Abstract: Disclosed is a positive-working resist composition which demonstrates improved photospeed and rate of development. The resist composition contains a solvent and select proportions of a novolak resin, a naphthoquinone diazide sensitizer, a dye which absorbs light at a maximum wavelength of from about 330 to about 460 nm and an effective proportion of a trihydroxybenzophenone compound. Also disclosed is a method of forming a resist pattern on a substrate by employing the positive-working resist composition.

Abstract: In the process for electroplating the walls of through holes in a laminated printed wiring board comprised of at least one non-conducting layer laminated to at least two separate conductive metal layers, which comprises the steps:(a) contacting said printed wiring board having said through holes with a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle size of less than about 3.

Abstract: An improvement to the process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:(a) contacting said printed wiring board having said through holes with an alkaline dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.

Abstract: A process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:(a) preparing a liquid dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion;(2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and(3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion;(b) applying said liquid disperison to the surface of the non-conducting material;(c) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and(d) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface.

Abstract: Disclosed is a stripping composition for effectively removing an organic polymeric material from a substrate. The stripping composition is essentially free of phenol compounds and halogenated hydrocarbon compounds and contains a select amine compound and an organic polar solvent. It has been found that the stripping composition is highly effective, even when the organic polymeric material to be removed from a substrate is a positive resist which has been subjected to high temperature post-baking operations.