Patents Assigned to Orthodyne Electronics
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Publication number: 20130306708Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: ApplicationFiled: July 22, 2013Publication date: November 21, 2013Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8584922Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: GrantFiled: July 22, 2013Date of Patent: November 19, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130299559Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Applicant: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130292456Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.Type: ApplicationFiled: January 12, 2012Publication date: November 7, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventor: Vahid Safavi Ardebili
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Patent number: 8573468Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: GrantFiled: July 15, 2013Date of Patent: November 5, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Patent number: 8544717Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: GrantFiled: April 29, 2011Date of Patent: October 1, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130228611Abstract: A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.Type: ApplicationFiled: December 21, 2011Publication date: September 5, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Jonathan Michael Byars, Garrett Leigh Wong
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Patent number: 8511536Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: GrantFiled: March 30, 2011Date of Patent: August 20, 2013Assignee: Orthodyne Electronics CorporationInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130200134Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.Type: ApplicationFiled: January 22, 2013Publication date: August 8, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventor: ORTHODYNE ELECTRONICS CORPORATION
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Publication number: 20130140346Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.Type: ApplicationFiled: March 30, 2011Publication date: June 6, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130119111Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.Type: ApplicationFiled: January 10, 2013Publication date: May 16, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventor: ORTHODYNE ELECTRONICS CORPORATION
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Publication number: 20130112735Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: ApplicationFiled: July 18, 2011Publication date: May 9, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20130042960Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.Type: ApplicationFiled: April 29, 2011Publication date: February 21, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin, Tao Xu
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Publication number: 20130019458Abstract: A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.Type: ApplicationFiled: April 12, 2011Publication date: January 24, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Jonathan M. Byars, Theodore J. Copperthite, H. Henry Von Tresckow
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Patent number: 8308050Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: July 2, 2012Date of Patent: November 13, 2012Assignee: Orthodyne Electronics CorporaitionInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120274014Abstract: A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.Type: ApplicationFiled: November 16, 2010Publication date: November 1, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventor: Jonathan Michael Byars
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Publication number: 20120273554Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: ApplicationFiled: July 2, 2012Publication date: November 1, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin
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Patent number: 8251274Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: April 19, 2012Date of Patent: August 28, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Publication number: 20120205028Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: ApplicationFiled: April 19, 2012Publication date: August 16, 2012Applicant: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8231044Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: October 3, 2011Date of Patent: July 31, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin