Abstract: The following specification discloses a parts handling and storage system that can be directed toward the handling and storage of electronic components. The storage portion comprises a movable cabinet on wheels having a plurality of elongated tubular members or channels that receive components or parts along the length thereof. The tubular members or channels are driven on a linked basis parallel to each other by a gear movement and chain drive. In this manner, the channels themselves in their linked relationship form a chain of axially elongated links. Each respective channel or tubular member can be indexed at a given point for exposing the parts therein, so that they can be moved therealong into an adjacent track or channel or other handling means. The storage cabinet and tubular channel members when combined with an extended track can be associated at the end of the track with a second storage cabinet for receiving the parts after they have been processed from the first storage cabinet.

Abstract: The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a "tailless" wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.