Abstract: An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2?×2? or 4?×4? waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments, the adapter frame has molded individual cavities to hold single die carriers. The adapter frame has the same exterior dimensions as a conventional wafer frame. This allows the adapter frame to be handled at the die sorter output in the same or similar manner as output wafer frames, thereby eliminating the need to change handlers when switching the output from a wafer frame to a specific die carrier.

Abstract: A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or torquing the rollers and tensioning the wire placed between the rollers. A linkage generally aligns the rollers in parallel with the wire therebetween. A photoelectric sensor determines a given amount of wire at a position between the bond head and the rollers and provides a signal for controlling the stepper motor driving the reel of wire.

Abstract: An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bonding tool in the Z axis. A pair of arms form a wire clamp supported on the flexible support and are articulated by a link connected for moving one of the arms with respect to the other by an electrical drive having a coil. A wire cutter is connected to the bonding head and a pusher pushes the wire cutter toward the bonding tool before wire is to be cut after bonding.

Abstract: An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling apparatus moves the wire that has been bonded with a pre-established force to determine whether the bond will withstand the force. The accompanying method for testing a bond includes holding the wire after the bond has been made with the same holder and pulling the wire with a pre-established force substantially along the direction of the wire's longitudinal axis to determine the strength of the bond.

Abstract: A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one stepper motor. A processing unit is mounted on the bonding head for controlling the clamping, feeding, and breaking of the wire.

Abstract: An improved ultrasonic wire bonding method and apparatus is disclosed having a wire delivery conduit for removing coil set in the wire through a serpentine movement prior to being bonded, which also provides sufficient drag to prevent displacement as the bonder with the wire is being moved from one location to another, and which orients the wire to said bonding tool end. An improved wire cutter moves independently of the wire bonding tool and is directly connected to the main Z positioning movement of said wire bonder so that the wire bonding tool and the cutter can move independently during the process. The wire bonding tool can be biased by a magnetic bias with an armature connected to the wire bonding tool. The wire bonding apparatus and the method provide a loop in the wire between first and second bonds by forming an arcuate bend in the wire as it moves away from the first point of bonding.

Abstract: The specification sets forth an ultrasonic wire bonding system for bonding wire to an underlying electronic circuit or terminal. The system incorporates a bonding tool connected to a transducer which causes the bonding tool to ultrasonically vibrate and when impressed against a wire lying thereunder, bond said wire to an underlying electronic circuit. The transducer is driven by a generator which generates either a constant current or constant voltage to the transducer while it is bonding. The constant current mode accommodates thick films and stitch bonding which require substantially more force, while the constant voltage mode provides for thin films and ball bonding which requires substantially less ultrasonic force.

Abstract: The following specification discloses a touchdown sensor for ultrasonic wire bonding devices. Such ultrasonic wire bonding devices are used for purposes of bonding wires to integrated circuits, package terminations, hybrids, and discrete semiconductor devices. The devices entail the utilization of a transducer that operates in a series resonant mode. The means of exciting the resonant mode is through an electrical signal imparted thereto, so that a tool attached to the transducer can then impart an ultrasonic bond to a wire with which it is placed in contact. The tool attached to the transducer is lowered by the device to a discrete location. The point of contact is monitored by sensing an increased impedance by contact of the tool and dampening of the transducer's resonant mode. This increased impedance is read by means of producing a voltage proportional to transducer current and determining when it has decreased below a previously set reference voltage.

Abstract: The following specification discloses a parts handling and storage system that can be directed toward the handling and storage of electronic components. The storage portion comprises a movable cabinet on wheels having a plurality of elongated tubular members or channels that receive components or parts along the length thereof. The tubular members or channels are driven on a linked basis parallel to each other by a gear movement and chain drive. In this manner, the channels themselves in their linked relationship form a chain of axially elongated links. Each respective channel or tubular member can be indexed at a given point for exposing the parts therein, so that they can be moved therealong into an adjacent track or channel or other handling means. The storage cabinet and tubular channel members when combined with an extended track can be associated at the end of the track with a second storage cabinet for receiving the parts after they have been processed from the first storage cabinet.

Abstract: The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a "tailless" wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.