Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
Type:
Grant
Filed:
October 13, 1992
Date of Patent:
June 28, 1994
Assignee:
Olin Corporation
Inventors:
Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman
Abstract: A biodegradable aqueous filter cleaning formulation containing effective amounts of a biodegradable carboxylic acid and/or salt thereof, a nonionic biodegradable surfactant based on oxyalkylated linear alcohols, and a water soluble organic solvent.
Abstract: An electrode and an electrolytic cell in which the electrode includes a plate having electrode material attached to at least one side thereof. A header opening is provided in the electrode plate and has a plurality of slots radiating therefrom towards the center of the plate. The electrolytic cell includes an electrode spaced from a separator such as a membrane or diaphram by a gasket member of universal design. The electrodes, separator and gaskets have a header opening extending therethrough with slots radiating from the header openings in the anode and cathode plates to provide fluid communication between anode and cathode chamber and the header.
Abstract: A process for producing chlorine dioxide a solution of chloric acid is reduced in the presence of an externally added load of perchlorate ions to form chlorine dioxide.
Abstract: A process for producing an aqueous hypochlorous acid solution reacts droplets of an alkali metal hydroxide solution containing greater than 50 percent by weight of the alkali metal hydroxide with chlorine gas. The reaction produces a gaseous mixture of dichlorine monoxide, chlorine, hypochlorous acid vapor and water vapor, and solid particles of alkali metal chloride. The solid particles of alkali metal chloride are separated and the gaseous mixture condensed at a temperature in the range of from about -33.degree. C. and about -5.degree. C. to produce the aqueous hypochlorous acid solution. The process of the invention results in increased yields of hypochlorous acid and provides an economic basis for increased production capacity. The aqueous hypochlorous acid solutions produced are highly pure and as a result have significantly improved stability.
Type:
Grant
Filed:
January 15, 1993
Date of Patent:
June 21, 1994
Assignee:
Olin Corporation
Inventors:
John H. Shaffer, James K. Melton, Joseph Borcz
Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.
Abstract: The formation of whiskers during tin or tin-lead solder electroplating of a copper base alloy substrate in a methane sulfonate solder plating bath is inhibited by passivating the surface of the substrate prior to electroplating. Preferred passivating solutions include an aqueous solution of sodium dichromate and phosphoric acid, and an aqueous solution of chromic acid and phosphoric acid. Passivation is preferably followed by treatment with a basic solution having a pH of at least 8.
Abstract: The present invention relates to a process for preparation of an isocyanate comprising (a) reacting an amide with an aqueous solution of hypochlorous acid in the presence of an water-immiscible organic solvent to produce an N-chloro amide; and (b) reacting said N-chloro amide with a base in the presence of a phase transfer catalyst and a water immiscible organic solvent to produce an isocyanate.
Abstract: A process for treating solutions of a hydroxylammonium salt containing excess acid which comprises:a) mixing the hydroxylammonium salt containing excess acid with a hydroxylammonium solution containing free hydroxylamine to produce a solution of the hydroxylammonium salt substantially free of excess acid,b) contacting a portion of the solution of the hydroxylammonium salt substantially free of excess acid with a weak base ion exchange resin to produce the hydroxylammonium solution containing free hydroxylamine, and,c) recycling the hydroxylammonium solution containing free hydroxylamine to step a).The process minimizes the decomposition of the hydroxylammonium salt solution and produces high purity hydroxylammonium nitrate solutions without directly contacting excess nitric acid with ion exchange resins. In addition to hydroxylammonium salts, the process can be used to treat any nitrate salt of an anine weak base which contains excess nitric acid.
Type:
Grant
Filed:
December 9, 1992
Date of Patent:
June 7, 1994
Assignee:
Olin Corporation
Inventors:
David W. Cawlfield, Donald B. Loftis, Sanders H. Moore, Elizabeth K. Walter
Abstract: Energetic binders, and, more specifically, a class of nitramine-containing polyether polymers characterized by favorable viscosity and glass transition temperature, as well as resistance to hydrolysis are prepared.
Abstract: The present invention relates, in one aspect, to a process for preparing a storage-stable dispersion of a biocide which comprises the steps of: (a) mixing a plastisol, comprising a resin and a carrier, and a biocide to provide a mixture of said plastisol and said biocide (b) heating said mixture of plastisol and biocide to an elevated temperature of between about 30.degree. C. and about 100.degree. C. to provide a homogeneous, storage stable dispersion, said dispersion containing said biocide in an amount of between about one and about 30 weight percent based upon the weight of said dispersion, said resin being present in an amount of between about 5 and about 75 weight percent based upon the weight of said dispersion, with the proviso that when the weight percent of said resin in said dispersion is between about 30% and about 75%, then said elevated temperature is between 30.degree. C. and 45.degree. C.
Type:
Grant
Filed:
May 8, 1992
Date of Patent:
June 7, 1994
Assignee:
Olin Corporation
Inventors:
James M. O'Connor, Rahim Hani, Craig Waldron
Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.
Type:
Grant
Filed:
July 13, 1992
Date of Patent:
May 24, 1994
Assignee:
Olin Corporation
Inventors:
Brian E. O'Donnelly, Brian Mravic, Jacob Crane, Deepak Mahulikar
Abstract: This invention relates to a process for preparing a dimer by the steps of: (a) cyclodimerizing a polyisocyanate in the presence of a dimerization catalyst which is covalently bound to an insoluble inorganic matrix by contacting said polyisocyanate with said catalyst at a temperature of between about 20 and about 135.degree. C. in a reaction to form an uretidione-containing cyclodimerized isocyanate wherein a portion of the isocyanate moieties comprising said polyisocyanate are converted to uretidione groups, and (b) separating said catalyst from said cyclodimerized isocyanate in order to stop said reaction after a desired amount of isocyanate moieties in said polyisocyanate have been converted to uretidione moieties.
Type:
Grant
Filed:
April 5, 1993
Date of Patent:
May 24, 1994
Assignee:
Olin Corporation
Inventors:
Stephen L. Goldstein, Anthony D. Hamer, Lawrence E. Katz, Michael J. McGeary, Curtis P. Smith
Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.
Abstract: A method of casting metal material wherein metallic metal is deposited on a foil moving underneath the feeding means for the molten metal and is supported on a supporting substrate. The foil is formed with side edges before receiving a deposit of molten metal to contain the flow of molten metal thereon in a direction transverse to the direction of movement of the foil.
Type:
Grant
Filed:
January 4, 1993
Date of Patent:
April 12, 1994
Assignee:
Olin Corporation
Inventors:
W. Gary Watson, Harvey P. Cheskis, Thomas J. Melillo
Abstract: Improved process for preparing dinitrotoluene by reacting toluene with concentrated nitric acid. The process reacts toluene with a large excess of concentrated nitric acid, in the presence of a select hydrated nitrate salt which is effective in minimizing explosive hazards, to produce a product which has substantially reduced by-product content.
Abstract: This invention relates to a process for minimizing or reducing the amount of residual free hydrazine in polymer latices. The process is particularly useful in the manufacture of hydrogenated nitrile rubber which is resistant to oxidative degradation at high temperatures, as well as resistant to corrosive environments such as acid environments. Nitrile rubbers are useful in the manufacture of fan belts, seals, gaskets, and hoses in increasingly small and hot-running car engines.
Type:
Grant
Filed:
December 14, 1992
Date of Patent:
April 12, 1994
Assignees:
Olin Corporation, The Goodyear Tire and Rubber Co.
Abstract: There is provided a method of treating a copper or copper alloy substrate to provide improved resistance to both oxidation and to chemical attack. The substrate is immersed in an aqueous solution containing both chromium (VI) ion and phosphate ions. The treatment is particularly effective for protecting imaged printed circuit boards during storage, handling and use.
Abstract: A method and apparatus for the casting of metal onto a moving horizontal surface in which the solidification of the casting occurs from the top to the bottom. The surface on which the metal is cast comprises a material having a low thermal conductivity of 10 or less watts/meter.degree. Kelvin. If desired, the casting may be cooled by cooling the top of the casting at a point downstream of the feeding system.
Abstract: A process for fabricating a porous, high surface area electrode and the use of that electrode in an electrolytic cell for manufacturing chlorine-free chlorine dioxide from dilute alkali metal chlorite solutions in a single step is disclosed. The electrolytic cell uses a porous flow-through anode and a cathode separated by a suitable separator.
Type:
Grant
Filed:
August 1, 1991
Date of Patent:
March 29, 1994
Assignee:
Olin Corporation
Inventors:
Jerry J. Kaczur, David W. Cawlfield, Julian F. Watson