Abstract: A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on one or both of the opposed faces of said solder-bearing portion. A region of the middle portion is twisted or the projections are bent so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surface-mounted lead for a substrate.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder- bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion carries a solder mass either on a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass, or on the opposed faces of said solderbearing portion. A region of the middle portion is twisted so that the solder-bearing portion lies in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board, or as a surfacemounted lead for a substrate.

Abstract: A solderable lead structure adapted for joining or soldering to a substrate carrying electrical components, comprising a double comb-like configuration made of conductive material, having two rows of contact strips or leads that are connected to opposite edges of a common carrier strip. At the free or distal ends of the leads, individual clips are formed for resiliently engaging both sides of a substrate. The leads extend from the carrier strip from opposite edges and are then folded to result in a linear, intermeshed arrangement.

Abstract: A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold the substrate against the leads, as during soldering. The retaining means may be disengaged from the substrate separately or simultaneously with the trimming of the leads from the lead arrangement after connecting to the substrate.

Abstract: A solder-bearing lead having a C-clip to resiliently grip the upper and lower surfaces of a substrate. One of the two arms forming the "C" is solder-bearing for mechanical and electrical connection to a conductive area on the substrate. In one embodiment, a polymer plug may be provided on the second arm, the plug having a narrowed neck region for improved retention by the second arm. In another embodiment, the second arm is coated with a non-conductive material, eliminating the need for mechanically retaining a plug or other insulator between the second arm and substrate. The coating on the lead is provided preferably by applying a liquid polymer to the second arm of the lead and hardening the polymer to form a durable, insulating coating.

Abstract: A lead frame is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining members are also provided with the frame to hold the substrate against the leads. The retaining member is preferably disengaged from the substrate simultaneously with the trimming of the leads from the frame after connecting to the substrate.

Abstract: A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.The present application is a continuation-in-part of application Ser. No. 416,505, filed Oct. 3, 1989, U.S. Pat. No. 5,052,954 which is a continuation of application Ser. No. 129,715, now U.S. Pat,. No. 4,883,435, and is also related to U.S. Pat. No. 4,728,305, U.S. Pat. No. 4,679,889, and U.S. Pat. No. 4,605,278. The disclosure of the parent application, Ser. No.

Abstract: A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

Abstract: A solder-bearing terminal or lead for attachment to a receptacle in a substrate or to the surface of a substrate, wherein a discrete mass of solder is mechanically held by the terminal or lead in close proximity to the substrate receptacle or surface in position to be melted for connecting the terminal to the substrate with an electrical and mechanical bond, the terminal or lead providing an unobstructed flow for the melted solder to the substrate.

Abstract: A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion includes a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass. A region of the middle portion is twisted so that the projections lie in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board/or as a surface-mounted lead for a substrate.

Abstract: A high-density connector arrangement for flat multiconductor cables has a support housing, and flat cable support members held by the support housing. The cable supports may be organized in banks for increasing density of conductors, and are preferably releasably secured to the support housing. Contact between conductors on mating cable supports of two connectors is enhanced by providing resiliency of engagement, by causing the cable to arc outward or partially splitting the supports or providing a resilient layer arranged between the cable tape and its support.

Abstract: An adapter for removably mounting electronic components on a circuit board or the like is disclosed which includes an insulating base having a plurality of holes extending therethrough, with a plurality of contacts disposed within the holes. Each contact includes a board-engaging section which extends from the base for compliantly engaging a hole in the circuit board. Each contact further includes a base-engaging section which resiliently engages a hole within the base, with the base-engaging section strongly engaging the adapter base to provide for essentially permanent placement therein. Each contact further includes a component end including means for mating with a component placed in contact therewith, which means may comprise solder on the component-facing side of the component end of the contact. Typically, a component will be placed on the base with mating conductive strips in contact with the component ends of the contacts.

Abstract: A solder-bearing terminal or lead for attachment to a receptacle in a substrate or to the surface of a substrate, wherein a discrete mass of solder is mechanically held by the terminal or lead in close proximity to the substrate receptacle or surface in position to be melted for connecting the terminal to the substrate with an electrical and mechanical bond, the terminal or lead providing an unobstructed flow for the melted solder to the substrate.

Abstract: A component and method are provided for making a soldered electrical connection between two mating members, in which a deposit of solder on the surface of one of the members is juxtaposed to a cooperatively shaped surface on the other member when the two members are mated, so that the solder will melt and bind the two surfaces when heated. The quality of this connection may be further improved by providing a resilient arrangement for urging the conforming surfaces together as heat is applied. In one form of contact element according to the invention a hollow, cylindrical metal shell with a longitudinal split provides a resilient fit into a mating member, such as a metal-lined hole on a printed circuit board. The shell is provided with a deposit of solder in a groove on its outer surface where the shell is to engage the metal lining of the hole.

Abstract: A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive area of the first surface.

Abstract: An electrical connector includes two assemblies which are adapted to mate. Each assembly has a number of contacts mounted thereon. The respective contacts (which may be pins and resilient tongues, or hermaphroditic contacts) include separate bearing surfaces and electrical contacting portions. The bearing surfaces of the contacts are subject to the abrasive action when the connector assemblies are being coupled or uncoupled, while the electrical contacting portions are protected from abrasion and contact one another only when the two assemblies are substantially coupled together.

Abstract: An electrical connector includes two assemblies which are adapted to mate. Each assembly has a number of contacts mounted thereon. The respective contacts (which may be pins and resilient tongues, or hermaphroditic contacts) include separate bearing surfaces and electrical contacting portions. The bearing surfaces of the contacts are subject to the abrasive action when the connector assemblies are being coupled or uncoupled, while the electrical contacting portions are protected from abrasion and contact one another only when the two assemblies are substantially coupled together.

Abstract: An edge clip for attachment to a contact pad on a substrate includes a pair of spaced-apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and one or more folded end portions, aligned with the connecting portion, can be supported from carrier rails at one or both ends during manufacture.

Abstract: A comb-like array of electrical leads is provided, each having a solder mass and/or a locating structure at a terminal end, the array being in two sets for respective attachment to conducting areas on the top and bottom surfaces of a substrate (such as a printed circuit board), the leads being pivotable either at their stem ends (as in FIGS. 1-2, 21-22 and 31-33) or at an intermediate fulcrum (as in FIGS. 40-41). Resilient structures in the form of resilient bowed portions are formed in the leads, so that upon applying appropriate force to the resilient structures, the sets of leads are separated to accept a substrate therebetween, with the lead terminal ends aligned with respective contact pads on the substrate, and so that upon releasing such force, the leads will tend to return to their initial positions and thereby resiliently clamp the lead structure to the substrate, to be held there during subsequent soldering.