permitting convenient connection of terminals to other components or substrates.

Abstract: A solder-bearing edge clip or connector for attachment to a substrate, where the solder mass is gripped in a thin flat blank of any desired configuration, with the axis of the solder mass extending substantially perpendicular to the plane of the blank.

Abstract: An electrical connector has a molded body for receiving one or more contacts. Each contact is formed from a flat strip by simple multiple stamping, and has a single contact-making tongue extending into a channel of the body which receives a mating pin contact. The arrangement is economically plated only on the tongue portion. The contact is adapted for either front or rear connection by having a terminal leg formed at each end of the contact body, only one selected leg being used.

Abstract: A solderable lead is provided for connecting an electrically conductive element (such as a terminal clip, or a connector contact, or a semiconductor chip holder terminal) to a metallic area on a substrate or the like, the solderable lead having a discrete slug of solder mechanically engaged in a special way in a position to be melted for bonding the lead to the metallic area. In one form of solderable lead, a terminal clip portion adapted to be secured to a metallic area on a second substrate is also provided, the terminal clip portion having one or two additional discrete masses of solder mechanically engaged with the clip portion in position to be melted for bonding the clip to one or two metallic areas on the second substrate.

Abstract: A strip of interconnected edge clips for attachment to contact pads on a circuit-bearing board, in which a plurality of edge clips each have a free end and a stem end with the stem ends of the clips connected with a carrier rail or strip. A pair of spaced-apart spring fingers are on the free ends of the clips for receiving an edge of a circuit-carrying board therebetween, and an elongate auxiliary support strand extends past the free ends of the plurality of clips and is mechanically connected with the free ends of the clips to provide support to the clips. According to another aspect of the invention, the clip has an angularly extending interconnecting portion between the stem end and free end, offsetting the free end in both a sideward and rearward direction relative to the stem end.

Abstract: A terminal clip for attachment to a contact pad on a substrate having one or two individual masses of solder mechanically engaged with the clip in a position to be melted for bonding the clip to one or two surfaces of the contact pad.

Abstract: An electrical contact with a cylindrical bore having an internal pressure finger and two external retaining louvers, made from a blank of sheet metal wherein the outlines of each finger and louver are stamped as U-shaped cuts spaced in separate rows, the blank then being folded along a line between the respective rows and rolled into cylindrical form with the pressure finger on the inside and retaining louvers on the outside.

Abstract: A terminal clip for attachment to a contact pad on a substrate having an individual mass of solder mechanically engaged with the clip in a position to be melted for bonding the clip to the contact pad.

Abstract: A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device wire base prior to the coining, trimming, slotting and various other forming operations which transform the wire base into a finished contact device. The apparatus features a sequential arrangement of gripping devices which manipulate the gold ribbon for processing as stated above, a welding apparatus for combining the gold ribbon segment with the contact wire base, a cutting device for cutting the gold ribbon and apparatus for forming the finished electrical contact device. The product features a formed contact device including a wire support member and a contact material simultaneously formed and flattened, to provide a minimum amount of inlaid or coined gold for effecting desirable contact characteristics.

Abstract: A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device wire base prior to the coining, trimming, slotting and various other forming operations which transform the wire base into a finished contact device. The apparatus features a sequential arrangement of gripping devices which manipulate the gold ribbon for processing as stated above, a welding apparatus for combining the gold ribbon segment with the contact wire base, a cutting device for cutting the gold ribbon and apparatus for forming the finished electrical contact device. The product features a formed contact device including a wire support member and a contact material simultaneously formed and flattened, to provide a minimum amount of inlaid or coined gold for effecting desirable contact characteristics.