Patents Assigned to Orthodyne Electronics
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Patent number: 9931709Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.Type: GrantFiled: January 18, 2017Date of Patent: April 3, 2018Assignee: Orthodyne Electronics CorporationInventor: Dominick A. DeAngelis
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Patent number: 9929122Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.Type: GrantFiled: May 6, 2015Date of Patent: March 27, 2018Assignee: Orthodyne Electronics CorporationInventors: Mark A. Delsman, Theodore J. Copperthite, Garrett W. Jones, Todd J. Walker, Tick-Kwang Loh, Jay C. McCandless
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Patent number: 9925624Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.Type: GrantFiled: June 16, 2016Date of Patent: March 27, 2018Assignee: Orthodyne Electronics CorporationInventors: Jonathan Michael Byars, Garrett Leigh Wong
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Patent number: 9527189Abstract: A system for processing a solar substrate is provided. The system includes a support structure for supporting a solar substrate. The system also includes a brushing system for selectively removing an interaction layer from an electrode region of the solar substrate.Type: GrantFiled: September 26, 2014Date of Patent: December 27, 2016Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Erich C. Mueller, Orlando L. Valentin, Tao Xu
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Patent number: 9393641Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.Type: GrantFiled: December 21, 2011Date of Patent: July 19, 2016Assignee: Orthodyne Electronics CorporationInventors: Jonathan Michael Byars, Garrett Leigh Wong
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Publication number: 20150235983Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.Type: ApplicationFiled: May 6, 2015Publication date: August 20, 2015Applicant: Orthodyne Electronics CorporationInventors: Mark A. Delsman, Theodore J. Copperthite, Garrett W. Jones, Todd J. Walker, Tick-Kwang Loh, Jay C. McCandless
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Publication number: 20150144682Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.Type: ApplicationFiled: January 28, 2015Publication date: May 28, 2015Applicant: Orthodyne Electronics CorporationInventor: Jonathan Michael Byars
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Patent number: 9038998Abstract: A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.Type: GrantFiled: November 16, 2010Date of Patent: May 26, 2015Assignee: Orthodyne Electronics CorporationInventor: Jonathan Michael Byars
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Patent number: 8998063Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.Type: GrantFiled: January 22, 2013Date of Patent: April 7, 2015Assignee: Orthodyne Electronics CorporationInventor: Jonathan Michael Byars
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Publication number: 20150017878Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: ApplicationFiled: September 26, 2014Publication date: January 15, 2015Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Erich C. Mueller, Orlando L. Valentin, Tao Xu
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Patent number: 8926760Abstract: A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer.Type: GrantFiled: February 19, 2010Date of Patent: January 6, 2015Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Erich Christoph Mueller, Orlando Luis Valentin, Tao Xu
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Patent number: 8820609Abstract: A wire bonding tool including a body portion terminating in a tip portion is provided. The tip portion includes opposing walls defining a groove, each of the opposing walls having a curved profile.Type: GrantFiled: September 13, 2012Date of Patent: September 2, 2014Assignee: Orthodyne Electronics CorporationInventor: Todd J. Walker
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Patent number: 8746537Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.Type: GrantFiled: October 22, 2013Date of Patent: June 10, 2014Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8720767Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.Type: GrantFiled: November 19, 2009Date of Patent: May 13, 2014Assignee: Orthodyne Electronics CorporationInventors: Jonathan Byars, Theodore J. Copperthite
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Publication number: 20140103095Abstract: A wire bonding tool including a body portion terminating in a tip portion is provided. The tip portion includes opposing walls defining a groove, each of the opposing walls having a curved profile.Type: ApplicationFiled: September 13, 2012Publication date: April 17, 2014Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventor: Todd J. Walker
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Patent number: 8685789Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.Type: GrantFiled: May 7, 2010Date of Patent: April 1, 2014Assignee: Orthodyne Electronics CorporationInventor: Christoph B. Luechinger
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Patent number: 8685791Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.Type: GrantFiled: January 25, 2013Date of Patent: April 1, 2014Assignee: Orthodyne Electronics CorporationInventor: Christoph B. Luechinger
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Publication number: 20140048584Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.Type: ApplicationFiled: October 22, 2013Publication date: February 20, 2014Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8651360Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.Type: GrantFiled: January 12, 2012Date of Patent: February 18, 2014Assignee: Orthodyne Electronics CorporationInventor: Vahid Safavi Ardebili
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Patent number: 8651354Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: GrantFiled: July 18, 2011Date of Patent: February 18, 2014Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin