Patents Assigned to Olin
  • Patent number: 6040107
    Abstract: A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: March 21, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Andrew J. Blakeney, Arturo N. Medina, Medhat A. Toukhy, Lawrence Ferreira, Alfred T. Jeffries, III, Ahmad A. Naiini
  • Patent number: 6038978
    Abstract: A shotshell having a hull with a protective barrier layer of fiber or other alternate material that prevents the hull from being in contact with the chamber. The protective layer may cover any portion of the exterior of the hull. The protective layer protects the plastic hull from the hot chamber of the barrel that would adversely affect the structural integrity or functioning of the shotshell. The protective material may be of precut size and thickness that when applied to the exterior of the hull will increase the diameter to reduce the clearance with the chamber and thereby resist sliding out of the chamber before the breech is closed. The protective layer may also have an adhesive surface disposed between the exterior surface of the hull and the protective layer to prevent the separation of the hull and the protective material.
    Type: Grant
    Filed: February 11, 1998
    Date of Patent: March 21, 2000
    Assignee: Olin Corporation
    Inventors: Melvin Ward Harris, Scott Hayward Mayfield
  • Patent number: 6033993
    Abstract: A process of treating a substrate having photoresist applied thereto, comprising the steps of:(a) removing said photoresist from said substrate by a method selected from the group consisting of photoresist stripping, plasma etch residue cleaning, or a combination thereof; and(b) rinsing said substrate with a non-corrosive rinsing composition comprising(1) water; and(2) one or more water-soluble corrosion inhibitors selected from the group consisting essentially of hydroxylamine, at least one hydroxylammonium salt, at least one water-soluble organic acid, at least one amino acid, and combinations thereof.
    Type: Grant
    Filed: September 23, 1997
    Date of Patent: March 7, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: M. Lee Love, Jr., Kenji Honda
  • Patent number: 6030932
    Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound;(ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: February 29, 2000
    Assignee: Olin Microelectronic Chemicals
    Inventors: Vincent G. Leon, Kenji Honda, Eugene F. Rothgery
  • Patent number: 6027853
    Abstract: The present invention relates to a process for preparing a radiation-sensitive composition, comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: February 22, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Sanjay Malik, Andrew J. Blakeney, Joseph J. Sizensky
  • Patent number: 6028154
    Abstract: A terpolymer containing 20 to 70 mole percent of an acid labile repeating unit, 3 to 40 mole percent of an acrylonitrile based repeating unit and a repeating unit containing silicon side chains. The silicon side chain repeating unit is provided in sufficient amounts so that the terpolymer silicon content is 7 to 20 weight percent. The terpolymer is used primarily in the formulation of multilayer positive operating photoresists.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: February 22, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Ulrich Schaedeli, Eric Tinguely, Manfred Hofmann, Pasquale Alfred Falcigno, Carl-Lorenz Mertesdorf
  • Patent number: 6020292
    Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.
    Type: Grant
    Filed: May 21, 1998
    Date of Patent: February 1, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Kenji Honda, Taishih Maw
  • Patent number: 6020628
    Abstract: To hermetically seal an optically transparent ceramic or glass member to a metallic housing, an aperture with a diameter less than the diameter of the member is formed through the metallic housing. The member is then press-fit into the aperture, partially displacing metal from the walls of the aperture, forming an inner burr circumscribing the aperture. The walls of the aperture and the circumscribing burr are then coated with a second metal, preferably electroless nickel. The resultant seal maintains hermeticity following thermal cycling and is particularly suited for the manufacture of a hybrid electronic package having an optical or opto-electronic coupling.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: February 1, 2000
    Assignee: Olin Corporation
    Inventors: Steven A. Tower, Brian Mravic
  • Patent number: 6016754
    Abstract: There is provided a lead-free projectile suitable for use as a bullet to be fired from a pistol or rifle. The projectile has a metallic jacket enveloping a metallic core. The core is formed from a high purity tin and has deformation properties similar to that of lead based projectiles without the environmental hazards associated with lead.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: January 25, 2000
    Assignee: Olin Corporation
    Inventors: Keith E. Enlow, Morris C. Buenemann, Jr.
  • Patent number: 6010825
    Abstract: A negatively operating photoresist composition comprising: (a) a polyimide precursor containing repeating structural units of formula (1) ##STR1## the composition comprises in all as many structural units of formula (I), which have residues R.sub.2, that the composition can be developed by means of aqueous-alkaline developers for photoresists, which are free of organic solvents.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: January 4, 2000
    Assignee: Olin Microelectronics Chemicals, Inc.
    Inventors: Sigurd Hagen, Nadia Reichlin
  • Patent number: 5992830
    Abstract: A bubbler ampoule and bubbler assembly for containing highly corrosive chemicals is configured so as to provide enhanced strength which allows safe transport and usage of high vapor pressure chemicals. The enhanced assembly strength is provided by controlling the ratio of the bottom wall thickness to the side wall thickness of the ampoule; and by providing properly radiused corners on the ampoule.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: November 30, 1999
    Assignee: Olin Corporation
    Inventors: Maurice E. Daubs, James H. Murphy, Jr.
  • Patent number: 5985507
    Abstract: A high thermal alkali-soluble novolak binder resin, comprising the addition-condensation reaction product of a phenolic mixture with at least one aldehyde source, the feedstock of the phenolic mixture for the reaction comprising:(1) about 25 to about 40 weight percent of the phenolic mixture being a monomer selected from meta-cresol 2,5-xylenol or the combination thereof;(2) about 50 to about 70 weight percent of the phenolic mixture being para-cresol; and(3) about 3 to about 20 weight percent of the phenolic mixture being acetamidophenol; all percentages based on the weight of total phenol monomer feedstock.The invention is also directed to a positive working photoresist made from the composition.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: November 16, 1999
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Andrew J. Blakeney, Sanjay Malik, Medhat A. Toukhy, Joseph Sizensky
  • Patent number: 5980656
    Abstract: A copper alloy achieves high electrical conductivity, in excess of 70% IACS; high strength, ultimate tensile strength in excess of 75 ksi; good surface cosmetics; and good stampability, above 25% break, by controlled additions of magnesium, iron and phosphorous. There is a critical iron content to achieve both good stampability and high electrical conductivity and a critical phosphorous content to achieve high strength and relatively small metal phosphide particles. There is further, a critical relationship between the amount of iron and phosphorous. An additions of magnesium, in amounts of more than 0.03%, broadens the effective ratio of iron to phosphorous, widening the composition box of the alloys of the invention.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: November 9, 1999
    Assignee: Olin Corporation
    Inventors: William L. Brenneman, John F. Breedis
  • Patent number: 5977041
    Abstract: The present invention is directed to an aqueous post-strip rinsing composition, comprising (1) water; (2) at least one water-soluble organic acid; and (3) at least one water-soluble surface-active agent, the rinse solution having a pH in the range from about 2.0 to about 5.0. The present invention is also directed to a method of using the above composition to remove residues from a semiconductor substrate.
    Type: Grant
    Filed: September 23, 1997
    Date of Patent: November 2, 1999
    Assignee: Olin Microelectronic Chemicals
    Inventor: Kenji Honda
  • Patent number: 5970878
    Abstract: The combination of a shot sleeve and a shot cup base form a universal shot wad that precisely fixes an adjustable volume for the shot column of a wide range of shot shell loads. The shot sleeve is a generally tubular member with an open end and a closed end. The inside of the shot sleeve is substantially smooth adjacent to both the open end and the closed end and has a plurality of substantially parallel, inwardly projecting, first ribs circumscribing the inside between the smooth portions.The shot cup base is a second tubular member and also has an open end and a closed end. A plurality of substantially parallel, outwardly protruding, second ribs circumscribe an outside of the shot cup base. The volume of a shot receiving portion is controlled by inserting the shot cup base a desired distance into the shot sleeve such that the two sets of ribs interengage.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: October 26, 1999
    Assignee: Olin Corporation
    Inventor: Robert J. Gardner
  • Patent number: 5950064
    Abstract: There is provided a lead-free projectile, such as a bullet or a ballistic shot, formed by liquid phase sintering or liquid phase bonding of a first particulate having a density greater than lead, a second, ductile, particulate having a melting temperature in excess of 400.degree. C. and a binder having a fluidity temperature that is less than the melting temperature of the second particulate. Unlike solid phase sintering that tends to produce articles having a porosity of about 20%, by volume, liquid phase sintering and liquid phase bonding achieve close to 0% porosity. Reducing the porosity level decreases the amount of high density, first particulate, required to achieve a density close to that of lead. Since the high density particulate tends to be the most expensive component of the projectile, this significantly reduces the cost of the projectile. The reduced porosity also allows for an increase in the amount of the second, ductile, component.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: September 7, 1999
    Assignee: Olin Corporation
    Inventors: Peter W. Robinson, Brian Mravic, Derek E. Tyler
  • Patent number: 5945251
    Abstract: 1. A process for preparing a purified solution of blocked polyhydroxystyrene resin in reaction/photoresist solvent, comprising the steps of:(1) forming an impure reaction solution comprising blocked polyhydroxystyrene resin and acidic catalyst in reaction/photoresist solvent;(2) adding amine, at least one hydrophilic solvent, at least one hydrophobic solvent and water to said impure reaction solution, thereby forming an aqueous phase comprising water, the hydrophilic solvent, and at least one salt of the amine and the acidic catalyst and an organic phase comprising the hydrophilic solvent, the hydrophobic solvent, the reaction/photoresist solvent and the blocked polyhydroxystyrene resin;(3) separating the aqueous phase from the organic phase; and(4) removing the hydrophilic solvent and the hydrophobic solvent from the organic phase, thereby forming a purified solution of blocked polyhydroxystyrene resin in reaction/photoresist solvent.
    Type: Grant
    Filed: May 8, 1998
    Date of Patent: August 31, 1999
    Assignee: Olin Corporation
    Inventor: James M. Davidson
  • Patent number: 5928818
    Abstract: Polymers having an average molecular weight M.sub.w (weight average) of 5,000 to 1,000,000 (measured by gel permeation chromatography), comprising structural repeating units of the formulae I-IV: ##STR1## in which R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently of one another are hydrogen, methyl or halogen, R.sub.5 and R.sub.6 independently of one another are C.sub.1 -C.sub.6 alkyl, R.sub.7, R.sub.8, R.sub.9 and R.sub.10 independently of one another are hydrogen, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy or halogen, and w, x, y and z are numbers equal to or greater than 1, with the provision that the quotient ##EQU1## which is obtainable from the sum of the structural units having protecting groups divided by the sum of all of the structural units present, obeys the condition 0.10.ltoreq.Q.ltoreq.0.50, are suitable as binders for DUV photoresists of high processing stability and flow resistance.
    Type: Grant
    Filed: February 26, 1997
    Date of Patent: July 27, 1999
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Carl-Lorenz Mertesdorf, Hans-Thomas Schacht, Norbert Muenzel, Pasquale Alfred Falcigno
  • Patent number: 5916695
    Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 20% to 40%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.
    Type: Grant
    Filed: December 9, 1996
    Date of Patent: June 29, 1999
    Assignee: Olin Corporation
    Inventors: Julius C. Fister, Szuchain Chen, Abid A. Khan, Dale L. Bender
  • Patent number: 5896993
    Abstract: Pourable products such as pool chemicals are packaged in a rectilinear stackable receptacle assembly. The receptacle assembly includes an upper cover or lid which includes a stacking recess into which a second receptacle assembly can nest. The receptacle assembly also includes a lower bucket portion which includes a continuous sidewall forming a rectilinear shape. The cover and the bucket side wall include interlocking members thereon which securely attach the cover to the bucket when the cover is pressed down against the bucket. The cover may include a pivotable bail handle, and also includes opposed side handles. The receptacle may include wheels partially located inwardly from one of the walls and upwardly from the bottom of the bucket.
    Type: Grant
    Filed: September 4, 1997
    Date of Patent: April 27, 1999
    Assignees: Olin Corporation, Berry Plastics Corporation
    Inventors: Aleene F. Nask, Timmy L. Willett, Richard Rhodes