Abstract: A light-emitting diode includes an N-type cladding layer, and a superlattice structure, an active layer, a P-type electron-blocking layer, and a P-type cladding layer disposed on the N-type cladding layer in such order. The superlattice structure includes at least one first layered element which has a sub-layer made of a nitride-based semiconductor material including Al, and having an energy band gap greater than that of said electron-blocking layer. The P-type electron-blocking layer is made of a nitride-based semiconductor material including Al, and has an energy band gap greater than that of the P-type cladding layer.

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: A light-emitting diode includes a first type semiconductor layer, a stress relief layer disposed on the first type semiconductor layer and including at least one first repeating unit containing a first well layer and a first barrier layer that are alternately stacked, an active layer disposed on the stress relief layer and including at least one second repeating unit containing a second well layer and a second barrier layer that are alternately stacked, a second type semiconductor layer disposed on the active layer, a first electrode electrically connected to the first type semiconductor layer, and a second electrode electrically connected to the second type semiconductor layer. The first well layer is made of an In-containing material. The second well layer is made of an In-containing material. The second barrier layer is formed with multiple sub-layers, each of which is made of an Al-containing material.

Abstract: A display substrate (20) and a display device (40). The display substrate (20) comprises a base substrate and a plurality of sub-pixels (100) located on the base substrate. Each sub-pixel (100) comprises a pixel circuit and a pixel electrode (134) electrically connected to the pixel circuit, and each pixel circuit comprises a driving sub-circuit. The pixel electrodes (134) each comprises an electrode body part (140) and a first electrode extension part (142) extending from the electrode body part (140). The display substrate (20) comprises first-type sub-pixels. The electrode body part (140) of each first-type sub-pixel (100) does not overlap a control electrode of the driving sub-circuit of the sub-pixel or an electrode part directly electrically connected to the control electrode, and the first electrode extension part (142) of each pixel electrode (134) at least partially overlaps the control electrode or the electrode part.

Abstract: A light-emitting diode (LED) lighting strip includes conductive lines and LED modules. The LED module includes LED lighting beads electrically connected with the conductive lines and arranged orderly on the conductive lines to form a strip. One of the conductive lines is a communication conductive line, and the remaining three are power-supplying conductive lines. On the communication conductive line, the LED lighting beads are connected in series. On the power-supplying conductive lines, the LED modules are connected in parallel, and the LED lighting beads of each LED module are connected in series. The LED lighting strip adopts an arrangement of serial-parallel connection for power and serial connection for signal to achieve various application solutions for different power supply voltages, and as a consequence, a serial communication protocol is adopted to control each of the LED lighting beads of the LED lighting strip, in order to realize diversification of lighting effect.

Abstract: Provided are an LED package device and a preparation method thereof, and a display device. The package device includes a transparent substrate, a black layer, a transparent bonding layer, multiple LED chips, and a mold protective layer. The multiple LED chips are fixed to the transparent substrate based on the transparent bonding layer. The black layer is configured to cover the transparent bonding layer. The black layer is provided with multiple matching holes. The multiple LED chips are matched in the multiple matching holes in a one-to-one correspondence. The cover area of the transparent bonding layer is S1. The area of the top surface of the transparent substrate is S2. The constraint relationship between S1 and S2 is S1<S2. The mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the multiple LED chips on the transparent substrate.

Abstract: A light source module provided includes a heat sink, a circuit board, a lamp shade, and a fixing member. The circuit board is provided with one side tightly attached to the heat sink, and the other side is provided with a plurality of light sources. The lamp shade is provided with a plurality of optical lenses, the plurality of the optical lenses are respectively formed by a plurality of recesses forming on a front surface of the lamp shade, and a plurality of arc protrusions corresponding to the plurality of the recess forming on a back surface of the lamp shade. The fixing member is configured to fix the lamp shade on the heat sink to receive the circuit board in a space defined by the lamp shade and heat sink. Further, a lighting apparatus is also provided.

Abstract: A flip-chip light emitting diode includes a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface; a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate; and a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer.

Abstract: The present disclosure discloses near-to-eye display equipment and an imaging method thereof. The near-to-eye display equipment includes a group of image display screen unit used for displaying an image, a group of optical lens assembly device used for correcting various optical aberrations of optical imaging, a group of optical prism assembly device used for achieving optical distance prolonging and light path transition, a group of prism splitter device used for image beam splitting and light path transition, and a group of optical reflection device used for optical image reflection and light field compression. The entire near-to-eye display equipment of the present disclosure has a simple optical structure and easily achieves an ultra large visual-field display system. Furthermore, the structure is approximate to a coaxial design, so that the optical performance is good, and a long distance of exit pupil is more suitable for observation with human eyes.

Abstract: The present application relates to a substrate, an LED light source assembly and manufacturing methods therefor. The substrate includes a first substrate and a second substrate which are arranged in a stacked manner. Electrode soldering regions on the front side of the first substrate and corresponding first conductive regions on the back side of the first substrate are electrically connected; and second conductive regions on the front side of the second substrate and corresponding third conductive regions on the back side of the second substrate are electrically connected, where the corresponding first conductive regions and the corresponding second conductive regions are electrically connected.

Abstract: A single light emitting diode (LED) structure includes an array of spaced discrete light emitting zones separated by isolation areas. Each emitting zone includes an epitaxial structure configured to emit an emitting light having a particular wavelength over an effective emission area. In addition, the effective emission area for each emitting zone can be geometrically defined and electrically configured to provide a desired light intensity. For example, each effective emission area can have a selected size and spacing depending on the application and light intensity requirements. Each emitting zone also includes a wavelength conversion member on its effective emission area configured to convert an emitting wavelength of the emitting light to a different color. The single (LED) structure can include multiple colors at different zones to produce a desired spectra or design.

Abstract: A semiconductor light emitting device includes a multi-quantum-well structure, a first capping layer, a second capping layer, and an electron barrier layer stacked in order. The multi-quantum-well structure includes a plurality of alternately-stacked potential barrier layers and potential well layers. The first capping layer is a semiconductor layer, and the second capping layer is a p-doped semiconductor layer. Each of the first and second capping layers has an aluminum mole fraction larger than that of each of the potential barrier layers, and the aluminum mole fraction of the first capping layer is larger than that of at least a portion of the electron barrier layer. A method for preparing the semiconductor light emitting device is also provided.

Abstract: A lighting structure includes a surface cover plate, a lighting module, a light adjustment layer, an optical adhesive layer and an electronic paper display module. The surface cover plate has a visible area and a black bezel. The lighting module has a light guide plate and point light sources. The light adjustment layer has an optical thinning region and a frame-shaped adhesive. The optical thinning region is less than the light guide plate in refractive index. The surface cover plate and the lighting module are adhered by the frame-shaped adhesive. The optical thinning region is disposed on an upper surface of the light guide plate. The optical adhesive layer has a refractive index equal to or greater than a refractive index of the light guide plate. The electronic paper display module is disposed under the lighting module.

Abstract: A rear lamp with an alarm function for a vehicle includes a light source; a reflector reflecting a light emitted from the light source to a mask; a lamp housing accommodating the light source and the reflector therein; and a mask coupled to the lamp housing and transmitting the light reflected by the reflector to an outside of the rear lamp apparatus therethrough, and the mask includes a first optical device capable of forming a pattern on a road, thereby implementing an alarm function.

Abstract: A backlight and a display device are provided herein, which is related to the field of display technology and intends to improve visual effect of the image displayed by the display device. The backlight may include a back plate, a light guide plate and a light source. The back plate includes an accommodation groove, and the light guide plate includes a holding groove at a first side surface of the light guide plate. The light source includes at least one light emitting element. The holding groove is configured to hold at least a portion of the at least one light emitting element, and the accommodation groove is configured to accommodate the light guide plate and the light source.

Abstract: The application discloses a ceiling grid multi-functional LED linear lamp, comprising: a main profile; an LED light bar, which is fixedly arranged on the inner bottom of the main profile; wherein both ends of the main profile are fixedly installed with mounting brackets, wherein the mounting bracket comprises a riveting bracket, a connecting piece and a movable bracket, the connecting piece is fixedly connected on one side of the bottom end of the riveting bracket, and the movable bracket is fixed on the back of the riveting bracket.

Abstract: A display panel, a method for detecting a display panel and an electronic device are provided. a display panel are provided, including a display area and a peripheral region surrounding the display area; a plurality of bonding pads in the peripheral region; a lighting pad in the peripheral region; a plurality of source signal lines at least in the display region; a plurality of source signal line leads in the peripheral region and electrically connected to the plurality of source signal lines and electrically connected to the plurality of bonding pads; a plurality of sub-pixel columns in the display region and electrically connected to the plurality of source signal lines; and a detection circuit, arranged in the peripheral region and between the plurality of binding pads and the display area.

Abstract: An infrared reflection device includes a power supply assembly, a plurality of switches, and two relatively disposed light-transmitting conductive substrates packaging a regulating area. Each of the light-transmitting conductive substrates comprise a light-transmitting substrate and an electrode layer. The regulating area is filled with a liquid crystal mixture; the electrode layers are arranged on opposite surfaces of the two light-transmitting substrates; the electrode layer of at least one of the light-transmitting conductive substrates comprises at least two mutually independent electrode areas; and electrode areas of the same light-transmitting conductive substrate, after being respectively connected in series to the switches, are jointly connected in parallel to the same electrode of the power supply assembly.